| Kolo Technologies, Inc. Patent applications |
| Patent application number | Title | Published |
|---|
| 20120112324 | THROUGH-WAFER INTERCONNECTION - A through-wafer interconnect and a method for fabricating the same are disclosed. The method starts with a conductive wafer to form a patterned trench by removing material of the conductive wafer. The patterned trench extends in depth from the front side to the backside of the wafer, and has an annular opening generally dividing the conductive wafer into an inner portion and an outer portion whereby the inner portion of the conductive wafer is insulated from the outer portion and serves as a through-wafer conductor. A dielectric material is formed or added into the patterned trench mechanical to support and electrically insulate the through-wafer conductor. Multiple conductors can be formed in an array. | 05-10-2012 |
| 20120013218 | MICRO-ELECTRO-MECHANICAL TRANSDUCER HAVING AN OPTIMIZED NON-FLAT SURFACE - A micro-electro-mechanical transducer (such as a cMUT) having a non-flat surface is disclosed. The non-flat surface may include a variable curve or slope in an area where a spring layer contacts a support, thus making a variable spring model as the spring layer vibrates. The non-flat surface may be that of a non-flat electrode optimized to compensate the dynamic deformation of the other electrode during operation and thus enhance the uniformity of the dynamic electrode gap during operation. Methods for fabricating the micro-electro-mechanical transducer are also disclosed. The methods may be used in both conventional membrane-based cMUTs and cMUTs having embedded springs transporting a rigid top plate. | 01-19-2012 |
| 20110136284 | Micro-Electro-Mechanical Transducer Having a Surface Plate - A micro-electro-mechanical transducer (such as a cMUT) is disclosed. The transducer has a base, a spring layer placed over the base, and a mass layer connected to the spring layer through a spring-mass connector. The base includes a first electrode. The spring layer or the mass layer includes a second electrode. The base and the spring layer form a gap therebetween and are connected through a spring anchor. The mass layer provides a substantially independent spring mass contribution to the spring model without affecting the equivalent spring constant. The mass layer also functions as a surface plate interfacing with the medium to improve transducing performance. Fabrication methods to make the same are also disclosed. | 06-09-2011 |
| 20100280388 | CMUT Packaging for Ultrasound System - Ultrasonic scanners and methods of manufacturing ultra-sonic scanners. One embodiment of a method includes integrating a flexible electronic device (e.g. an IC) and a flexible ultrasonic transducer (e.g. a portion of a circular CMUT array) with a flexible member. The IC, the transducer, and the flexible member can form a flexible subassembly which is rolled up to form an ultrasonic scanner. The integration of the IC and the transducer can occur at the same time. In the alternative, the integration of the electronic device can occur before the integration of the transducer. Moreover, the integration of the transducer can include using a semiconductor technique. Furthermore, the rolled up subassembly can form a lumen or can be attached to a lumen. The method can include folding a portion of the flexible subassembly to form a forward looking transducer. The flexible member of some subassemblies can include a pair of arms. | 11-04-2010 |
| 20100278015 | Variable Operating Voltage in Micromachined Ultrasonic Transducer - A cMUT and a cMUT operation method use an input signal that has two components with different frequency characteristics. The first component has primarily acoustic frequencies within a frequency response band of the cMUT, while the second component has primarily frequencies out of the frequency response band. The bias signal and the second component of the input signal together apply an operation voltage on the cMUT. The operation voltage is variable between operation modes, such as transmission and reception modes. The cMUT allows variable operation voltage by requiring only one AC component. This allows the bias signal to be commonly shared by multiple cMUT elements, and simplifies fabrication. The implementations of the cMUT and the operation method are particularly suitable for ultrasonic harmonic imaging in which the reception mode receives higher harmonic frequencies. | 11-04-2010 |
