LANNER ELECTRONIC INC.
LANNER ELECTRONIC INC. Patent applications | ||
Patent application number | Title | Published |
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20110157815 | SERVER STRUCTURE WITH A REPLACEABLE HEAT-DISSIPATING MODULE - A server structure with a replaceable heat-dissipating module comprises at least one heat-dissipating module receiving slot and at least one heat-dissipating module. The heat-dissipating module receiving slot is provided in a case and has two lateral walls each provided with a sliding groove. The heat-dissipating module further comprises a heat-dissipating element and two side boards. The two side boards are located at two sides of the heat-dissipating element for engaging with the sliding grooves, respectively, so that the heat-dissipating module receiving slot replaceably receives the heat-dissipating module therein. | 06-30-2011 |
20110157810 | SERVER WITH A REPLACEABLE MODULE - A server with a replaceable module includes a housing, at least one carrying mechanism and at least two urging units. The carrying mechanism further has a carrying seat, a first cover plate, at least two retaining plates and at least two fastening members. Each of the two urging units has a second notch and an exerting portion. Therein, when a user exerts a force on the exerting portions, the fastening members are ejected out form the housing, and the carrying mechanism is ejected out of the housing simultaneously. | 06-30-2011 |