KOREA PHOTONICS TECHNOLOGY INSTITUTE Patent applications |
Patent application number | Title | Published |
20150295128 | ELECTRONIC DEVICE HAVING QUANTUM DOTS AND METHOD OF MANUFACTURING THE SAME - Provided are electronic devices having quantum dots and methods of manufacturing the same. An electronic device includes a first nanorod, a quantum dot disposed on an upper surface of the first nanorod, and a second nanorod that covers a lateral surface of the first nanorod and the quantum dot. The first nanorod and the second nanorod are of opposite types. | 10-15-2015 |
20150263225 | DEVICES HAVING NITRIDE QUANTUM DOT AND METHODS OF MANUFACTURING THE SAME - Devices having nitride quantum dots and methods of manufacturing the same are provided. The device includes a nitride group material substrate, a plurality of nanorods that are formed on the nitride group material layer and are separated from each other, and a nitride quantum dot on each of the nanorods. A pyramid-shaped layer may be further formed between each of the nanorods and the nitride quantum dot. The nanorods and the nitride quantum dot are covered by an upper contact layer. A plurality of nitride quantum dots may be formed on each of the nanorods and the respective nitride quantum dots may have different sizes. | 09-17-2015 |
20140246649 | MULTI-LUMINOUS ELEMENT AND METHOD FOR MANUFACTURING SAME - The present invention relates to a multi-luminous element and a method for manufacturing the same. The present invention provides the multi-luminous element comprising: a buffer layer disposed on a substrate; a first type semiconductor layer disposed on the buffer layer; a first active layer which is disposed on the first type semiconductor layer and is patterned to expose a part of the first type semiconductor layer; a second active layer disposed on the first type semiconductor layer which is exposed by the first active layer; and a second type semiconductor layer disposed on the first active layer and the second active layer, the first and second active layers being repeatedly disposed in the horizontal direction, and the method for manufacturing the same. The multi-luminous element according to the present invention reduces loss of light emitting efficiency and can generate multi-wavelength light by repeatedly disposing the first and second active layers in the horizontal direction. | 09-04-2014 |
20140052002 | FLUORESCENT IMAGE ACQUISITION AND PROJECTION APPARATUS FOR REAL-TIME VISUALIZATION OF INVISIBLE FLUORESCENT SIGNAL - A fluorescent image acquisition and projection apparatus for real-time visualization of an invisible fluorescent signal is provided. The apparatus visualizes an invisible fluorescent signal generated from a target object (a tissue of a living body, a cell of a living body, or the like) by using a photodetection unit and a projector in real time. The apparatus directly projects a visualized fluorescent signal onto a region of the target object where the invisible fluorescent signal is generated, thereby enabling users to determine and confirm the generation location of the fluorescence with the naked eye. | 02-20-2014 |
20130299775 | NITRIDE BASED SEMICONDUCTOR LIGHT EMITTING DEVICE - The disclosure relates to a nitride based semiconductor light emitting device with improved luminescence efficiency by increasing a recombination rate of electrons and holes contributing to luminescence, which results from matching the spatial distribution of electron and hole wave functions. The nitride based semiconductor light emitting device according to the present invention includes an n-type nitride layer, an active layer formed on the n-type nitride layer, and a p-type nitride layer formed on the active layer. At this stage, a strain control layer, and the at least one layer has a larger energy bandgap than a quantum well layer in the active layer. The strain control layer is disposed in an area where the quantum well layer of the active layer is formed. Moreover, an energy bandgap of the strain control layer is less than that of quantum barrier of the active layer. | 11-14-2013 |
20130234274 | LIGHT EMITTING APPARATUS - There is provided a light emitting apparatus including: at least one pair of lead frames; a light emitting device electrically connected to the lead frames to emit ultraviolet rays; a body including a side wall surrounding the light emitting device, and a groove portion formed in an upper surface of the side wall to receive an adhesive; and a lens part disposed above the light emitting device and fixed to the upper surface of the side wall of the body by the adhesive. | 09-12-2013 |
20130193558 | METHOD FOR MANUFACTURING A GROUP III NITRIDE SUBSTRATE USING A CHEMICAL LIFT-OFF PROCESS - The non-polar or semi-polar group III nitride layer disclosed in a specific example of the present invention can be used for substrates for various electronic devices, wherein problems of conventional polar group III nitride substrates are mitigated or solved by using the nitride substrate of the invention, and further the nitride substrate can be manufactured by a chemical lift-off process. | 08-01-2013 |