| 20100251537 | Through-Wafer Interconnections in Electrostatic Transducer and Array - A method for fabricating electrostatic transducers and arrays electrically separates the substrate segments of the transducer elements from each other using a technique involving two cutting steps, in which the first step forms a patterned opening in the substrate to make a partial separation of substrate segments, and the second step completes the separation after the substrate segments have been secured to prevent instability of the substrate segments upon completion of the second step. The securing of the substrate segments may be accomplished by filling a nonconductive material in the partial separation or securing the transducer array on a support substrate. When the substrate is conductive, the separated substrate segments serve as separate bottom electrodes that can be individually addressed. The method is especially useful for fabricating ID transducer arrays. | 10-07-2010 |
| 20100246332 | Stacked Transducing Devices - Implementations include a capacitive micromachined ultrasonic transducer (CMUT) having an additional transducing device overlaid in a vertically stacked relationship. In some implementations the additional transducing device is a second CMUT configured to operate at a different frequency from the first CMUT. | 09-30-2010 |
| 20100244623 | Capacitive Micromachined Ultrasonic Transducer with Voltage Feedback - Implementations of a capacitive micromachined ultra-sonic transducer (CMUT) include a feedback component connected in series with the CMUT. The feedback component applies a feedback on a voltage applied on the CMUT for affecting the voltage applied on the CMUT as a capacitance of the CMUT changes during actuation of the CMUT. | 09-30-2010 |
| 20100207489 | MEMS Ultrasonic Device Having a PZT and CMUT - A MEMS ultrasonic device has an array of PZT transducer elements and a cMUT structure bonded to the array of PZT transducer elements. The MEMS ultrasonic device can be adapted for ultrasonic imaging. The cMUT structure may serve as an active MEMS acoustic filter having at least two acoustic I/O ports to alter an input acoustic signal to an output acoustic signal. The first I/O port is adapted for interfacing with a medium, and the second I/O port for passing an acoustic signal to an acoustic transducer. An array of MEMS acoustic filters may be designed to function as an acoustic lens. Fabrication methods to make the same are also disclosed. | 08-19-2010 |
| 20100013574 | Micro-Electro-Mechanical Transducer Having a Surface Plate - A micro-electro-mechanical transducer (such as a cMUT) is disclosed. The transducer has a base, a spring layer placed over the base, and a mass layer connected to the spring layer through a spring-mass connector. The base includes a first electrode. The spring layer or the mass layer includes a second electrode. The base and the spring layer form a gap therebetween and are connected through a spring anchor. The mass layer provides a substantially independent spring mass contribution to the spring model without affecting the equivalent spring constant. The mass layer also functions as a surface plate interfacing with the medium to improve transducing performance. Fabrication methods to make the same are also disclosed. | 01-21-2010 |
| 20090152980 | Electrostatic Comb Driver Actuator/Transducer and Fabrication of the Same - An electrostatic actuator/transducer has a comb driver and can be adapted for a variety of applications, particularly as a capacitive micromachined ultrasonic transducer. The comb driver has two electrodes each connected to a set of comb fingers. The two sets of comb fingers interdigitate with each other, and in one embodiment each has a saw-toothed shape. One electrode is connected to a spring structure and movable along a vertical direction to engage and disengage the two sets of comb fingers. The movable portion is adapted to perform an actuation function and/or a sense of function. Fabrication methods for making the electrostatic actuator/transducer are also disclosed. | 06-18-2009 |
| 20090141592 | Telemetric Sensing Using Micromachined Ultrasonic Transducer - Implementations of a cMUT have a telemetric antenna operative to telemetrically transmit an output signal generated by the cMUT in reception mode (RX). The cMUT generates the output signal by converting a received energy applied on the cMUT. The received energy may be an acoustic wave or a low-frequency pressure signal. The acoustic wave may be generated by a separate acoustic energy source. The cMUT may form a modulated signal using a carrier signal modulated with the output signal, and telemetrically transmit the modulated signal carrying the output signal to increase efficiency. The antenna may also receive an input signal from outside to telemetrically power on the cMUT. | 06-04-2009 |
