LAN TECHNICAL SERVICE CO., LTD. Patent applications |
Patent application number | Title | Published |
20150104656 | METHOD FOR BONDING POLYMER FILM AND POLYMER FILM, METHOD FOR BONDING POLYMER FILM AND INORGANIC MATERIAL SUBSTRATE, POLYMER FILM LAMINATE, AND LAMINATE OF POLYMER FILM AND INORGANIC MATERIAL SUBSTRATE - The present invention provides a method for firmly and inexpensively bonding at low temperature a polymer film to another polymer film or to a glass substrate without the use of an organic adhesive. A method for bonding a polymer film includes a step (S | 04-16-2015 |
20140048805 | BONDING-SUBSTRATE FABRICATION METHOD, BONDING SUBSTRATE, SUBSTRATE BONDING METHOD, BONDING-SUBSTRATE FABRICATION APPARATUS, AND SUBSTRATE ASSEMBLY - [Problem] To provide a substrate bonding technique having a wide range of application. [Solution] A silicon thin film is formed on a bonding surface, and the interface with the substrate is surface-treated using energetic particles/metal particles. | 02-20-2014 |
20140037945 | BONDING-SUBSTRATE FABRICATION METHOD, BONDING SUBSTRATE, SUBSTRATE BONDING METHOD, BONDING-SUBSTRATE FABRICATION APPARATUS, AND SUBSTRATE ASSEMBLY - [Problem] To provide a substrate bonding technique having a wide range of application. [Solution] A silicon thin film is formed on a bonding surface, and the interface with the substrate is surface-treated using energetic particles/metal particles. | 02-06-2014 |