LAM RESEARCH AG Patent applications |
Patent application number | Title | Published |
20160118274 | CONVECTIVE WAFER HEATING BY IMPINGEMENT WITH HOT GAS - An apparatus for processing wafer-shaped articles comprises a rotary chuck adapted to hold a wafer shaped article of a predetermined diameter in a predetermined orientation. The chuck includes a heater comprising a plurality of gas nozzles directed toward a surface of a wafer shaped article when held by the chuck. The heater comprises a gas inlet and at least one heating element for heating gas to be discharged through the plurality of gas nozzles. The heater is configured to heat a wafer shaped article principally by convective heat transfer from heated gas discharged through the plurality of gas nozzles. | 04-28-2016 |
20150380370 | METHOD FOR ETCHING SEMICONDUCTOR STRUCTURES AND ETCHING COMPOSITION FOR USE IN SUCH A METHOD - A method of etching a semiconductor structure, comprises contacting an under bump metallization (UBM) with an etching composition. The UBM includes an underlying layer comprising titanium and an overlying layer comprising a second metal. The etching composition is a liquid comprising at least 0.1 wt % hydrofluoric acid and at least 0.1 wt % phosphoric acid. | 12-31-2015 |
20150243543 | APPARATUS FOR LIQUID TREATMENT OF WAFER SHAPED ARTICLES - An apparatus for processing wafer-shaped articles comprises a spin chuck adapted to hold and spin a wafer-shaped article of a predetermined diameter during a processing operation. A liquid collector surrounds the spin chuck, and comprises a first inner surface. The first inner surface comprises a first conductive material. The collector further comprises a first conductive pathway for grounding the first conductive material. | 08-27-2015 |
20150243533 | DEVICE AND METHOD FOR REMOVING LIQUID FROM A SURFACE OF A DISC-LIKE ARTICLE - A device for removing liquid from a surface of a disc-like article comprises a spin chuck for holding and rotating a single disc-like article about an axis of rotation and a liquid dispenser for dispensing liquid onto the disc-like article. A first gas dispenser comprises at least one nozzle with at least one orifice for blowing gas onto the disc-like article, and a second gas dispenser comprises at least one nozzle with at least one orifice for blowing gas onto the disc-like article. A rotary arm moves the liquid dispenser and the second gas dispenser across the disc-like article so that the second gas dispenser and the liquid dispenser move to a point in a peripheral region of the spin chuck. The at least one nozzle of the second gas dispenser is elongated along a first horizontal line that defines an angle α of 5-20° relative to a second horizontal line connecting the center of the second gas dispenser and the rotation axis of the rotary arm. | 08-27-2015 |
20150235876 | METHOD AND APPARATUS FOR PROCESSING WAFER-SHAPED ARTICLES - A method and device for processing wafer-shaped articles includes a spin chuck for holding and rotating a wafer-shaped article about a rotation axis, and at least one dispenser for dispensing a fluid onto at least one surface of a wafer-shaped article. A collector surrounds the spin chuck for collecting process fluids, with at least two collector levels for separately collecting fluids in different collector levels. Each collector level comprises an exhaust gas collecting chamber leading to a respective exhaust gas conduit. At least one of the exhaust gas conduits comprises a valve mechanism that reciprocally restricts exhaust gas flow from its associated exhaust gas conduit while opening the exhaust gas conduit to an ambient environment outside the collector, and vice-versa. | 08-20-2015 |
20150202555 | METHOD AND APPARATUS FOR CONDITIONING PROCESS LIQUIDS - An apparatus for conditioning a process liquid comprises a tank incorporating a heat transfer device for heating or cooling a process liquid in the tank. A filtration unit is mounted within the tank for filtering the process liquid in the tank. A pump is mounted adjacent the tank and in fluid communication with process liquid in the tank. The pump causes process liquid to circulate between the filtration unit and the heat transfer device. | 07-23-2015 |
20150200123 | METHOD AND APPARATUS FOR LIQUID TREATMENT OF WAFER SHAPED ARTICLES - An apparatus for treating a wafer-shaped article, comprises a spin chuck for holding a wafer-shaped article in a predetermined orientation, at least one upper nozzle for dispensing a treatment fluid onto an upwardly facing surface of a wafer-shaped article when positioned on the spin chuck, and at least one lower nozzle arm comprising a series of lower nozzles extending from a central region of the spin chuck to a peripheral region of the spin chuck. The series of nozzles comprises a smaller nozzle in a central region of the spin chuck and a larger nozzle in a peripheral region of the spin chuck. In the method according to the invention, a heated liquid is supplied through the series of nozzles so as to supply more heat to peripheral regions of a wafer than to central regions. | 07-16-2015 |
20150187629 | APPARATUS FOR TREATING SURFACES OF WAFER-SHAPED ARTICLES - An apparatus for processing wafer-shaped articles comprises a closed process chamber providing a gas-tight enclosure. A rotary chuck is located within the closed process chamber, and is adapted to hold a wafer shaped article thereon. A lid is secured to an upper part of the closed process chamber. The lid comprises an annular chamber, gas inlets communicating with the annular chamber and opening on a surface of the lid facing outwardly of the closed process chamber, and gas outlets communicating with the annular chamber and opening on a surface of the lid facing inwardly of the closed process chamber. | 07-02-2015 |
20150187624 | APPARATUS FOR TREATING SURFACES OF WAFER-SHAPED ARTICLES - An apparatus for processing wafer-shaped articles comprises a closed process chamber providing a gas-tight enclosure. A rotary chuck is located within the closed process chamber, the rotary chuck being adapted to hold a wafer shaped article thereon. A lid is secured to an upper part of the closed process chamber, the lid comprising an upper plate formed from a composite fiber-reinforced material and a lower plate that faces into the process chamber and is formed from a chemically-resistant plastic. | 07-02-2015 |