| 20090140609 | Micromachined Ultrasonic Transducers - A capacitive micromachined ultrasonic transducer (CMUT) includes a structured membrane which possesses improved frequency response characteristics. Some embodiments provide CMUTs which include a substrate, a first electrode, a second movable electrode, and a structured membrane. The movable second electrode is spaced apart from the first electrode and is coupled to the structured membrane. The structured membrane is shaped to possess a selected resonant frequency or an optimized frequency response. The structured membrane can include a plate and a beam coupled to the plate such that the resonant frequency of the structured membrane is greater than the resonant frequency of the plate. Furthermore, the ratio of the resonant frequency of the structured membrane over the mass of the structured membrane can be greater than the ratio of the resonant frequency of the plate over the mass of the plate. In some embodiments, the CMUT is an embedded spring ESCMUT. | 06-04-2009 |
| 20090140606 | Micro-Electro-Mechanical Transducers - A micro-electro-mechanical transducer (such as a cMUT) is disclosed. The transducer has a substrate, a top plate, and a resilient structure therebetween. The resilient structure has multiple connectors distributed over the device element area to vertically transport the top player with distributed support. The resilient structure may be cantilevers formed using a middle spring layer covering cavities on the substrate. Connectors define a transducing space below the top plate. The resilient structure enables a vertical displacement of the connectors, which transports the top plate in a piston-like motion to change the transducing space and to effectuate energy transformation. No separate cells are necessary for each addressable transducer element. Multiple device elements can be made on the same substrate. | 06-04-2009 |
| 20090048522 | Modulation in Micromachined Ultrasonic Transducers - A capacitive micromachined ultrasonic transducer (cMUT) system uses a modulation technique to increase cMUT sensitivity. An AC carrier signal is applied to the cMUT through a modulation signal port to modulate the signal. The higher frequency of the AC carrier signal carries the real signal to a high frequency range to increase the output current signal level. The real signal is later recovered by demodulation. The technique is applicable in both the reception mode and the transmission mode. | 02-19-2009 |
| 20080290756 | Micro-Electro-Mechanical Transducer Having an Insulation Extension - A micro-electro-mechanical transducer (such as a cMUT) having two electrodes separated by an insulator with an insulation extension is disclosed. The two electrodes define a transducing gap therebetween. The insulator has an insulating support disposed generally between the two electrodes and an insulation extension extending into at least one of two electrodes to increase the effective insulation without having to increase the transducing gap. Methods for fabricating the micro-electro-mechanical transducer are also disclosed. The methods may be used in both conventional membrane-based cMUTs and cMUTs having embedded springs transporting a rigid top plate. | 11-27-2008 |
| 20080203556 | Through-Wafer Interconnection - A through-wafer interconnect and a method for fabricating the same are disclosed. The method starts with a conductive wafer to form a patterned trench by removing material of the conductive wafer. The patterned trench extends in depth from the front side to the backside of the wafer, and has an annular opening generally dividing the conductive wafer into an inner portion and an outer portion whereby the inner portion of the conductive wafer is insulated from the outer portion and serves as a through-wafer conductor. A dielectric material is formed or added into the patterned trench mechanical to support and electrically insulate the through-wafer conductor. Multiple conductors can be formed in an array. | 08-28-2008 |
| 20080197751 | Micro-Electro-Mechanical Transducers - A micro-electro-mechanical transducer (such as a cMUT) is disclosed. The transducer has a substrate, a top plate, and a middle spring layer therebetween. The substrate and the middle spring layer define cavities therebetween sidewalled by standing features. The middle spring layer is anchored by the standing features to create cantilevers over the cavities to enable a vertical displacement of connectors placed on the middle spring layer. The connectors define a transducing space between the middle spring layer and the top plate. The top plate is transported by the vertical displacement of the connectors in a piston-like motion to change the transducing space and to effectuate energy transformation. Various configurations of cantilevers, including single cantilevers, back-to-back double cantilevers and head-to-head double cantilevers (bridges) are possible. | 08-21-2008 |
