| Kulicke and Soffa Industries, Inc. Patent applications |
| Patent application number | Title | Published |
|---|
| 20120128229 | IMAGING OPERATIONS FOR A WIRE BONDING SYSTEM - A method of imaging a feature of a semiconductor device is provided. The method includes the steps of: (a) imaging a first portion of a semiconductor device to form a first imaged portion; (b) imaging a subsequent portion of the semiconductor device to form a subsequent imaged portion; (c) adding the subsequent imaged portion to the first imaged portion to form a combined imaged portion; and (d) comparing the combined imaged portion to a reference image of a feature to determine a level of correlation of the combined imaged portion to the reference image. | 05-24-2012 |
| 20120125977 | ULTRASONIC TRANSDUCERS FOR WIRE BONDING AND METHODS OF FORMING WIRE BONDS USING ULTRASONIC TRANSDUCERS - A method of forming a wire bond using a bonding tool coupled to a transducer is provided. The method includes the steps of: (1) applying electrical energy to a driver of the transducer at a first frequency; and (2) applying electrical energy to the driver at a second frequency concurrently with the application of the electrical energy at the first frequency, the first frequency and the second frequency being different from one another. | 05-24-2012 |
| 20120104075 | METHOD OF OPERATING A CLAMPING SYSTEM OF A WIRE BONDING MACHINE - A method of operating a wire bonding machine is provided. The method includes the steps of: (1) providing a workpiece secured in a bonding position by a device clamp of a wire bonding machine; (2) raising the device clamp to a first height above the workpiece, the device clamp remaining at the first height for a first predetermined period of time; and (3) raising the device clamp to a second height above the workpiece after step (2), the second height being further away from the workpiece than the first height. | 05-03-2012 |
| 20120074206 | METHODS OF FORMING WIRE BONDS FOR WIRE LOOPS AND CONDUCTIVE BUMPS - A method of forming a wire bond using a wire bonding machine is provided. The method includes the steps of: (1) selecting at least one target bonding control value; (2) generating bonding parameters for forming a wire bond using an algorithm and the at least one selected target bonding control value; (3) forming a wire bond using the generated bonding parameters; (4) determining if the at least one selected target bonding control value of the formed wire bond is within a predetermined tolerance of the at least one selected target bonding control value; (5) adjusting at least one bonding adjustment value if the at least one selected target bonding control value of the formed wire bond is not within the predetermined tolerance; and (6) generating revised bonding parameters for forming a subsequent wire bond using an algorithm and the at least one adjusted bonding adjustment value | 03-29-2012 |
| 20120065761 | SYSTEMS AND METHODS FOR OPTIMIZING LOOPING PARAMETERS AND LOOPING TRAJECTORIES IN THE FORMATION OF WIRE LOOPS - A method of forming a wire loop in connection with a semiconductor package is provided. The method includes the steps of: (1) providing package data related to the semiconductor package to a wire bonding machine; (2) providing at least one looping control value related to a desired wire loop to the wire bonding machine, the at least one looping control value including at least a loop height value related to the desired wire loop; (3) deriving looping parameters, using an algorithm, for forming the desired wire loop; (4) forming a first wire loop on the wire bonding machine using the looping parameters derived in step (3); (5) measuring actual looping control values of the first wire loop formed in step (4) corresponding to the at least one looping control value; and (6) comparing the actual looping control values measured in step (5) to the at least one looping control value provided in step (2). | 03-15-2012 |
| 20120031877 | GAS DELIVERY SYSTEM FOR REDUCING OXIDATION IN WIRE BONDING OPERATIONS - A wire bonding machine is provided. The wire bonding machine includes a bonding tool and an electrode for forming a free air ball on an end of a wire extending through the bonding tool where the free air ball is formed at a free air ball formation area of the wire bonding machine. The wire bonding machine also includes a bond site area for holding a semiconductor device during a wire bonding operation. The wire bonding machine also includes a gas delivery mechanism configured to provide a cover gas to: (1) the bond site area whereby the cover gas is ejected through at least one aperture of the gas delivery mechanism to the bond site area, and (2) the free air ball formation area. | 02-09-2012 |
| 20120024089 | METHODS OF TEACHING BONDING LOCATIONS AND INSPECTING WIRE LOOPS ON A WIRE BONDING MACHINE, AND APPARATUSES FOR PERFORMING THE SAME - A method of teaching bonding locations of a semiconductor device on a wire bonding machine is provided. The method includes (1) providing the wire bonding machine with position data for (a) bonding locations of a first component of the semiconductor device, and (b) bonding locations of a second component of the semiconductor device; and (2) teaching the bonding locations of the first component of the semiconductor device and the second component of the semiconductor device using a pattern recognition system of the wire bonding machine to obtain more accurate position data for at least a portion of the bonding locations of the first component and the second component. The teaching step is conducted by teaching the bonding locations in the order in which they are configured to be wire bonded on the wire bonding machine. | 02-02-2012 |