20150187612 | APPARATUS FOR TREATING SURFACES OF WAFER-SHAPED ARTICLES - An apparatus for processing wafer-shaped articles, comprises a closed process chamber providing a gas-tight enclosure. A rotary chuck is located within the closed process chamber, and is adapted to hold a wafer shaped article thereon. A lid is secured to an upper part of the closed process chamber, and comprises a lower surface facing inwardly of the chamber. At least one heating element heats the lower surface of the lid to a desired temperature, so as to prevent condensation of process vapour on the inwardly facing surface of the lid. | 07-02-2015 |
20150187561 | METHOD AND APPARATUS FOR LIQUID TREATMENT OF WAFER SHAPED ARTICLES - In an apparatus and method for treating a wafer-shaped article, a spin chuck is provided for holding and rotating a wafer-shaped article. A first liquid dispenser communicates with a supply of an organic liquid and is positioned so as to dispense the organic liquid onto a surface of a wafer-shaped article. A degasifying unit is positioned upstream of the first liquid dispenser and downstream of the supply. The degasifying unit is configured to reduce a dissolved gas content of the organic liquid to less than 20% of a saturation concentration at a pressure of 1 bar. | 07-02-2015 |
20140349489 | METHOD AND APPARATUS FOR LIQUID TREATMENT OF WAFER-SHAPED ARTICLES - An apparatus for treating a wafer-shaped article, comprises a spin chuck for holding a wafer-shaped article in a predetermined orientation, a liquid dispenser for dispensing a treatment liquid onto a downwardly facing surface of a wafer-shaped article when positioned on the spin chuck, and a gas dispenser for dispensing a gas within a gap defined between the downwardly-facing surface of the wafer-shaped article and an upper surface of the spin chuck. | 11-27-2014 |
20140339215 | APPARATUS FOR LIQUID TREATMENT OF WAFER SHAPED ARTICLES AND HEATING SYSTEM FOR USE IN SUCH APPARATUS - An apparatus for treating a disc-shaped article comprises a spin chuck and at least three individually controllable infrared heating elements. The infrared heating elements are mounted in a stationary manner with respect to rotation of said spin chuck. At least the transparent plate positioned between the infrared heating elements and the underside of a wafer is mounted for rotation with the spin chuck. Alternatively, the transparent plate is part of a housing that encloses the infrared heating elements and that rotates with the spin chuck as the heating elements are stationary relative thereto. | 11-20-2014 |
20140283994 | APPARATUS FOR TREATING SURFACES OF WAFER-SHAPED ARTICLES - An apparatus for liquid treatment of substrates, comprises a substrate holder and a liquid collector surrounding the substrate holder. The liquid collector comprises a trough for collecting liquid that has been used to treat a substrate. The trough is in fluid communication with a discharge conduit, and the liquid collector further comprising a recessed surface extending from a discharge opening in the trough to an inlet opening of the discharge conduit that is positioned lower than the trough. The discharge opening in the trough has a cross-sectional area that is at least twice as large in cross sectional area than the inlet opening of the discharge conduit. | 09-25-2014 |
20140283935 | COLLECTOR FOR USE WITH AN APPARATUS FOR TREATING WAFER-SHAPED ARTICLES - A collector assembly for use with a spin chuck includes a base component, a top component and a first intermediate component configured to be fitted between the base component and the top component. The base, top and first intermediate components are configured so as to be interconnectable to form a process enclosure and so as to be separable from one another. The base component and the intermediate component each comprise collector wall segments such that when the base, top and first intermediate components are interfitted, the wall segments together define an outer side wall of the collector assembly. | 09-25-2014 |
20140182636 | METHOD AND APPARATUS FOR PROCESSING WAFER-SHAPED ARTICLES - The wet treatment of wafer-shaped articles is improved by utilizing a droplet generator designed to produce a spray of monodisperse droplets. The droplet generator is mounted above a spin chuck, and is moved across a major surface of the wafer-shaped article in a linear or arcuate path. The droplet generator includes a transducer acoustically coupled to its body such that sonic energy reaches a region of the body surrounding the discharge orifices. Each orifice has a width w of at least 1 μm and at most 200 μm and a height h such that a ratio of h to w is not greater than 1. | 07-03-2014 |
20140174657 | APPARATUS FOR LIQUID TREATMENT OF WAFER SHAPED ARTICLES AND LIQUID CONTROL RING FOR USE IN SAME - An apparatus for treating a wafer-shaped article includes a rotary chuck configured to hold a wafer-shaped article of a predetermined diameter such that a surface of the wafer-shaped article facing the rotary chuck is spaced from an upper surface of the rotary chuck. A ring is mounted on the rotary chuck, and includes a first upper surface overlapping an outer peripheral edge of a wafer-shaped article when positioned on the rotary chuck and a second upper surface positioned radially inwardly of the first surface. The second upper surface is elevated relative to the first upper surface, to define an annular gap between the second upper surface and a wafer-shaped article when positioned on the spin chuck that is smaller than a distance between the first upper surface and a wafer-shaped article when positioned on the rotary chuck. | 06-26-2014 |
