| KUANG HONG PRECISION CO., LTD. Patent applications |
| Patent application number | Title | Published |
|---|
| 20120134631 | Molded Interconnect Device (MID) with Thermal Conductive Property and Method for Production Thereof - A molded interconnect device (MID) with a thermal conductive property and a method for production thereof are disclosed. A thermal conductive element is set in a support element to improve the thermal conductivity of the support element, and the support element is a non-conductive support or a metallizable support. A metallization layer is formed on a surface of the support element. If a heat source is set on the metallization layer, heat produced by the heat source will pass out from the metallization layer or the support element with the thermal conductivity material element. | 05-31-2012 |
| 20120074094 | Manufacturing Method for Forming Circuit Structure on Non-Conductive Carrier - A manufacturing method of forming an electrical circuit on a non-conductive carrier comprises following steps. After providing an electrically non-conductive carrier, catalysts are dispersed on or in the electrically non-conductive carrier. A predetermined track structure is formed on the electrically non-conductive carrier to expose the catalysts on the surface of the predetermined track structure. The surface of the predetermined track structure containing the catalysts is metalized to form a conductor track. | 03-29-2012 |
| 20110278055 | THREE-DIMENSIONAL CIRCUIT DEVICE AND METHOD OF MANUFACTURING SAME - In a method of manufacturing a three-dimensional (3D) circuit device, conducting circuits are formed on a non-conductive base through electroplating. The non-conductive base, and a circuit pattern section, at least one conducting junction and at least one current-guiding junction provided on the base are formed through double injection molding process. An electrically conductive interface layer is formed on the circuit pattern section and the junctions; and then, metal circuits are formed on the circuit pattern section through electroplating. By providing the conducting junction and the current-guiding junction, when forming metal circuits through electroplating, electroplating current can be evenly distributed over the circuit pattern section to form metal coating with uniform thickness, which enables upgraded production efficiency and reduced cost in manufacturing a 3D circuit device. | 11-17-2011 |
