LECC TECHNOLOGY CO., LTD. Patent applications |
Patent application number | Title | Published |
20150318663 | SENSING MODULE AND LASER DEVICE - Disclosure is related to a sensing module and a Laser device using the sensing module. The sensing module is adapted to a Laser module. The sensing module essentially includes a beam splitter and a photo sensor. This beam splitter is disposed at an optical-axis path of laser beam. The splitter is used to split the laser beam into a transmissive beam and a reflective beam. The photo sensor however is disposed apart from the optical-axis path of the original laser beam. The photo sensor converts the sensed photo signals into electrical signals which are as feedback signals to the laser module. | 11-05-2015 |
20120177078 | SURFACE-EMITTING LASER DIODE MODULE HAVING IMPROVED FOCUSING PERFORMANCE - A surface-emitting laser diode module having improved focusing performance includes a main body, a first support member, a second support member, a laser diode chip, and a focusing lens. The first and the second support members are disposed on the main body. One end of the first and the second support members is exposed in a trough formed on the main body. The other ends of the first and the second support members protrude from the main body and form a respective soldering portion. The laser diode chip is disposed on the first support member exposed in the trough and connected electrically to the second support member. The focusing lens is arranged at the light exit aligning the laser diode chip. The thinner and lighter laser diode module can provide better focus for dot or line laser applications. | 07-12-2012 |
20110259167 | LASER ASSISTED POSITIONING MECHANISM - A laser assisted positioning mechanism includes a cover, a laser module, a lens, an adjusting device and a plurality of cell holders. The cover includes a lower cover and an upper cover, and the lower cover has a hollowing supporting rib formed in a center thereof. The laser module is disposed in the cover. The lens is disposed on the lower cover of the cover in conjunction with the laser module. The adjusting device is connected with the laser module and exposed outside the upper cover. The cell holders are disposed in the cover, respectively receiving cells, and electrically connected with the laser module. Accordingly, the laser assisted positioning mechanism can be assembled and mounted on a circular saw machine and emit laser to cut materials by aligning with a desired cut line for assisting the cutting operation. | 10-27-2011 |