20140144529 | APPARATUS FOR LIQUID TREATMENT OF WORK PIECES AND FLOW CONTROL SYSTEM FOR USE IN SAME - A flow control system in an apparatus for treating a work piece controls a flow rate of treatment liquid dispensed from a liquid dispenser. The system includes a flow meter that measures a flow rate of liquid being supplied to the liquid dispenser, a controller that receives signals indicative of a flow rate measured by the flow meter, and a pressure regulator that regulates pressure of the liquid supply downstream of the flow meter based on control signals from the controller. At least two alternative liquid supply paths are provided downstream of the pressure regulator and upstream of an outlet of the liquid dispenser. Each supply path is equipped with a respective shutoff valve and provides a respectively different pressure drop to the treatment liquid. | 05-29-2014 |
20140137908 | APPARATUS FOR PROCESSING WAFER-SHAPED ARTICLES - The harmful effects of accumulating droplets of process liquid on the outer surface of a dispense nozzle are prevented by equipping an apparatus for process wafer-shaped articles with a blow-off block that blows the droplets off the nozzle outer surface before they can coalesce and drop in an uncontrolled manner onto the work piece. The nozzle preferably has a polished and tapered outer surface to aid in blowing off any accumulated droplets of process liquid from the outer surface. | 05-22-2014 |
20140102637 | METHOD AND APPARATUS FOR LIQUID TREATMENT OF WAFER SHAPED ARTICLES - In an apparatus and process for treating wafer-shaped articles, a spin chuck holds a wafer-shaped article in a predetermined orientation relative to an upper surface of the spin chuck. A heating assembly comprises a housing containing at least one infrared heating element. The heating assembly is mounted above the upper surface of the spin chuck and adjacent a wafer-shaped article when mounted on the spin chuck. The housing also contains a conduit having an inlet connected to a source of cooling fluid and an outlet returning cooling fluid to the source of cooling fluid. | 04-17-2014 |
20140097580 | APPARATUS FOR LIQUID TREATMENT OF WAFER SHAPED ARTICLES - Apparatus for processing wafer-shaped articles comprises a chuck adapted to hold a wafer-shaped article of a predetermined diameter during a processing operation to be performed on the wafer-shaped article. The chuck comprises a chuck body having an outer surface that faces a wafer-shaped article when positioned on the chuck. The outer surface comprises a first electrically conductive material and the chuck body further comprises a first conductive pathway between the first conductive material and ground. | 04-10-2014 |
20140054280 | METHOD AND APPARATUS FOR LIQUID TREATMENT OF WAFER SHAPED ARTICLES - In an apparatus and process for treating wafer-shaped articles, a spin chuck holds a wafer-shaped article in a predetermined orientation relative to an upper surface of the spin chuck. The apparatus includes a heating assembly having a housing that contains at least one infrared heating element. The heating assembly is mounted above an upper surface of the spin chuck and adjacent a wafer-shaped article when mounted on the spin chuck. The housing comprises a gas inlet connected to a gas supply, and at least one outlet for discharging gas from the housing. | 02-27-2014 |
20140053982 | METHOD AND APPARATUS FOR PROCESSING WAFER-SHAPED ARTICLES - An apparatus and method for processing wafer-shaped articles features a spin chuck that is axially displaceable between at least two exhaust levels within a surrounding collector. A gas supply system comprises ducts for supplying gas separately to a first interior region of the collector that is above the spin chuck and a second interior region that is below the spin chuck. The pressure differential within the collector above and below the spin chuck can thereby be controlled to prevent cross-contamination between collector levels. | 02-27-2014 |
20140041803 | METHOD AND APPARATUS FOR LIQUID TREATMENT OF WAFER SHAPED ARTICLES - In an apparatus and method for treating a wafer-shaped article, a rotary chuck is configured to hold a wafer-shaped article of a predetermined diameter such that a surface of the wafer-shaped article facing the rotary chuck is spaced from an opposing peripheral surface of the rotary chuck. The opposing peripheral surface comprises a first surface overlapping an outer peripheral edge of a wafer-shaped article when positioned on the spin chuck and a second surface positioned radially inwardly of the first surface and meeting the first surface at an interface that is radially inward of and substantially concentric with a wafer-shaped article when positioned on the rotary chuck. The second surface is substantially more hydrophobic than the first surface. | 02-13-2014 |
20140026926 | METHOD AND APPARATUS FOR LIQUID TREATMENT OF WAFER-SHAPED ARTICLES - An apparatus and method for treating a wafer-shaped article utilizes a gas supply hood that can be positioned in a working position above a holder so as to cover all or substantially all of a wafer shaped article when positioned on the holder. The gas supply hood accommodates a fluid dispenser for dispensing at least one fluid onto an upper surface of the wafer shaped article positioned on the holder. The gas supply hood permits the fluid dispenser to be moved laterally of the holder and the gas supply hood while the gas supply hood is in the working position and without moving the gas supply hood. | 01-30-2014 |
20130319472 | METHOD AND APPARATUS FOR PROCESSING WAFER-SHAPED ARTICLES - A device and method for treating the surface of a semiconductor wafer provides a treatment fluid in the form of a dispersion of gas bubbles in a treatment liquid generated at acoustic pressures less than those required to induce cavitation in the treatment liquid. A resonator supplies ultrasonic or megasonic energy to the treatment fluid and is configured to create an interference pattern in the treatment fluid comprising regions of pressure amplitude minima and maxima at an interface of the treatment fluid and the semiconductor wafer. The resonator is mounted in the space between the rotary chuck body and a wafer carried in rotation with the chuck body; however, the resonator itself is stationary in relation to rotation of the wafer and chuck body. | 12-05-2013 |