| 20120006882 | CONDUCTIVE BUMPS, WIRE LOOPS, AND METHODS OF FORMING THE SAME - A method of forming a conductive bump is provided. The method includes the steps of: ( | 01-12-2012 |
| 20110174865 | METHOD OF TEACHING EYEPOINTS FOR WIRE BONDING AND RELATED SEMICONDUCTOR PROCESSING OPERATIONS - A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another. | 07-21-2011 |
| 20110121053 | Z-AXIS MOTION SYSTEM FOR A WIRE BONDING MACHINE - A coil assembly configured to provide motion of a bonding tool of a wire bonding machine along a substantially vertical axis is provided. The coil assembly includes a first coil portion having a first force constant, the first coil portion being configured to receive energy to provide a first motion of the bonding tool. The coil assembly also includes a second coil portion having a second force constant, the second coil portion being configured to receive energy to provide a second motion of the bonding tool, the second force constant being different from the first force constant. | 05-26-2011 |
| 20110114703 | Z-AXIS MOTION SYSTEM FOR A WIRE BONDING MACHINE - A coil assembly configured to provide motion of a bonding tool of a wire bonding machine along a substantially vertical axis is provided. The coil assembly includes a first coil portion having a first force constant, the first coil portion being configured to receive energy to provide a first motion of the bonding tool. The coil assembly also includes a second coil portion having a second force constant, the second coil portion being configured to receive energy to provide a second motion of the bonding tool, the second force constant being different from the first force constant. | 05-19-2011 |
| 20110073635 | GAS DELIVERY SYSTEM FOR REDUCING OXIDATION IN WIRE BONDING OPERATIONS - A wire bonding machine is provided. The wire bonding machine includes a bonding tool and an electrode for forming a free air ball on an end of a wire extending through the bonding tool where the free air ball is formed at a free air ball formation area of the wire bonding machine. The wire bonding machine also includes a bond site area for holding a semiconductor device during a wire bonding operation. The wire bonding machine also includes a gas delivery mechanism configured to provide a cover gas to: ( | 03-31-2011 |
| 20110056267 | METHOD OF CALIBRATING A CONSTANT VOLTAGE SUPPLY FOR AN ULTRASONIC TRANSDUCER OF A WIRE BONDING MACHINE - A method of calibrating a voltage for use with an ultrasonic transducer of a wire bonding machine in a constant voltage mode is provided. The method includes: (1) determining an impedance value associated with operation of the ultrasonic transducer; and (2) establishing an adjusted voltage level for use with the ultrasonic transducer in the constant voltage mode based on the determined impedance value. | 03-10-2011 |
| 20110000951 | WIRE PAYOUT MEASUREMENT AND CALIBRATION TECHNIQUES FOR A WIRE BONDING MACHINE - A method of calibrating a wire payout related to predetermined looping motions used during formation of a wire loop is provided. The method includes the steps of: (a) determining a first wire payout length related to predetermined wire looping motions used in the formation of a first of the wire loop, the predetermined looping motions being performed on a first wire bonding system; (b) determining a second wire payout length related to the predetermined wire looping motions used in the formation of a second of the wire loop; and (c) adjusting at least one wire bonding process variable, and repeating step (b) with the at least one adjusted wire bonding process variable such that the second wire payout length determined in the repeated step (b) is closer to the first wire payout length than the second wire payout length determined in the initial step (b). | 01-06-2011 |
| 20100230809 | WIRE LOOP AND METHOD OF FORMING THE WIRE LOOP - A method of forming a wire loop is provided. The method includes: (1) forming a first fold of wire; (2) bonding the first fold of wire to a first bonding location to form a first bond; (3) extending a length of wire, continuous with the first bond, between (a) the first bond and (b) a second bonding location; and (4) bonding a portion of the wire to the second bonding location to form a second bond. | 09-16-2010 |
| 20100230476 | REDUCED OXIDATION SYSTEM FOR WIRE BONDING - A wire bonding machine is provided. The wire bonding machine includes (1) a bond site area for holding a semiconductor device during a wire bonding operation, and (2) a gas supply line configured to provide a gas at the bond site area from above the bond site area. | 09-16-2010 |
| 20100225179 | LINEAR MOTOR WITH REDUCED COGGING - A linear motor is provided including a magnet track including a plurality of permanent magnets, and a coil assembly including a plurality of laminations. The coil assembly defines a plurality of teeth having slots therebetween. The plurality of teeth include (1) two end teeth and (2) at least one non-end tooth arranged between the two end teeth. Each of the two end teeth defines an end profile including a first surface and a second surface. The first surface and the second surface are separated by a step which is substantially perpendicular to a plane defined by the plurality of magnets. The linear motor also includes a plurality of coils at least partially disposed in at least a portion of the slots defined by the plurality of teeth. | 09-09-2010 |
