| Laird Technologies, Inc. Patent applications |
| Patent application number | Title | Published |
|---|
| 20120081253 | Low-Profile Antenna Assembly - A low-profile antenna assembly includes at least two antennas co-located under a cover. At least one of the at least two antennas includes an antenna configured for use with AM/FM radio. And, at least one of the at least two antennas includes an antenna configured for use with at least one or more of SDARS, GPS, cell phones, Wi-Fi, DAB-VHF-III, DAB-L, etc. | 04-05-2012 |
| 20120080639 | POTATO SHAPED GRAPHITE FILLER, THERMAL INTERFACE MATERIALS AND EMI SHIELDING - Various potato graphite filler, thermal interface materials, EMI shielding materials and methods of making thermal interface and EMI shielding materials are disclosed. An example thermal interface material includes a matrix material and a graphite filler suspended in the matrix material. The graphite filler includes potato graphite particles. | 04-05-2012 |
| 20120061135 | COMPLIANT MULTILAYERED THERMALLY-CONDUCTIVE INTERFACE ASSEMBLIES HAVING EMI SHIELDING PROPERTIES - According to various aspects of the present disclosure, exemplary embodiments are disclosed of EMI shielding, thermally-conductive interface assemblies. In various exemplary embodiments, an EMI shielding, thermally-conductive interface assembly includes a thermal interface material and a sheet of shielding material, such as an electrically-conductive fabric, mesh, foil, etc. The sheet of shielding material may be embedded within the thermal interface material and/or be sandwiched between first and second layers of thermal interface material. | 03-15-2012 |
| 20120057588 | MULTIPLE ANTENNA MULTIPLEXERS, DEMULTIPLEXERS AND ANTENNA ASSEMBLIES - Exemplary embodiments of apparatus and methods relating to antenna multiplexers and demultiplexers are disclosed. In exemplary embodiments, antenna multiplexers include two or more inputs for receiving a corresponding number of signals from multiple antennas. The antennas may include a cellular antenna (e.g., world cell antennas or cellular antenna operable within one or more of AMPS/GSM850, GSM900, GSM1800, PCS/GSM1900, UMTS/AWS, GSM850, GSM1900, AWS, LTE, AMPS, PCS, EBS, BRS, WCS, etc.). The antennas may also include AM/FM antennas, SDARS antennas, GPS antennas, and/or antennas combining the preceding. Exemplary antenna multiplexers also include an output for simultaneously outputting the combined signals received by the multiplexer. Demultiplexers for receiving such combined signals and outputting each signal via a separate output are also disclosed. | 03-08-2012 |
| 20120012382 | Conductive Films for EMI Shielding Applications - According to various aspects, exemplary embodiments are provided of EMI shielding materials. In one exemplary embodiment, an EMI shielding material generally includes a conductive metal layer disposed on a thin carrier film. The EMI shielding material may be sufficiently compliant such that the conductive metal layer and thin carrier film are capable of conforming to an irregular surface when the EMI shielding material is applied to the irregular surface. | 01-19-2012 |
| 20120001818 | MULTI-BAND DIPOLE ANTENNAS - Multi-band dipole antennas for wireless application devices are disclosed. An example antenna includes at least one dipole including a resonant element and a ground element. A feed point is coupled to the resonant element, and a ground point is coupled to the ground element. The example antenna also includes a parasitic element adjacent at least a portion of the resonant element. The parasitic element is coupled to the ground element and configured to be operable for changing a resonant frequency of at least a portion of the resonant element. | 01-05-2012 |
| 20110310562 | THERMAL INTERFACE MATERIAL ASSEMBLIES, AND RELATED METHODS - A thermal interface material (TIM) assembly is provided for use in conducting heat away from heat generating components. The TIM assembly generally includes a substrate, a metal alloy coupled to at least one side surface of the substrate, and a coating material covering at least part of the substrate and at least part of the metal alloy. The substrate may include a metal foil, a heat dissipating unit, a heat generating component, etc. The metal alloy may include a low melting metal alloy coupled to the substrate to form multiple bumps along the substrate in a pattern. The pattern may be generic such that the TIM assembly may be used with multiple different heat generating components to effectively conduct heat away from the multiple different heat generating components, or it may correspond to particular locations on a heat generating component away from which heat is to be conducted. | 12-22-2011 |
| 20110303455 | ANTENNA UNIVERSAL MOUNT JOINT CONNECTORS - An antenna mount assembly is disclosed. The antenna mount assembly includes an output contact and an antenna mount body. The antenna mount body includes an output portion, a shielding compartment for housing and electromagnetically shielding a connection between a coaxial cable and the output contact, and an access port to permit access to the shielding compartment around the connection between the coaxial cable and the output contact. An antenna mount nut is mechanically attachable to the output portion of the antenna mount body. The antenna mount nut is configured for mechanically attaching an antenna to the antenna mount body. The output contact is coupled to the antenna mount body. The output contact extends from the output portion and into the shielding compartment for electrically connecting the coaxial cable to the output portion. Antenna mount bodies, connector assemblies and methods of making and installing antenna mounts, and connectors are also disclosed. | 12-15-2011 |