20130309874 | METHOD AND APPARATUS FOR LIQUID TREATMENT OF WAFER-SHAPED ARTICLES - An apparatus for treating a wafer-shaped article, comprises a spin chuck for holding a wafer-shaped article in a predetermined orientation, a liquid dispenser for dispensing a treatment liquid onto a downwardly facing surface of a wafer-shaped article when positioned on the spin chuck, and a gas dispenser for dispensing a gas within a gap defined between the downwardly-facing surface of the wafer-shaped article and an upper surface of the spin chuck. | 11-21-2013 |
20130309048 | APPARATUS AND METHOD FOR TRANSPORTING WAFER-SHAPED ARTICLES - An apparatus for transporting a wafer-shaped article, comprises a holder configured to hold a wafer-shaped article of a predetermined diameter, attached to a robot arm that is horizontally movable, via a linkage. The holder is vertically movable relative to the distal end of the robot arm via the linkage from a retracted position to an extended position. | 11-21-2013 |
20130284208 | METHOD AND APPARATUS FOR LIQUID TREATMENT OF WAFER-SHAPED ARTICLES - An in-line mixing system provides a process liquid for treatment of wafer-shaped articles. The system comprises a first flow regulator configured to regulate flow of a first liquid stream, a second flow regulator configured to regulate flow of a second liquid stream having a chemical component, a refractive index meter configured to provide a refractive index measurement of a mixture of the first and second liquid streams, a combined flow meter configured to provide a combined flow measurement of the mixture of the first and second liquid streams, and an automatic controller. The automatic controller is configured to operate the first and second flow regulators based upon the refractive index measurement and the combined flow measurement. | 10-31-2013 |
20130260569 | APPARATUS AND METHOD FOR LIQUID TREATMENT OF WAFER-SHAPED ARTICLES - An apparatus and method for liquid treatment of wafer-shaped articles comprises a process unit comprising a chuck for holding a wafer-shaped article in a predetermined orientation, and a liquid recovery system that receives used process liquid recovered from the process unit. The liquid recovery system supplies process liquid to a dispenser in the process unit. A supply of fresh process liquid supplies fresh process liquid to the liquid recovery system and also supplies fresh process liquid to a dispenser in the process unit while bypassing the liquid recovery system. | 10-03-2013 |
20130233356 | PROCESS AND APPARATUS FOR TREATING SURFACES OF WAFER-SHAPED ARTICLES - An apparatus and method for processing wafer-shaped articles comprises an array of nozzles that are stationary in use, and are individually controlled to simulate the action of a moving boom arm without the actual need for such an arm. Preferably three such arrays are provided, for dispensing three different types of liquid at various process stages. The computer control of the nozzle valves may cause only one nozzle of each array to be open at any given time, or may cause a pair of adjacent nozzles to be open simultaneously. | 09-12-2013 |
20130160260 | APPARATUS FOR TREATING SURFACES OF WAFER-SHAPED ARTICLES - A device and method for processing wafer-shaped articles comprises a process chamber and a rotary chuck located within the process chamber. The rotary chuck is adapted to be driven without physical contact through a magnetic bearing. The rotary chuck comprises a series of gripping pins adapted to hold a wafer shaped article in a position depending downwardly from the rotary chuck. The rotary chuck further comprises a plate that rotates together with the rotary chuck. The plate is positioned above an area occupied by the wafer-shaped article, and shields upper surfaces of the process chamber from liquids flung off of a wafer-shaped article during use of the rotary chuck. | 06-27-2013 |
20130154203 | DEVICE FOR TREATING SURFACES OF WAFER-SHAPED ARTICLES AND GRIPPING PIN FOR USE IN THE DEVICE - A device for processing wafer-shaped articles comprises a rotary chuck having a series of pins adapted to hold a wafer shaped article on the rotary chuck. Each of the pins comprises a cylindrical body and a projecting gripping portion formed integrally therewith. The cylindrical body and gripping portion are made from a ceramic material. The gripping portion comprises cylindrical surfaces having a common generatrix with surfaces of the cylindrical body. | 06-20-2013 |
20130134128 | DEVICE AND METHOD FOR TREATING WAFER-SHAPED ARTICLES - A method and device for processing wafer-shaped articles comprises a closed process chamber. A rotary chuck is located within the process chamber, and is adapted to hold a wafer shaped article thereon. An interior fluid distribution ring is positioned above the rotary chuck, and comprises an annular surface inclined downwardly from a radially inner edge to a radially outer edge thereof. At least one fluid distribution nozzle extends into the closed process chamber and is positioned so as to discharge fluid onto the annular surface of the fluid distribution ring. | 05-30-2013 |
20130127102 | METHOD AND DEVICE FOR PROCESSING WAFER SHAPED ARTICLES - A method and device for treating a wafer-shaped article utilizes a novel clamping mechanism, which permits wafer shift to be performed with reduced wear to the chuck pins. A wafer is rotated on a spin chuck that has a plurality of pins positioned at a periphery of the wafer shaped article. The pins each have a head portion which, in a service position, extends radially inwardly of and above the wafer. Gas is supplied onto a surface of the wafer facing the spin chuck at a flow rate sufficient to displace the wafer upwardly into contact with the head portions of the pins. This serves to clamp the wafer against the head portions of the pins. However, the pins contact the wafer only on upwardly oriented wafer surfaces and the wafer is supported from below solely by the gas flow. | 05-23-2013 |