20130137995 | PULSE DIAGNOSIS DEVICE USING OPTICAL SENSOR - A pulse diagnosis device which can detect the pulsation signal of a radial artery using an optical sensor comprising: a sensor module for sensing the pulsation signal by closely adhering thereto a prescribed body part; and a system control portion for operating the sensor module, and processing the optical signal sensed from the sensor module, wherein the sensor module comprises: an optical waveguide-type sensor which is placed on the bottom surface of the sensor module, and lets the optical signal to pass therethrough and detects the change in optical characteristics due to the change in the pressure; a light-source module which is connected on one side surface of the optical waveguide-type sensor, and inputs the optical signal into the optical waveguide-type sensor; and an optical detector module which is connected on one side surface of the optical waveguide-type sensor, and detects the optical signal delivered from the optical waveguide-type sensor. | 05-30-2013 |
20120319081 | MULTI-LUMINOUS ELEMENT AND METHOD FOR MANUFACTURING SAME - The present invention relates to a multi-luminous element and a method for manufacturing the same. The present invention provides the multi-luminous element comprising: a buffer layer disposed on a substrate; a first type semiconductor layer disposed on the buffer layer; a first active layer which is disposed on the first type semiconductor layer and is patterned to expose a part of the first type semiconductor layer; a second active layer disposed on the first type semiconductor layer which is exposed by the first active layer; and a second type semiconductor layer disposed on the first active layer and the second active layer, the first and second active layers being repeatedly disposed in the horizontal direction, and the method for manufacturing the same. | 12-20-2012 |
20120086040 | LIGHT-EMITTING DIODE HAVING A WAVELENGTH CONVERSION MATERIAL LAYER, AND METHOD FOR FABRICATING SAME - Provided is a light-emitting diode having a wavelength conversion material and a method for fabricating the same. The light-emitting diode comprises: a base structure; a light-emitting diode chip arranged on the base structure; and a wavelength conversion material layer arranged on the light-emitting diode chip, such that the area adjacent the upper surface of the light-emitting diode chip is thicker than the area adjacent to the side surface of the light-emitting diode chip. In addition, the method for fabricating a light-emitting diode comprises: a step of arranging the light-emitting diode chip on the base structure; and a step of arranging a wavelength conversion material layer containing a light-transmitting photocurable material on the light-emitting diode chip, such that the area thereof adjacent to the upper surface of the light-emitting diode chip is thicker than the area thereof adjacent to the side surface of the light-emitting diode chip. | 04-12-2012 |
20100295087 | Light Emitting Diode with High Electrostatic Discharge and Fabrication Method Thereof - The present invention relates to a light emitting diode with high electrostatic discharge and a fabrication method thereof, and more specifically to a light emitting diode comprising a first electrode layer provided over a upper surface of a first semiconductor layer and a upper surface of a second semiconductor layer; a transparent electrode layer formed on the upper surface of the second semiconductor layer, spaced from the first electrode layer; and a second electrode layer provided on a upper surface of the transparent electrode layer. With the present invention, there is provided a light emitting diode element with resistance against electrostatic discharge and with high reliability being strong against electrical impact, by selecting a structure arranging a form of an electrode differently from a conventional electrode. | 11-25-2010 |
20100067848 | FABRICATION METHOD OF OPTICAL MODULE AND OPTICAL MODULE USING THE SAME METHOD - A fabrication method of an optical module comprises a mixed/hybrid optical alignment method, and an optical module uses the same fabrication method using an optical element chip such as a light source chip or a photodetector chip, etc. on an optical wiring substrate and making it possible to simultaneously secure mass productivity that is the advantage of the passive alignment method according to the related art and alignment accuracy that is the advantage of the active alignment method. | 03-18-2010 |
20090180733 | SYSTEM PACKAGE USING FLEXIBLE OPTICAL AND ELECTRICAL WIRING AND SIGNAL PROCESSING METHOD THEREOF - A system package using flexible optical waveguides and electrical wires, and a signal processing method thereof are disclosed. Several rigid substrates having highly integrated electronic elements and optical elements mounted thereon can be electrically and optically connected by using flexible substrates that are electrically wired and optically connected. The package can be variously changed when configuring the package by the flexible substrate and the heat dissipation device and the electromagnetic shielding device are installed in the inside of the package, making it possible to solve electromagnetic wave interference problems and thermal problems occurring in the inside of the package. | 07-16-2009 |