| 20110299262 | BOARD LEVEL ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDS WITH THROUGH HOLE LATCHING MECHANISMS - Disclosed herein are exemplary embodiments of EMI shielding apparatus (e.g., one-piece shields, multi-piece shields, frames, etc.) having one or more latching members insertable into openings or holes in a substrate (e.g., printed circuit board, etc.) and engagable to the substrate. The engagement of the latching members with the substrate mechanically attaches the EMI shielding apparatus to the substrate. | 12-08-2011 |
| 20110242764 | ASSEMBLIES AND METHODS FOR DISSIPATING HEAT FROM HANDHELD ELECTRONIC DEVICES - According to various aspects of the present disclosure, exemplary embodiments include assemblies and methods for dissipating heat from an electronic device by a thermally-conducting heat path to the external casing via one or more portions of an electromagnetic interference shield and/or thermal interface material disposed around the device's battery or other power source. In an exemplary embodiment, a thermally conductive structure which comprises elastomer may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path around the battery area through or along the thermally conductive structure which comprises elastomer. | 10-06-2011 |
| 20110221648 | MULTIBAND HIGH GAIN OMNIDIRECTIONAL ANTENNAS - Exemplary embodiments are provided of multiband high gain omnidirectional antennas. In one exemplary embodiment, an antenna generally includes first and second radiating elements. The first radiating element is configured to produce a first radiation pattern at a first operating frequency. The second radiating element is configured to produce a second radiation pattern at a second operating frequency. Each of the first and second radiating elements includes a meandering or helical portion. | 09-15-2011 |
| 20110204280 | THERMAL INTERFACE MATERIALS INCLUDING THERMALLY REVERSIBLE GELS - Thermal interface materials are disclosed that include or are based on thermally reversible gels, such as thermally reversible gelled fluids, oil gels and solvent gel resins. In an exemplary embodiment, a thermal interface material includes at least one thermally conductive filler in a thermally reversible gel. | 08-25-2011 |
| 20110195264 | Acicular Metal Particles Having a High Aspect Ratio and Non-Catalytic Methods for Making the Same - A non-catalytic method for making high aspect ratio metal particles comprises: mixing a preheated metallic salt solution with a preheated reducing solution, the reducing solution comprising a carboxylic acid or salt thereof and an acrylic copolymer; and heating the reaction mixture to a first temperature and maintaining the mixture at the first temperature for a first period of time, then heating the reaction mixture to a second temperature that is higher than the first temperature and maintaining the mixture at the second temperature for a second period of time. The metal cations in the metallic salt are reduced by the reducing solution to form a plurality of crystallized metallic particles having a high aspect ratio. Electrically conductive articles incorporating the high aspect ratio metal particles and methods for their manufacture are also provided. | 08-11-2011 |
| 20110095954 | MULTI-BAND DIPOLE ANTENNA ASSEMBLIES FOR USE WITH WIRELESS APPLICATION DEVICES - According to various aspects, antenna elements are provided for multi-band sleeve dipole antenna assemblies for use with wireless application devices. The antenna elements generally include first and second radiating elements. The first radiating elements may be tuned for receiving electrical resonant frequencies within a first frequency bandwidth. The second radiating elements may be tuned for receiving electrical resonant frequencies within a second frequency bandwidth different from the first frequency bandwidth. | 04-28-2011 |
| 20110080323 | LOW PROFILE ANTENNA ASSEMBLIES - An antenna assembly including a ground plane and a radiator supported above the ground plane is disclosed. The radiator may include a slot to configure the radiator to be resonant in at least two frequency ranges and a grounding point coupled to the ground plane. The radiator may be a dual-band planar inverted F antenna (PIFA) having an upper surface opposite the ground plane. First and second antenna modules may be coupled to the upper surface of the PIFA. The first and second antenna modules may be patch antennas, such as stacked patch antennas. | 04-07-2011 |
| 20110073360 | SHIELDING ENCLOSURES - Disclosed herein are various exemplary embodiments of shielding enclosures. In an exemplary embodiment, a shielding enclosure generally includes a frame and a lid. The frame includes vertically extending sidewalls and horizontally inwardly extending lateral flanges therefrom. The lateral flanges define a top opening of the frame and include outwardly extending detent legs. The lid includes a top portion for covering the top opening of the frame. The lid also includes flanges downwardly extending from edges of the top portion. At least one of the flanges has a detent structure, such that when the lid is installed on the frame the detent legs of the frame are engaged by the detent structure. The detent structure may, for example, be detent slots or detent protrusions. | 03-31-2011 |