20130125379 | DEVICE AND METHOD FOR PROCESSING WAFER SHAPED ARTICLES - A device for processing wafer-shaped articles, comprises a chuck adapted to receive a wafer shaped article, and a collector surrounding the chuck. The collector comprises a base and a plurality of divider walls, as well as a plurality of nested partitions surrounding the chuck. Each of the plurality of nested partitions is positioned on a corresponding one of the plurality of divider walls, and each of the plurality of nested partitions is vertically movable so as to define a plurality of separate process regions within the collector depending on the vertical position of each of the plurality of nested partitions. At least one of the divider walls comprises an internal exhaust conduit communicating with an exhaust duct underlying the divider wall. | 05-23-2013 |
20130102158 | METHOD, APPARATUS AND COMPOSITION FOR WET ETCHING - A liquid composition for wet etching has improved selectivity for polysilicon over silicon dioxide, even when the polysilicon is heavily doped and/or the silicon dioxide is a low temperature oxide. The composition comprises 0.05-0.4 percent by weight hydrofluoric acid, 15-40 percent by weight nitric acid, 55-85 percent by weight sulfuric acid and 2-20 percent by weight water. A method and apparatus for wet etching using the composition are also disclosed. | 04-25-2013 |
20130101372 | METHOD AND APPARATUS FOR PROCESSING WAFER-SHAPED ARTICLES - A device for processing wafer-shaped articles comprises a closed process chamber. The closed process chamber has a side wall, a holder located within the closed process chamber adapted to receive a wafer shaped article, and a door for loading and unloading a wafer shaped article into and from the closed process chamber. The door in a first position blocks an opening in the side wall of the chamber and seals against an interior surface of the side wall of the chamber. The door is connected to an exterior of the chamber via a linkage that guides the door in a nonlinear translational movement between the first position and a second position in which the door is positioned interiorly of the chamber so as to permit loading and unloading of a wafer shaped article through the opening. | 04-25-2013 |
20130098392 | METHOD AND APPARATUS FOR PROCESSING WAFER-SHAPED ARTICLES - In a method and apparatus for treating a surface of an article, an improved rinse liquid prevents build-up of static charge while avoiding damages to certain types of exposed metal-containing surfaces. In one embodiment, a semiconductor wafer having structures including at least one of cobalt, nickel and platinum is rotated on a spin chuck, as a rinse liquid is dispensed onto a surface of the wafer. The rinse liquid is a dilute aqueous solution of a base of the formula | 04-25-2013 |
20130098391 | METHOD AND APPARATUS FOR PROCESSING WAFER-SHAPED ARTICLES - In a method and apparatus for treating a surface of an article, an improved rinse liquid prevents build-up of static charge while avoiding damages to certain types of exposed metal surfaces. In one embodiment, a semiconductor wafer having structures including at least one of cobalt, nickel and platinum is rotated on a spin chuck, as a rinse liquid is dispensed onto a surface of the wafer. The rinse liquid is a dilute aqueous solution of a base of the formula | 04-25-2013 |
20130062839 | APPARATUS FOR TREATING SURFACES OF WAFER-SHAPED ARTICLES - A device for processing wafer-shaped articles comprises a closed process chamber. The closed process chamber comprises a housing providing a gas-tight enclosure, a rotary chuck located within the closed process chamber and adapted to hold a wafer shaped article thereon, and an interior cover disposed within said closed process chamber. The interior cover is movable between a first position in which the rotary chuck communicates with an outer wall of the closed process chamber, and a second position in which the interior cover seals against an inner surface of the closed process chamber adjacent the rotary chuck to define a gas-tight inner process chamber. | 03-14-2013 |
20130061873 | METHOD AND APPARATUS FOR LIQUID TREATMENT OF WAFER SHAPED ARTICLES - In an apparatus and method for treating a wafer-shaped article, a spin chuck is provided for holding a wafer-shaped article in a predetermined orientation wherein a lower surface of the wafer-shaped article is spaced a predetermined distance from an upper surface of the spin chuck. A heating assembly comprising at least one infrared heater is mounted above the upper surface of the spin chuck and below a wafer-shaped article when mounted on the spin chuck. The heating assembly is stationary in relation to rotation of the spin chuck. | 03-14-2013 |
20130048607 | METHOD AND DEVICE FOR WET TREATMENT OF PLATE-LIKE ARTICLES - A method and device for wet treatment of a plate-like article comprises a spin chuck for holding and rotating the plate-like article. Gas supply nozzles open on a surface of the spin chuck facing a first side of the plate-like article. The spin chuck is configured to direct gas discharged from the gas supply nozzles radially outwardly through a gap defined between an upper surface of the spin chuck and a downwardly facing surface of a plate-like article positioned on the spin chuck. Liquid supply nozzles open on the surface of the spin chuck facing a first side of the plate-like article and positioned radially outwardly of the gas supply nozzles. The liquid supply nozzles are positioned beneath a peripheral region of a plate-like article positioned on the spin chuck. | 02-28-2013 |
20130019893 | ULTRASONIC CLEANING METHOD AND APPARATUS - A device and method for treating the surface of a semiconductor wafer provides a treatment fluid in the form of a dispersion of gas bubbles in a treatment liquid generated at acoustic pressures less than those required to induce cavitation in the treatment liquid. A resonator supplies ultrasonic or megasonic energy to the treatment fluid and is configured to create an interference pattern in the treatment fluid comprising regions of pressure amplitude minima and maxima at an interface of the treatment fluid and the semiconductor wafer. | 01-24-2013 |
