LANNER ELECTRONIC INC.
|LANNER ELECTRONIC INC. Patent applications|
|Patent application number||Title||Published|
|20110157815||SERVER STRUCTURE WITH A REPLACEABLE HEAT-DISSIPATING MODULE - A server structure with a replaceable heat-dissipating module comprises at least one heat-dissipating module receiving slot and at least one heat-dissipating module. The heat-dissipating module receiving slot is provided in a case and has two lateral walls each provided with a sliding groove. The heat-dissipating module further comprises a heat-dissipating element and two side boards. The two side boards are located at two sides of the heat-dissipating element for engaging with the sliding grooves, respectively, so that the heat-dissipating module receiving slot replaceably receives the heat-dissipating module therein.||06-30-2011|
|20110157810||SERVER WITH A REPLACEABLE MODULE - A server with a replaceable module includes a housing, at least one carrying mechanism and at least two urging units. The carrying mechanism further has a carrying seat, a first cover plate, at least two retaining plates and at least two fastening members. Each of the two urging units has a second notch and an exerting portion. Therein, when a user exerts a force on the exerting portions, the fastening members are ejected out form the housing, and the carrying mechanism is ejected out of the housing simultaneously.||06-30-2011|