| 20110056742 | EMI SHIELDS AND METHODS OF MANUFACTURING THE SAME - An electromagnetic interference (EMI) shielding apparatus generally includes a lid and a framework. The lid includes a top portion having at least one projection joining part thereon. The at least one projection joining part has a peripheral contour. The framework includes a top portion and a lateral side extending downward from the top portion. The top portion includes at least one joining opening having a peripheral contour coinciding with the peripheral contour of the at least one projection joining part of the lid. Accordingly, the at least one projection joining part of the lid is engagable with the at least one joining opening of the framework via an interference fit. | 03-10-2011 |
| 20110040007 | HIGHLY THERMALLY-CONDUCTIVE MOLDABLE THERMOPLASTIC COMPOSITES AND COMPOSITIONS - Thermally-conductive moldable thermoplastic compositions or composites may generally include a plurality of metal-coated filler particles; a plurality of secondary filler particles; and a polymer matrix in admixture with the metal-coated filler particles and the secondary filler particles. The composition or composite may have a thermal conductivity ranging from about 20 Watts per meter-Kelvin to about 35 Watts per meter-Kelvin. Injection molded articles having a moldable thermally-conductive thermoplastic composition or composite can be formed for microelectronics, automotive, avionic, and other heat dissipation applications. | 02-17-2011 |
| 20110032692 | EMI SHIELDING SLIDE ASSEMBLIES FOR SLIDABLY OPENING AND CLOSING PORTABLE ELECTRONIC DEVICES AND FOR PROVIDING EMI SHIELDING FOR BOARD-MOUNTED ELECTRONIC COMPONENTS - According to various aspects, exemplary embodiments are provided of slide assemblies for slidably opening and closing portable communications terminals, which also are configured to provide electromagnetic interference (EMI) shielding for electronic components of a substrate, such as board-mounted electronic components on a printed circuit board (PCB) of a cellular phone, etc. In one exemplary embodiment, a slide assembly generally includes first and second slide members slidably coupled so as to allow the first slide member to be slidably moved relative to the second slide member. EMI shielding structure is along at least one surface of at least one of the first and second slide members. The EMI shielding structure and the at least one of the first and second slide members are operable for cooperatively providing EMI shielding for one or more board-mounted electronic components of a substrate when disposed within the interior cooperatively defined by the EMI shielding structure, the at least one of the first and second slide members, and the substrate. | 02-10-2011 |
| 20110030754 | THERMOELECTRIC MODULES AND RELATED METHODS - An example thermoelectric module of the present disclosure generally includes a first laminate having a dielectric layer and an electrically conductive layer coupled to the dielectric layer, a second laminate having a dielectric layer and an electrically conductive layer coupled to the dielectric layer, and thermoelectric elements disposed generally between the first and second laminates. At least one of the dielectric layers is a polymeric dielectric layer. The electrically conductive layer of the first laminate is at least partially removed to form electrically conductive pads on the first laminate. The electrically conductive layer of the second laminate is at least partially removed to form electrically conductive pads on the second laminate. The thermoelectric elements are coupled to the electrically conductive pads of the first and second laminates for electrically coupling the thermoelectric elements together. | 02-10-2011 |
| 20110025575 | INTEGRATED ANTENNA AND EMI SHIELDING SUPPORT MEMBER FOR PORTABLE COMMUNICATIONS TERMINALS - According to various aspects, exemplary embodiments are provided of portable communications terminals and assemblies thereof. In one exemplary embodiment, a portable communications terminal includes a support member. An antenna is supported by the support member. Electromagnetic interference (EMI) shielding structure is also supported by the support member. A printed circuit board includes one or more electronic components mounted thereon. The EMI shielding structure is operable for providing EMI shielding for one or more electronic components that are disposed within the interior defined by the EMI shielding structure and the printed circuit board. | 02-03-2011 |
| 20110000516 | FLEXIBLE ASSEMBLIES WITH INTEGRATED THERMOELECTRIC MODULES SUITABLE FOR USE IN EXTRACTING POWER FROM OR DISSIPATING HEAT FROM FLUID CONDUITS - In one exemplary embodiment, an assembly includes one or more thermoelectric modules, a compliant thermal interface, and a heat spreader. The compliant thermal interface is configured such that it may substantially conform against and intimately thermally contact an outer surface of a fluid conduit. The heat spreader is disposed generally between and thermally coupled to the compliant thermal interface and the one or more thermoelectric modules. The heat spreader may have greater flexibility than the one or more thermoelectric modules. The heat spreader may also have a thermal conductivity greater than the compliant thermal interface. The assembly may have sufficient flexibility to be circumferentially wrapped at least partially around a portion of the fluid conduit's outer surface, with the compliant thermal interface in substantial conformance against and in intimate thermal contact with the fluid conduit's outer surface portion. Accordingly, a thermally-conducting heat path may thus be established from the fluid conduit to the one or more thermoelectric modules via the compliant thermal interface and the heat spreader. | 01-06-2011 |