20130008602 | APPARATUS FOR TREATING A WAFER-SHAPED ARTICLE - An apparatus for processing wafer-shaped articles comprises a closed process chamber, a chuck located within the closed process chamber, and at least one process liquid dispensing device disposed within the chamber. The closed process chamber comprises a lid that can be opened to position a wafer-shaped article within the closed process chamber. The lid incorporates a heater adapted to heat a wafer-shaped article positioned in the closed process chamber. | 01-10-2013 |
20120305036 | DEVICE FOR TREATING SURFACES OF WAFER-SHAPED ARTICLES - A device for liquid treatment of a wafer-shaped article comprises a closed process chamber, and a ring chuck located within the closed process chamber. The ring chuck is adapted to be driven without physical contact through a magnetic bearing. A magnetic stator surrounds the closed process chamber. The closed process chamber has a cylindrical wall positioned between the ring chuck and the magnetic stator during liquid treatment of a wafer-shaped article. Various structures are provided to prevent upward ingress of processing liquid into a gap defined between the ring chuck and the cylindrical wall. | 12-06-2012 |
20120298149 | METHOD AND APPARATUS FOR LIQUID TREATMENT OF WAFER SHAPED ARTICLES - An apparatus for treating a wafer-shaped article, comprises a spin chuck for holding a wafer-shaped article in a predetermined orientation, at least one upper nozzle for dispensing a treatment fluid onto an upwardly facing surface of a wafer-shaped article when positioned on the spin chuck, and at least one lower nozzle arm comprising a series of lower nozzles extending from a central region of the spin chuck to a peripheral region of the spin chuck. The series of nozzles comprises a smaller nozzle in a central region of the spin chuck and a larger nozzle in a peripheral region of the spin chuck. In the method according to the invention, a heated liquid is supplied through the series of nozzles so as to supply more heat to peripheral regions of a wafer than to central regions. | 11-29-2012 |
20120286481 | DEVICE AND PROCESS FOR LIQUID TREATMENT OF WAFER SHAPED ARTICLES - A spin chuck and a process of operating the same display improved resistance to backsplash by provision of a media collecting ring mounted on the spin chuck. The media collecting ring surrounds a wafer to be processed and includes a radially-inwardly extending upper portion having an obliquely-angled downwardly-facing surface positioned above an upper surface of a wafer held in the device. The device moreover includes a stationary chamber surrounding the spin chuck equipped with at least two superposed collecting baffles. During treatment, liquid collected by the media collecting ring is preferably discharged radially outwardly through a series of holes formed in the ring, so as to pass between a pair of the superposed collecting baffles of the chamber. | 11-15-2012 |
20120273363 | ULTRASONIC TREATMENT METHOD AND APPARATUS - Improved methods and apparatus for cleaning substrates and enhancing diffusion limited reaction at substrate surfaces use piezoelectric transducers operating in the gigasonic domain. The resonator assemblies include plural transducer stacks each including a thin film piezoelectric element coupled to a resonator plate that faces the substrate. At the disclosed frequencies and powers used, Eckart or Rayleigh streaming can be induced in a liquid treatment medium without substantial generation of cavitation. | 11-01-2012 |
20120167914 | DEVICE AND METHOD FOR WET TREATING DISC-LIKE SUBSTRATES - A method for wet treatment of wafers includes a first plate and a second plate substantially parallel to the first plate, and a wafer is held between the first and the second plate substantially parallel. A first dispenser introduces fluid into a first gap between the first plate and the wafer when being treated, and a second dispenser introduces fluid into a second gap between the second plate and the wafer when being treated. At least one vibrating element is acoustically coupled to at least the second plate, and a holder and the second plate are rotated relative to each other about an axis substantially perpendicular to the second plate. | 07-05-2012 |
20120160276 | PROCESS FOR TREATING A SEMICONDUCTOR WAFER - Mixtures containing concentrated sulfuric acid used for stripping photoresist from semiconductor wafer, such as SOM and SPM mixtures, are more quickly removed from a wafer surface using another liquid also containing high concentration of sulfuric acid, with the second liquid furthermore containing controlled small amounts of fluoride ion. The second liquid renders the wafer surface hydrophobic, which permits easy removal of the sulfuric acid therefrom by spinning and/or rinsing. | 06-28-2012 |
20120138097 | METHOD AND APPARATUS FOR SURFACE TREATMENT USING INORGANIC ACID AND OZONE - Improved removal of ion-implanted photoresist in a single wafer front-end wet processing station is achieved by dissolving gaseous ozone into relatively cool inorganic acid, dispensing the acid ozone mixture onto a wafer, and rapidly heating the surface of the wafer to a temperature at least 30° C. higher than the temperature of the acid ozone mixture. | 06-07-2012 |
20120131815 | METHOD AND APPARATUS FOR WAFER WET PROCESSING - A gas dispenser in a process module for wet processing of wafer-shaped articles is substantially smaller than the article to be processed and is movable laterally of the article as it dispenses inert gas above the article. | 05-31-2012 |
20120108074 | METHOD FOR TREATING A SEMICONDUCTOR WAFER - Disclosed is a method for treating semiconductor wafer including:
| 05-03-2012 |
20120103522 | CLOSED CHAMBER FOR WAFER WET PROCESSING - An improved design for a closed chamber process module for single wafer wet processing utilizes a combination lid and gas showerhead for sealing the chamber from above. One or more media arms dispense liquid onto a wafer in the chamber. The media arms are mounted inside the chamber but are connected by a linkage that passes through the chamber wall to a drive unit mounted outside the chamber. | 05-03-2012 |
