| Kyocera Chemical Corporation Patent applications |
| Patent application number | Title | Published |
|---|
| 20110263132 | METHOD FOR FORMING AN ADHESIVE LAYER AND ADHESIVE COMPOSITION - In a forming method of an adhesive layer including the steps of selectively coating, on a surface to be bonded, an adhesive composition containing a thermosetting composition and an organic solvent using a noncontact coating device; and removing the organic solvent from the adhesive composition coated on the surface to be bonded and in a forming method of an adhesive layer characterized in the thermosetting composition has a hardening property so as to exhibit two kinds of reaction temperatures, the adhesive composition comprising an epoxy resin and an epoxy curing agent which are reacted through a first hardening reaction exhibiting a first DSC peak within a temperature range of 100 to 160° C. and a second hardening reaction relating to a self-polymerization of the epoxy resin and exhibiting a second DSC peak within a temperature range of 140 to 200° C. | 10-27-2011 |
| 20110263078 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - According to one embodiment, a method is disclosed for manufacturing a semiconductor device. The method can include die bonding to bond a semiconductor element to a first position of a base member via a bonding layer provided on one surface of the semiconductor element. The method can include wire bonding to connect a terminal formed on the semiconductor element to a terminal formed on the base member by a bonding wire. In addition, the method can include sealing to seal the semiconductor element and the bonding wire. Viscosity of the bonding layer in the bonding is controlled not to exceed the viscosity of the bonding layer in the sealing. | 10-27-2011 |
| 20100025084 | PHOTOSENSITIVE THERMOSETTING RESIN COMPOSITION AND FLEXIBLE PRINTED CIRCUIT BOARD - There is provided a photosensitive thermosetting resin composition of an alkali development type from which it is possible to form a coating film that is halogen-free yet has high-level flame retardancy, has a superior low warpage property after it is cured, is excellent in plasticity, resolution, soldering heat resistance, chemical resistance, and the like, and a flexible printed circuit board using the same. There is provided a photosensitive thermosetting resin composition of an alkali development type and a flexible printed circuit board using the same, the photosensitive thermosetting resin composition including: (A) a resin component having a (meth)acryloyl group and a carboxyl group in one molecule and soluble in a dilute alkali solution; (B) a phosphorus-containing epoxy thermosetting resin component; (C) a photopolymerization initiator; (D) an organophosphorus compound; and (E) a diluent, and having excellent performance in all the properties comparable to those of conventional photosensitive thermosetting resin compositions using brominated epoxy resin and a halogen-based flame retardant, and having an excellent property of not generating hydrogen bromide which has been a problem at the time of the combustion. | 02-04-2010 |
| 20080252862 | Light Reflector, Method for Manufacturing the Same and Projector - A light reflector which can be manufactured easily by using a plastic base material that is light weight and low cost and has high reflectivity, and a method for manufacturing the same. The light reflector comprises a plastic base material | 10-16-2008 |