| 20100321897 | COMPLIANT MULTILAYERED THERMALLY-CONDUCTIVE INTERFACE ASSEMBLIES - According to various aspects of the present disclosure, exemplary embodiments are disclosed of thermally-conductive interface assemblies. In exemplary embodiments, thermal interface material is disposed on or along one side of a flexible thermally-conductive sheet. In other embodiments, a flexible thermally-conductive sheet is bonded to, encapsulated within, or sandwiched between first and second layers of a thermal interface material. The flexible thermally-conductive sheet may be a flexible perforated graphite sheet. The thermal interface material may be thermally-conductive polymer. The perforations in the graphite sheet may enable a polymer-to-polymer bond to form that may help mechanically bond the first and second layers to the graphite sheet and/or may help provide heat conduction between the first and second layers. | 12-23-2010 |
| 20100321895 | MEMORY MODULES INCLUDING COMPLIANT MULTILAYERED THERMALLY-CONDUCTIVE INTERFACE ASSEMBLIES - According to various aspects of the present disclosure, exemplary embodiments are disclosed of thermally-conductive interface assemblies suitable for use in dissipating heat from one or more components of a memory module. The thermally-conductive interface assembly may generally include a flexible heat-spreading material having first and second sides and one or more perforations extending through the flexible heat-spreading material from the first side to the second side. The flexible heat-spreading material may be sandwiched between first and second layers of soft thermal interface material. A portion of the soft thermal interface material may be disposed within the one or more perforations. The thermally-conductive interface assembly may be positioned relative to one or more components of a memory module to provide a thermally-conductive heat path from the one or more components to the first layer of soft thermal interface material. | 12-23-2010 |
| 20100319744 | THERMOELECTRIC MODULES AND RELATED METHODS - An example method for making thermoelectric modules generally includes coupling a first wafer and a second wafer together, processing the first and second wafers to produce a first thermoelectric element and a second thermoelectric element where the first thermoelectric element and the second thermoelectric element are coupled together, coupling the first thermoelectric element to a first conductor, coupling the second thermoelectric element to a second conductor, separating the first thermoelectric element and the second thermoelectric element, coupling the first thermoelectric element to a third conductor whereby the first thermoelectric element, the first conductor, and the third conductor form at least part of a thermoelectric module, and coupling the second thermoelectric element to a fourth conductor whereby the second thermoelectric element, the second conductor, and the fourth conductor form at least part of another thermoelectric module. | 12-23-2010 |
| 20100309631 | ASSEMBLIES AND METHODS FOR DISSIPATING HEAT FROM HANDHELD ELECTRONIC DEVICES - According to various aspects of the present disclosure, exemplary embodiments include assemblies and methods for dissipating heat from an electronic device by a thermally-conducting heat path to the external casing via one or more portions of an electromagnetic interference shield and/or thermal interface material disposed around the device's battery or other power source. In an exemplary embodiment, a shield (or portions thereof) may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path generally around the battery area through or along the shield. In another exemplary embodiment, a thermal interface material (or portions thereof) may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path generally around the battery area through or along the thermal interface material. | 12-09-2010 |
| 20100277379 | INTERCHANGEABLE SLIDABLY MOUNTABLE FINS FOR ANTENNA ASSEMBLIES - An antenna assembly for installation to a mobile platform generally includes a base portion and an antenna module removably coupled to the base portion. The base portion generally includes a longitudinal axis and defines a channel extending generally along at least part of the longitudinal axis. The antenna module generally includes a mount and an antenna element coupled to the mount. The mount and antenna element can be removably received, for example, slid, into the channel of the base portion, in electrical contact therewith. The antenna module may also include a cover providing the antenna assembly with a generally fin-shaped structure. And, any one of multiple different antenna modules each having, for example, different antenna elements therein may be releasably coupled to the mount as desired. | 11-04-2010 |
| 20100276630 | PROCESS FOR UNIFORM AND HIGHER LOADING OF METALLIC FILLERS INTO A POLYMER MATRIX USING A HIGHLY POROUS HOST MATERIAL - A method relating to making a metal coated filler includes mixing a solution of an organic diol with a plurality of porous filler particles to obtain a support mixture; contacting a metal salt solution with the support mixture forming a reaction mixture; and heating the reaction mixture to a temperature within a temperature range from about 50 degrees Celsius to about 200 degrees Celsius. The metal cations in the metal salt solution are reduced to metal particles by the organic diol and are disposed on the porous filler particles and on filler particle pore surfaces. The metal coated filler may then be optionally isolated. Electrically and/or thermally conductive articles including the metal coated fillers and methods for their manufacture are also disclosed. | 11-04-2010 |