20120103371 | METHOD AND APPARATUS FOR DRYING A SEMICONDUCTOR WAFER - A method and apparatus for drying semiconductor wafers uses hot isopropyl alcohol in liquid form at temperatures above 60° C. and below 82° C. The use of hot IPA better avoids pattern collapse and permits reduced consumption of IPA. The wafer temperature can be maintained by applying hot deionized water to the opposite wafer side and by evaporating the hot IPA from the wafer surface using heated nitrogen gas. | 05-03-2012 |
20120100721 | METHOD FOR TREATING A SEMICONDUCTOR WAFER - A method for treating semiconductor wafer includes: providing a stack including a high-k layer including a first oxide material, wherein the first oxide material contains hafnium and/or zirconium, and a cap-layer including a second oxide material, wherein the cap-layer has been deposited on top of the high-k layer, wherein the second oxide material contains lanthanum, a lanthanide and/or aluminium; supplying liquid A to the surface of the semiconductor wafer, liquid A being an aqueous solution containing an oxidizing agent; supplying liquid B to the surface of the semiconductor wafer, liquid B being a liquid with a pH-value lower than 6; and conducting a step SC wherein a liquid C is supplied to the surface of the semiconductor wafer, wherein step SC is carried out after step SB, wherein liquid C is an aqueous acidic solution with a fluorine concentration of at least 10 ppm. | 04-26-2012 |
20120085374 | DEVICE AND METHOD FOR WET TREATING PLATE-LIKE-ARTICLES - A method for wet treatment of plate-like articles includes, a chuck for holding a single plate-like article having an upwardly facing surface for receiving liquid running off a plate-like article when being treated with liquid, wherein the chuck is outwardly bordered by a circumferential annular lip. The chuck has an outer diameter greater than the greatest diameter of the plate-like article to be treated, and a rotatable part with an upwardly facing ring-shaped surface for receiving liquid running off the circumferential lip of the chuck. The rotatable part is rotatable with respect to the chuck, the ring-shaped surface is coaxially arranged with respect to the circumferential annular lip, the inner diameter of the ring-shaped surface is smaller than the outer diameter of the chuck, and the distance d between the lip and the upwardly facing ring-shaped surface is in a range from 0.1 mm to 5 mm. | 04-12-2012 |
20120085372 | METHOD FOR DRYING A SEMICONDUCTOR WAFER - Disclosed is a method for drying a plate-like article; the method including rinsing with an aqueous rinsing liquid with subsequent rinsing with an organic solvent, | 04-12-2012 |
20120073596 | ULTRASONIC CLEANING METHOD AND APPARATUS - A device and method for treating the surface of a semiconductor wafer provides a treatment fluid in the form of a dispersion of gas bubbles in a treatment liquid generated at acoustic pressures less than those required to induce cavitation in the treatment liquid. A resonator supplies ultrasonic or megasonic energy to the treatment fluid and is configured to create an interference pattern in the treatment fluid comprising regions of pressure amplitude minima and maxima at an interface of the treatment fluid and the semiconductor wafer. | 03-29-2012 |
20120018940 | DEVICE FOR HOLDING WAFER SHAPED ARTICLES - A device for holding wafer-shaped articles, such as semiconductor wafers, is equipped with a series of pins that are brought into contact with a peripheral edge of the wafer-shaped article, under control of a common gear ring or a series of conjointly operated gear sectors. In the regions of the gear ring or gear sectors engaging the pin assemblies, those elements are designed to yield more readily than other regions of the gear ring or gear sectors, to accommodate differential thermal expansion of the chuck components in the vicinity of the pin assemblies. | 01-26-2012 |
20110304107 | DEVICE FOR TREATING DISC-LIKE ARTICLES - A device for treating a disc-like article with a fluid, includes elements for dispensing a fluid onto the article and a chuck for holding and rotating the article around an axis perpendicular thereto. The chuck includes a base body, a drive ring, and gripping members for contacting the article at its edge. The gripping members are eccentrically movable with respect to the center of the article. The eccentric movement of the gripping members is driven by a drive ring rotatably mounted to the base body, so that the drive ring is rotatable against the base body around the axis. The relative rotational movement of the drive ring against the base body is carried out by either holding the base body and rotating the drive ring or by holding the drive ring and rotating the base body, whereby the to-be-held-part (drive ring or base body) is held without touching the respective to-be-held-part by magnetic force. | 12-15-2011 |
20110290283 | CLOSED CHAMBER WITH FLUID SEPARATION FEATURE - Selective recovery of excess process fluid from within a closed process chamber is achieved by providing a magnetically drive ring chuck and at least one process fluid collector within the closed process chamber, with the ring chuck and the fluid collector being vertically movable relative to each other. | 12-01-2011 |
20110275221 | METHOD FOR TREATMENT SUBSTRATES AND TREATMENT COMPOSITION FOR SAID METHOD - A mixture of perhalogenic acid and sulfuric acid is unexpectedly stable at high temperatures and is effective in stripping photoresists, including difficult to treat ion-implanted photoresists, with short processing times. In use, no decomposition of the mixture is observed up to a temperature of 145° C. In the mixture, the sulfuric acid is highly purified and has a concentration of 96 wt % or greater. The perhalogenic acid is preferably H | 11-10-2011 |
20110272874 | DEVICE FOR HOLDING WAFER SHAPED ARTICLES - A spin chuck for holding semiconductor wafers includes one or more damping mechanisms to limit the force with which chuck pins impact the wafer edge following wafer shift. The damping mechanism may be a linear or rotary dashpot. The dashpot or dashpots are mounted on a surface of the chuck body and include a control arm that contacts a common gear ring that in turn drives the chuck pins during radially inward and outward movement. | 11-10-2011 |