| 20100186991 | CONDUCTIVE BUMPS, WIRE LOOPS INCLUDING THE IMPROVED CONDUCTIVE BUMPS, AND METHODS OF FORMING THE SAME - A method of forming a conductive bump using a wire-bonding machine is provided. The method includes (a) depositing a free air ball bump on a contact pad of a semiconductor element, (b) forming a first fold of wire on the deposited free air ball bump, and (c) forming a second fold of wire on the first fold of wire. | 07-29-2010 |
| 20100181365 | METHOD OF TEACHING EYEPOINTS FOR WIRE BONDING AND RELATED SEMICONDUCTOR PROCESSING OPERATIONS - A method of teaching an eyepoint for a wire bonding operation is provided. The method includes ( | 07-22-2010 |
| 20100147552 | METHOD OF FORMING BENDS IN A WIRE LOOP - A method of forming a bend in a wire loop is provided. The method includes the steps of: (1) forming a first bend in the wire loop at a predetermined portion of the wire loop; (2) paying out a length of wire after step (1); and (3) forming a second bend in the wire loop at the predetermined portion after step (2). | 06-17-2010 |
| 20100108744 | CLOSED LOOP WIRE BONDING METHODS AND BONDING FORCE CALIBRATION - A method of applying bonding energy to form a bond between a portion of a wire and a contact of a bonding location using a wire bonding machine is provided. The method includes: (1) moving a bonding tool towards the contact; (2) detecting when a portion of the contact ( | 05-06-2010 |
| 20090314822 | METHOD OF CONTROLLING THE TRAJECTORY OF A BONDING TOOL DURING THE FORMATION OF A WIRE LOOP - A method of determining a trajectory of an arc motion of a wire used in the formation of a wire loop is provided. The arc motion is between a first point and a second point of the trajectory. The method includes: ( | 12-24-2009 |
| 20090308904 | WIRE FEED SYSTEM AND METHOD OF OPERATING THE SAME - A wire feed system for a wire bonding machine is provided. The wire feed system includes (1) a wire supply, and (2) an air guide for receiving a length of wire from the wire supply. The air guide has an air inlet for receiving a pressurized fluid. The wire feed system is configured to apply a variable tension to the length of wire received by the air guide. | 12-17-2009 |
| 20090250503 | Z-AXIS MOTION SYSTEM FOR A WIRE BONDING MACHINE - A coil assembly configured to provide motion of a bonding tool of a wire bonding machine along a substantially vertical axis is provided. The coil assembly includes a first coil portion having a first force constant, the first coil portion being configured to receive energy to provide a first motion of the bonding tool. The coil assembly also includes a second coil portion having a second force constant, the second coil portion being configured to receive energy to provide a second motion of the bonding tool, the second force constant being different from the first force constant. | 10-08-2009 |
| 20090039141 | BONDING WIRE CLEANING UNIT AND METHOD OF WIRE BONDING USING THE SAME - A wire cleaning system for cleaning wire configured to be wirebonded is provided. The wire cleaning system includes a chamber through which a wire configured to be wirebonded extends prior to the wire being wirebonded. The wire cleaning system also includes an energy source for removing contamination from the wire in the chamber prior to the wire being wirebonded. | 02-12-2009 |
| 20080314964 | WIRE BONDING APPARATUS AND PROCESS - A wire bonding machine includes (1) a support structure for supporting a work piece and (2) a pre-heat structure for supporting the work piece during a pre-heat operation. The pre-heat structure is moveable with respect to the support structure. | 12-25-2008 |
| 20080314963 | Bonding Tool With Improved Finish - A bonding tool includes a body portion terminating at a tip portion. The tip portion is formed from a material, wherein a grain structure of the material is exposed for at least a portion of the tip portion. | 12-25-2008 |
| 20080264907 | ELECTRONIC FLAME-OFF ELECTRODE WITH BALL-SHAPED TIP - An electrode for a wire bonding apparatus is provided. The electrode includes a body portion and a tip portion adjacent the body portion. The tip portion has a substantially spherical configuration. | 10-30-2008 |
| 20080210740 | LOW-PROFILE CAPILLARY FOR WIRE BONDING - A wire bonding tool includes a first cylindrical portion having a first outside diameter and a second cylindrical portion adjacent the first cylindrical portion. The second cylindrical portion has a second outside diameter, the second outside diameter being less than the first outside diameter. The wire bonding tool also includes a tapered portion adjacent the second cylindrical portion. The tapered portion has a third outside diameter at an end adjacent the second cylindrical portion, the third outside diameter being less than the first outside diameter. | 09-04-2008 |
| 20080197171 | BOND HEAD LINK ASSEMBLY FOR A WIRE BONDING MACHINE - A bond head assembly for use with a bonding machine includes a wire bonding tool and a link mechanism coupled between the wire bonding tool and the wire bonding machine. The link mechanism includes a frame, a plurality of arm links pivotably connected to the frame, and a tool support member supporting the wire bonding tool and pivotably connected to each of the arm links. | 08-21-2008 |