| 20100266246 | EMI SHIELDING AND/OR GROUNDING GASKETS - An electromagnetic interference (EMI) shielding and/or grounding gasket generally includes one or more sides and slots along the one or more sides. Finger elements are defined by the slots. The finger elements include contact portions for electrically contacting at least one electrically conductive surface adjacent to a mounting surface when the gasket is mounted thereto with its one or more sides disposed about and in electrical contact with the mounting surface. The gasket may thus be operable for establishing an electrically conductive pathway between the electrically-conductive surface and the mounting surface. | 10-21-2010 |
| 20100258344 | FLAME RETARDANT EMI SHIELDS - An example electromagnetic interference shield generally includes a resilient core member and an electrically conductive layer. An adhesive bonds the electrically conductive layer to the resilient core member. The adhesive may include halogen-free flame retardant. | 10-14-2010 |
| 20100245200 | Multi-Band Antenna Assemblies - A multi-band antenna assembly that is operable to receive and/or transmit signals at one or more frequencies generally includes at least two radiating elements, a transmission line coupled to each of the at least two radiating elements, and a tunable match resonator coupled to the transmission line. The tunable match resonator is operable to vary input impedance of a signal received and/or transmitted by the antenna assembly by changing an electrical field within the tunable match resonator. | 09-30-2010 |
| 20100238012 | ANTENNA ASSEMBLIES FOR REMOTE APPLICATIONS - An antenna assembly is provided suitable for use with a remote communications module such as, for example, a keyless entry module, a tire pressure monitoring module, etc. The antenna assembly generally includes a support, a folded metallic antenna element mounted on the support, an amplifier coupled to the folded antenna element, and a transmission line coupled to the amplifier. | 09-23-2010 |
| 20100226354 | MULTIPLE ANTENNA MULTIPLEXERS, DEMULTIPLEXERS AND ANTENNA ASSEMBLIES - Exemplary embodiments are provided of apparatus and methods relating to antenna multiplexers and demultiplexers are disclosed. In exemplary embodiments, antenna multiplexers include two or more inputs for receiving a corresponding number of signals from multiple antennas. The antennas may include world cell antennas, AM/FM antennas, SDARS antennas, GPS antennas, and/or antennas combining the preceding. Exemplary antenna multiplexers also include an output for simultaneously outputting the combined signals received by the multiplexer. Demultiplexers for receiving such combined signals and outputting each signal via a separate output are also disclosed. | 09-09-2010 |
| 20100177012 | DUAL-POLARIZED ANTENNA MODULES - An array antenna module includes multiple antenna assemblies. Each antenna assembly generally includes a first radiating element and a second radiating element spaced apart from the first radiating element and capacitively coupled thereto. A first transmission line is capacitively coupled to the first radiating element, and a second transmission line is electrically coupled to the first radiating element by a connector. The antenna assembly is operable to transmit at least one or more signals to at least one or more wireless application devices and/or to receive at least one or more signals from at least one or more wireless application devices. The first radiating element, second radiating element, first transmission line, and/or second transmission line are coupled to substrates. And at least one or more of the substrates may include epoxy resin bonded glass fabric such as, for example, flame retardant 4. | 07-15-2010 |
| 20100167600 | ELECTROCOATED CONTACTS COMPATIBLE WITH SURFACE MOUNT TECHNOLOGY - According to various aspects, exemplary embodiments are provided of contacts that may be compatible with surface mount technology. The contacts may be surface mountable for establishing an electrical pathway (e.g., electrical grounding contact, etc.) from at least one electrically-conductive surface on the substrate to another electrically-conductive surface (e.g., EMI shield, battery contact, etc.). In one exemplary embodiment, a contact generally includes a resilient dielectric core member. At least one outer electrically-conductive layer is electrocoated onto the resilient dielectric core member. A solderable electrically-conductive base member may be coupled to the resilient core member and/or the outer electrically-conductive layer. The base member may be in electrical contact with the outer electrically-conductive layer. | 07-01-2010 |
| 20100097286 | OMNIDIRECTIONAL MULTIPLE INPUT MULTIPLE OUTPUT (MIMO) ANTENNAS WITH POLARIZATION DIVERSITY - Exemplary embodiments are provided of omnidirectional MIMO antennas with polarization diversity. In one exemplary embodiment, an omnidirectional MIMO antenna generally includes an array of radiating antenna elements having a linear horizontal polarization and radiating omnidirectionally in azimuth. The antenna also includes at least one radiating antenna element having a linear vertical polarization and radiating omnidirectionally in azimuth. The vertically polarized radiating antenna is spaced-apart from the array. The antenna is operable for producing omnidirectional, vertically polarized coverage for at least one port, as well as omnidirectional, horizontally polarized coverage for at least one other port. | 04-22-2010 |