20110254236 | GROUNDED CHUCK - Improved reduction of static charge in spin chucks is achieved by providing one or more pin assemblies which are formed from chemically inert material and which include an electrically conductive inlay. | 10-20-2011 |
20110253181 | DEVICE FOR TREATING DISC-LIKE ARTICLES - A device for treating a disc-like article with a fluid, includes elements for dispensing a fluid onto the article and a chuck for holding and rotating the article around an axis perpendicular thereto. The chuck includes a base body, a drive ring, and gripping members for contacting the article at its edge. The gripping members are eccentrically movable with respect to the center of the article. The eccentric movement of the gripping members is driven by a drive ring rotatably mounted to the base body, so that the drive ring is rotatable against the base body around the axis. The relative rotational movement of the drive ring against the base body is carried out by either holding the base body and rotating the drive ring or by holding the drive ring and rotating the base body, whereby the to-be-held-part (drive ring or base body) is held without touching the respective to-be-held-part by magnetic force. | 10-20-2011 |
20110250044 | DEVICE FOR TREATING DISC-LIKE ARTICLE AND METHOD FOR OPERATING SAME - A device for supporting and rotating a disc-like article includes:
| 10-13-2011 |
20110155169 | ULTRASONIC CLEANING FLUID, METHOD AND APPARATUS - A cleaning fluid including dispersed gas avoids using ultrasonic energy to induce cavitation by subjecting a liquid containing dissolved gas to a pressure reduction in a bubble machine, to generate a gas/liquid dispersion. The cleaning fluid can be used to clean articles such as semiconductor wafers using a device that includes a holder and a vibrator for supplying ultrasonic or megasonic energy to the article. | 06-30-2011 |
20110151675 | DEVICE AND PROCESS FOR LIQUID TREATMENT OF A WAFER SHAPED ARTICLE - A spin chuck in an apparatus for single wafer wet processing has structures at its periphery that, in combination with a supported wafer, form a series of annular nozzles that direct flowing gas from a chuck-facing surface of the wafer, around the edge of the wafer, and exhaust the gas away from the non-chuck-facing surface of the wafer, thereby preventing treatment fluid applied to the non-chuck-facing surface from contacting the edge region of the wafer. Retaining pins with enlarged heads engage the wafer edge and prevent it from being displaced upwardly when a high flow rate of gas is utilized. | 06-23-2011 |
20110148022 | REINFORCED PIN FOR BEING USED IN A PIN CHUCK, AND A PIN CHUCK USING SUCH REINFORCED PIN - Improved durability and longevity of spin chucks is achieved by using a composite support pin structure in which a pin body of a chemically inert plastic includes a hollow cavity containing an insert formed from a material whose Young's modulus is greater than that of the inert plastic. | 06-23-2011 |
20110146728 | HIGH TEMPERATURE CHUCK AND METHOD OF USING SAME - Improved resistance to temperature-related degradation or deformation in a wafer-supporting chuck is provided by at least one shielding member that physically and/or thermally shields chuck components from effects of elevated temperature processing fluids. | 06-23-2011 |
20110130009 | METHOD AND APPARATUS FOR SURFACE TREATMENT USING A MIXTURE OF ACID AND OXIDIZING GAS - Improved removal of ion-implanted photoresist in a single wafer front-end wet processing station is achieved by combining gaseous ozone and heated sulfuric acid such that a gas/liquid dispersion or foam of ozone in sulfuric acid is applied in a layer to the wafer surface to be treated. | 06-02-2011 |
20110000541 | METHOD FOR DEPOSITION A FILM ONTO A SUBSTRATE - Disclosed is a method for depositing a film onto a substrate, with a sputter deposition process
| 01-06-2011 |
20100288312 | DEVICE AND PROCESS FOR WET TREATING A PERIPHERAL AREA OF A WAFER-SHAPED ARTICLE - A device for wet treating a peripheral area of a wafer-shaped article includes holding elements for holding and rotating the wafer-shaped article at its edge, a first and a second liquid treatment units for supplying liquid towards the peripheral area. The holding elements include rollers for driving the wafer-shaped article at its edge. The first liquid treatment unit includes a first liquid carrier for providing a first liquid to wet a first section of the peripheral area, a first liquid supply nozzle for supplying liquid to the first liquid carrier, and a first liquid discharging channel for removing liquid from the first liquid carrier. The second liquid treatment unit includes, a second liquid carrier for providing a second liquid to wet a second section of the peripheral area, a second liquid supply nozzle for supplying liquid to the second liquid carrier, a second liquid discharging channel for removing liquid from the second liquid carrier, and a second gas treatment section with a gas supply nozzle for supplying gas towards the peripheral area, which has been treated with the second liquid for removing most of the second liquid from the peripheral area, and with a gas discharge channel for discharging gas and removed liquid. | 11-18-2010 |
20100200163 | APPARATUS AND METHOD FOR WET TREATMENT OF DISC-LIKE ARTICLES - Disclosed is an apparatus for wet treatment of a disc-like article, which comprises: a spin chuck for holding and rotating the disc-like article, and an inner edge nozzle dispensing treatment liquid directed towards a first peripheral region of the first surface of the disc-like article, wherein the first surface is facing the spin chuck and the first peripheral region is defined as being a region of the first surface with an inner radius (ri), which is greater than 1 cm less than the disc-like article's radius (ra), wherein the inner edge nozzle is positioned in a stationary manner between the disc-like article (when placed on the spin chuck) and the spin chuck, wherein the inner edge nozzle is feed through a central pipe, which is disposed in a stationary manner and penetrates centrally through the spin chuck, for supplying a treatment liquid against a first surface of the disc-like article. | 08-12-2010 |