| Kyoritsu Chemical & Co., Ltd. Patent applications |
| Patent application number | Title | Published |
|---|
| 20100182560 | METHOD FOR REPAIRING GLASS SUBSTRATE, PROCESS FOR PRODUCING GLASS SUBSTRATE, GLASS SUBSTRATE, AND FLAT PANEL DISPLAY - A method for repairing a glass substrate is a method for repairing a glass substrate ( | 07-22-2010 |
| 20090257171 | Coating Liquid for Manufacturing Electrode Plate, Undercoating Agent, and Use Therof - This invention relates to a coating formulation for manufacturing an electrode plate, which contains a solution of a hydroxyalkylchitosan and an organic acid and/or its derivative in an aprotic polar solvent, and an active material added to the solution and kneaded with the solution, the electrode plate, a manufacturing process of the electrode plate, a battery, a capacitor, and an undercoating formulation. According to this invention, a coating formulation for manufacturing an electrode plate for a nonaqueous electrolyte secondary battery or an electrode plate for an electric double layer capacitor having excellent adhesion and improved contact resistance between an active material layer and a collector, the electrode plate, its manufacturing process, the battery and the capacitor can be provided. | 10-15-2009 |
| 20090071703 | CONDUCTIVE PASTE, CIRCUIT BOARD, CIRCUIT ARTICLE AND METHOD FOR MANUFACTURING SUCH CIRCUIT ARTICLE - The present invention provides a conductive paste, which is suitable for forming and protecting a circuit, an electrode and the like and is capable of connecting electrodes of a plurality of circuit boards in a short time, a circuit board, a circuit article excellent in moisture and heat resistance and the like, and a method for producing the circuit article. The present conductive paste comprises a conductive material that is scaly, has a mean particle diameter of 1 μm or more and 10 μm or less, and is at least one material selected from the group consisting of Ag, an Ag alloy, an Ag-coated material, and an Ag alloy-coated material, and a resin having a storage modulus at 25° C. of 100 MPa or more. The present circuit board ( | 03-19-2009 |
