| KYOCERA SLC TECHNOLOGIES CORPORATION Patent applications |
| Patent application number | Title | Published |
|---|
| 20120081864 | COLLECTIVE PRINTED CIRCUIT BOARD - There is provided a collective printed circuit board including a plurality of printed circuit boards each having a mounting unit on which a semiconductor element is mounted at an upper-surface central portion, and a frame having a plurality of through holes having sizes to surround the mounting portion. Upper-surface peripheral edge portions of the printed circuit boards and a through-hole peripheral portion of the frame are bonded to each other such that the mounting units are exposed from the through holes. | 04-05-2012 |
| 20120080223 | PRINTED CIRCUIT BOARD - There is provided a printed circuit board including an insulating substrate having a guide hole, a solder resist layer coated on a surface of the insulating substrate, and a connection pad arranged on the surface of the insulating substrate and having an outer periphery covered with the solder resist layer and a central portion exposed in an opening formed in the solder resist layer. The solder resist layer has a positioning hole having a diameter smaller than that of the guide hole and formed by photolithography above the guide hole simultaneously with the opening. | 04-05-2012 |
| 20100071950 | Wiring Board and Manufacturing Method Thereof - A wiring board is comprised of a plurality of circular semiconductor element connection pads deposited in a lattice form onto a mounting portion of an insulation substrate, their upper surfaces being connected to electrodes of a semiconductor element, and a solder resist layer deposited onto the insulation substrate, which covers the side surfaces of these pads and exposes the upper surfaces of these pads. The solder resist layer has a concave part whose bottom surface corresponds to at least all the upper surfaces of these pads. A method of manufacturing a wiring board includes the step of forming a plurality of circular semiconductor element connection pads in a lattice form on a mounting portion of an insulation substrate; the step of depositing onto the insulation substrate a resin layer for a solder resist layer for burying these pads; and forming a solder resist layer by partially removing the resin layer, the solder resist layer covering the side surfaces of these pads and having a concave part whose bottom surface corresponds to at least all the upper surfaces of the pads. | 03-25-2010 |