| 20100039336 | WIND NOISE REDUCING MOUNTING BASES FOR ANTENNA ASSEMBLIES - An antenna assembly is provided that includes an antenna element depending from an antenna mounting base. The mounting base includes a shaft portion that uniformly tapers from a mounting end portion to a projecting end portion. The shaft portion includes grooves, or flutes, that each extends from the mounting end portion toward the projecting end portion, and that each has a curvature about an axis of the shaft portion. The grooves provide the shaft portion with an asymmetrical cross-sectional area that causes airflow impinging on the shaft portion to generate turbulence and scatter low air pressure regions that tend to form locally around the shaft portion. As a result, small vibrations generated by the low pressure regions are suppressed, and whistling sounds, noises, etc. associated with the vibrations may be reduced. | 02-18-2010 |
| 20090211802 | ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING APPARATUS AND RELATED METHODS - According to various aspects, exemplary embodiments are provided of shielding apparatus suitable for use in providing electromagnetic interference shielding for one or more electrical components on a substrate. In one exemplary embodiment, a shielding apparatus generally includes first and second walls. The first wall includes laterally spaced-apart detent protrusions. The second wall includes an edge portion disposed relative to the first wall such that an interface between the edge portion of the second wall and the first wall is substantially sealed against the ingress and/or egress of electromagnetic interference through the interface. The edge portion of the second wall is engaged generally between and laterally confined by the laterally spaced-apart detent protrusions of the first wall, such that the laterally spaced-apart detent protrusions inhibit movement of the second wall relative to the first wall. Accordingly, this helps retain the interface between the edge portion of the second wall and the first wall substantially sealed against the ingress and/or egress of electromagnetic interference through the interface. | 08-27-2009 |
| 20090207579 | EMI SHIELDING ASSEMBLIES AND RELATED METHODS OF RETAINING COMPONENTS THEREOF TOGETHER - In one exemplary embodiment, an electromagnetic interference (EMI) shielding apparatus generally includes a shield and a gasket. The gasket includes at least one tab formed monolithically with the gasket and attached to a support or portion of the gasket. The at least one tab is movable relative to the support from a first, pre-installed configuration in which the at least one tab is generally co-planar with the support to a second, installed configuration in which the at least one tab extends generally outwardly relative to the support. Movement of the at least one tab from the first configuration to the second configuration may position the at least one tab at least partially within the at least one opening of the shield. Frictional engagement of the at least one tab within the at least one opening may help retain the relative positioning of the gasket to the shield. | 08-20-2009 |
| 20090195477 | STACKED PATCH ANTENNAS - According to various exemplary embodiments, an antenna assembly generally includes one or more antennas, such as a single multi-frequency antenna, first and second stacked patch antennas, etc. The antenna assembly may be operable for receiving signals having different frequencies (e.g., a frequency associated with a satellite digital audio radio service (SDARS), a frequency associated with a global positioning system (GPS), etc.). The antenna assembly may generally include at least one antenna (e.g., a single multi-frequency antenna, first and second stacked patch antennas, etc.) having at least one feed point and tuned to at least one of a first frequency and a second frequency that is different than the first frequency. A low noise amplifier may be in communication with the at least one feed point for amplifying signals having the first frequency and signals having the second received from a signal output. A single communication link may be used for communicating an output signal of the antenna assembly. | 08-06-2009 |
| 20090184827 | PLANAR DISTRIBUTED RADIO-FREQUENCY IDENTIFICATION (RFID) ANTENNA ASSEMBLIES - Disclosed are exemplary embodiments of passive radio-frequency identification (RFID) readers operable for creating a relatively uniform near field adjacent a planar surface for reading RFID tags generally above the planar surface. The RFID reader may include a plurality of antenna elements distributed in an array underneath the planar surface. A central antenna element may be located within the array generally between two or more perimetric antenna elements. A network may distribute electromagnetic energy to the antenna elements such that a current phase of at least one perimetric antenna element is out of phase with and lagging a current phase of the central antenna element. Alternatively, the perimetric antenna elements may be parasitically coupled to the central antenna element, such that a current phase of at least one perimetric antenna element is out of phase with and lagging a current phase of the central antenna element. | 07-23-2009 |
| 20090140499 | GASKETS FOR PROVIDING ENVIRONMENTAL SEALING AND/OR ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING - A gasket generally includes upper and lower members and first and second oppositely-disposed lateral members. The first and second oppositely-disposed lateral members connect the lower member to the upper member such that a spaced distance separates the lower member's inner surface from the upper member's inner surface. The first and second lateral members, lower member, and lower member may collectively define a generally trapezoidal profile. | 06-04-2009 |
