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KOKI COMPANY LIMITED
TOKYO, JP
| KOKI COMPANY LIMITED Patent applications | ||
| Patent application number | Title | Published |
|---|---|---|
| 20110274937 | LEAD-FREE SOLDER ALLOY, FATIGUE RESISTANT SOLDERING MATERIALS CONTAINING THE SOLDER ALLOY, AND JOINED PRODUCTS USING THE SOLDERING MATERIALS - [PROBLEMS TO BE SOLVED] To provide a low-silver lead-free solder alloy having an excellent wettability and being excellent in heat-fatigue resistance, and a solder-paste soldering material and resin-flux cored soldering material being excellent in fatigue resistance, and a joined product by using the soldering material. | 11-10-2011 |