| 20090119903 | EMI SHIELDS AND RELATED MANUFACTURING METHODS - An electromagnetic interference (EMI) shield according to one embodiment generally includes a frame and a cover. The frame includes peripheral walls each having at least one folded portion forming an outer sidewall and an inner sidewall. The cover includes a lid portion and a plurality of edge portions extending downwardly from the lid portion. The shield includes at least one dimple configured to be engagingly received in at least one opening for releasably retaining the cover to the frame. | 05-14-2009 |
| 20090117373 | THERMAL INTERFACE MATERIAL WITH THIN TRANSFER FILM OR METALLIZATION - According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a metallization layer having a layer thickness of about 0.0005 inches or less. The metallization layer is disposed along at least a portion of the first side of the thermal interface material. | 05-07-2009 |
| 20090117345 | THERMAL INTERFACE MATERIAL WITH THIN TRANSFER FILM OR METALLIZATION - According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a dry material having a thickness of about 0.0005 inches or less. The dry material is disposed along at least a portion of the first side of the thermal interface material. | 05-07-2009 |
| 20090114438 | Fabric-Over-Foam EMI Gaskets Having Transverse Slits and Related Methods - According to various aspects, exemplary embodiments are provided of fabric-over-foam EMI gaskets. In one exemplary embodiment, a fabric-over-foam EMI gasket generally includes a resiliently compressible foam core and an outer electrically-conductive fabric layer. At least one slit extends generally transversely across an upper surface portion of a longitudinally extending region of the gasket. | 05-07-2009 |
| 20090111290 | ELECTROCOATED CONTACTS COMPATIBLE WITH SURFACE MOUNT TECHNOLOGY - According to various aspects, exemplary embodiments are provided of contacts that may be compatible with surface mount technology. The contacts may be surface mountable for establishing an electrical pathway (e.g., electrical grounding contact, etc.) from at least one electrically-conductive surface on the substrate to another electrically-conductive surface (e.g., EMI shield, battery contact, etc.). In one exemplary embodiment, a contact generally includes a resilient dielectric core member. At least one outer electrically-conductive layer is electrocoated onto the resilient dielectric core member. A solderable electrically-conductive base member may be coupled to the resilient core member and/or the outer electrically-conductive layer. The base member may be in electrical contact with the outer electrically-conductive layer. | 04-30-2009 |
| 20090085824 | ANTENNA RADIAL SYSTEMS AND RELATED METHODS - According to various aspects, exemplary embodiments are provided of antenna radial systems. In one exemplary embodiment, an antenna radial system generally includes a washer having a channel disposed along a first side of the washer. A radial includes a locking portion configured to be received within the channel. The radial also includes elongate portions extending outwardly from the locking portion such that an angle is defined between each elongate portion and the locking portion. A bushing cooperates with the washer for sandwiching the radial's locking portion therebetween to thereby help retain the radial's locking portion within the channel. | 04-02-2009 |
| 20090066593 | VEHICLE-MOUNT STACKED PATCH ANTENNA ASSEMBLIES WITH RESILIENTLY COMPRESSIBLE BUMPERS FOR MECHANICAL COMPRESSION TO AID IN ELECTRICAL GROUNDING OF SHIELD AND CHASSIS - According to various aspects, exemplary embodiments are provided of antenna assemblies. In one exemplary embodiment, an antenna assembly suitable for installation to a vehicle body wall generally comprises a chassis, a radome, and a shield disposed generally between the chassis and radome. Two or more resiliently compressible bumpers are spaced apart and compressively sandwiched generally between the radome and the shield. Compression of the bumpers generates a compressive force urging the shield generally towards the chassis that aids in electrically grounding of the shield with the chassis. | 03-12-2009 |
| 20090057003 | ELECTROMAGNETIC INTERFERENCE SHIELDS AND RELATED MANUFACTURING METHODS - According to various aspects, exemplary embodiments are provided of board level shields having single piece constructions. In an exemplary embodiment, a shielding enclosure includes sidewalls and an integral top surface. The sidewalls include upper and lower portions cooperatively defining an interlock therebetween. The upper sidewall portions depend downwardly from the integral top surface. The interlock releasably attaches the integral top surface and upper sidewall portions to the lower sidewall portions. By disengaging the interlock, the integral top surface and upper sidewall portions may then be completely separated from the lower sidewall portions. The integral top surface and upper sidewall portions may also be reattached to the lower sidewall portions by engagement of the interlock. | 03-05-2009 |
| 20090021445 | BROADBAND VHF ANTENNA - An antenna assembly having a radiating element and a circuit board is provided. The radiating element is coupled to the circuit board by a conductive extension and hook portion where the hook portion extends into and possibly through a bore on the circuit board. | 01-22-2009 |
| 20090020328 | HYBRID ANTENNA STRUCTURE - An electrical component is provided that provides at least a two shot injection molding structure. One of the at least two shots of plastic comprises a laser direct structuring material. Another of the at least two shots of plastic comprises a non-platable plastic. The laser direct structuring material is selectively activated such that a conductive trace can be plated on the laser direct structuring material. | 01-22-2009 |
| 20090016025 | THERMALLY CONDUCTIVE EMI SHIELD - Electromagnetic-energy absorbing materials are combined with thermally conductive materials, such as those used for thermal management in association with electronic equipment, thereby suppressing the transmission of electromagnetic interference (EMI) therethrough. Disclosed are materials and processes for combining EMI-absorbing materials with thermally conductive materials thereby improving EMI shielding effectiveness in an economically efficient manner. In one embodiment, a thermally conductive EMI absorber is prepared by combining an EMI-absorbing material (for example, ferrite particles) with a thermally conducting material (for example, ceramic particles), each suspended within an elastomeric matrix (for example, silicone). In application, a layer of thermally conductive EMI-absorbing material is applied between an electronic device or component, and a heat sink. | 01-15-2009 |
| 20090009403 | ANTENNA ASSEMBLY WITH CONNECTORS HAVING AN INTERNAL CONDUCTIVE CHANNEL - The present invention provides an antenna with an integral electrical connection to a printed circuit board. The electrical connection is accomplished by providing a connection beam from a conductive layer to the circuit board. The connection beam is provided with a channel extending through the connection beam, such as a channel through the geometric center of the beam, and the channel is plated. The connection beam terminates with a contact point. The beam is deflectable to provide contact force. | 01-08-2009 |
| 20080298627 | WATER RESISTANT AUDIO MODULE - A water resistant/proof speaker module with improved performance and bass reflection is provided. The speaker module comprises a housing into which an audio unit fits. The speaker module is provide with a speaker face having at least 50% of the speaker face open to improve audio characteristics. Seals are provided along the speaker module to inhibit moisture from entering the device housing. | 12-04-2008 |
| 20080272973 | DUAL BAND SLOT ARRAY ANTENNA ABOVE GROUND PLANE - A multiple frequency directional antenna is provided. The antenna includes a radiating array aligned over a ground plane. The radiating array has at least two first elongated slots and two second elongated slots. The slots have different lengths to provide different operating frequencies. On the radiating array opposite the slots is a microstrip impedance matching and diplexing feed network. Radio frequency power is supplied to the antenna via the feed network. | 11-06-2008 |
| 20080271916 | GASKETS FOR PROTECTING FINGERPRINT READERS FROM ELECTROSTATIC DISCHARGE SURGES - According to various aspects, exemplary embodiments are provided of gaskets that can protect fingerprint readers from receiving electrostatic discharge surges when a user's finger is placed in contact with the electronic scanning portion of the fingerprint reader. In exemplary embodiments, a gasket can provide an electrically-insulative barrier between the exposed contact points on the sides of the fingerprint reader, the electrostatic discharge, and the electrically-conductive side of the gasket. The gasket can also include an electrically-conductive side that provides a relatively short path to ground for the electrostatic discharge. | 11-06-2008 |
| 20080266041 | HIGH CURRENT LOW-PROFILE CURRENT CHOKES SUITABLE FOR USE IN DC TO DC CONVERTERS - According to various aspects, exemplary embodiments are provided of current chokes suitable for use in DC to DC converters. For example, a current choke may include a ferrite body with at least one pair of laterally spaced-apart interior conductors disposed lengthwise within the body. A first pair of end terminations may be disposed on a first end of the body and connected to the interior conductors, and a second pair of end terminations may be disposed on a second end of the body and connected to the interior conductors. A nonmagnetic dielectric may be disposed within the body laterally between the interior conductors. The nonmagnetic dielectric may be configured to control magnetic coupling between the at least one pair of interior conductors so that the current choke is operable with a coefficient of magnetic coupling between the interior conductors of less than about 0.90. | 10-30-2008 |
| 20080231515 | ANTENNA WITH LOW SAR - An antenna having a low specific absorption rate has it power feed connected to radio frequency power such that a connector is arranged between a head of the user and a portion of the power feed. | 09-25-2008 |
| 20080198084 | ASYMMETRIC DIPOLE ANTENNA - A multiple frequency dipole antenna is provided. The antenna includes a plurality of conductive traces on a substrate (flexible or rigid). One conductive trace comprises the radiating portion and includes a plurality of radiating arms asymmetrically arranged. The other conductive trace comprises the ground portion and includes a plurality of ground arms. Radio frequency power is supply using, for example, a coaxial cable feed. The outer conductor of the coaxial cable feed is attached ground portion (either substantially parallel or perpendicular to a portion of the ground arms. The central conductor of the cable traverses a gap between the radiating portion and ground portion and is coupled to the radiating portion distal from the radiating arms. | 08-21-2008 |
