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KOH YOUNG TECHNOLOGY INC.

KOH YOUNG TECHNOLOGY INC. Patent applications
Patent application numberTitlePublished
20130077849METHOD FOR INSPECTING MEASUREMENT OBJECT - An inspection method for inspecting a device mounted on a substrate, includes generating a shape template of the device, acquiring height information of each pixel by projecting grating pattern light onto the substrate through a projecting section, generating a contrast map corresponding to the height information of each pixel, and comparing the contrast map with the shape template. Thus, a measurement object may be exactly extracted.03-28-2013
20130039563METHOD OF GENERATING INSPECTION PROGRAM - A method of generating an inspection program that does not have a gerber file is shown. To generate the inspection program, a first image information is acquired by scanning a bare board, a second image information is acquired by scanning a solder-pasted board that solder is pasted on a pad area of the bare board, and by analyzing the first image information and the second image information an inspection program is generated. The first image information and the second image information may include at least one of a two-dimensional image information and a three-dimensional image information. The step for generating an inspection program calculates a difference between the first image information and the second image information, after extracting a position and a size of an area in which the difference occurs, then generates the inspection program by using the extracted information. Therefore, a bare board and a solder-pasted board may be each inspected and the accurate position and size of the solder pasted area may be extracted through analyzing the acquired two-dimensional image information or a three-dimensional image information differences.02-14-2013
20130010102METHOD OF MEASURING MEASUREMENT TARGET - In order to measure a measurement target on a PCB, height information of the PCB is acquired by using a first image photographed by illuminating a grating pattern light onto the PCB. Then, a first area protruding on the PCB by greater than a reference height is determined as the measurement target by using the height information. Thereafter, color information of the PCB is acquired by using a second image photographed by illuminating light onto the PCB. Then, the first color information of the first area determined as the measurement target out of the color information of the PCB is set as reference color information. Thereafter, the reference color information is compared with color information of an area except for the first area to judge whether the measurement target is formed in the area except for the first area. Thus, the measurement target may be accurately measured.01-10-2013
20120287264BOARD INSPECTION APPARATUS - An apparatus for inspecting a board is shown. The board inspection apparatus includes at least one illuminating module, an imaging lens, a first beam splitter, a first camera, and a second camera. The illuminating module provides light to an inspection board and the imaging lens transmits a light reflected from the inspection board. The first beam splitter transmits a portion of the light transmitted from the imaging lens and reflects the rest of the transmitted light. The first camera image-captures by receiving the light that transmits the first beam, and the second camera image-captures by receiving the light reflected from the first beam splitter. Therefore, by using one imaging lens to inspect the inspection board, the decrease in accuracy caused by the different optical axis or magnification may be prevented.11-15-2012
20120130666INSPECTION METHOD - In order to inspect a board, a measurement area is set on a board, and reference data and measurement data of the measurement area are acquired. Then, a conversion condition is established for the measurement area, and a conversion relation is acquired according to a distortion degree between reference data and measurement data. Thereafter, validity of the conversion relation is verified by using at least one of verifying that a comparison feature object satisfies the conversion relation, verifying that a verification feature object selected from feature objects satisfies the conversion relation and verifying that a pad formed on the board satisfies the conversion relation. Then, the conversion condition is confirmed, and an inspection area for inspecting a measurement target is set according to the confirmed conversion condition. Thus, an inspection area may be correctly set so that distortion is compensated for.05-24-2012
20120128232METHOD FOR DETECTING A BRIDGE CONNECTING FAILURE - A method for detecting a bridge connecting failure to detect a bridge shorting terminals of a component includes acquiring a 2D image and height-based information through lights irradiated on a board, acquiring rotation information of the component using at least one of the 2D image and the height-based information, establishing an inspection region for detection of the bridge connecting failure using the rotation information, extracting a first bridge region within the inspection region using the 2D image, extracting a second bridge region within the inspection region using the height-based information, and judging whether the bridge connecting failure of the component occurs by using at least one of the first and second bridge regions. Thus, the method may inspect more precisely the bridge connecting failure through the first bridge region extracted from the 2D image and the second bridge region extracted from the height-based information.05-24-2012
20120128231INSPECTION METHOD - In order to inspect a board, firstly, a measurement area is set on a board, and reference data and measurement data of the measurement area are acquired. Then, a plurality of feature blocks is established by a block unit so as to include a predetermined shape in the measurement area, and a merged block is established by merging feature blocks overlapped in the feature blocks. Thereafter, a distortion degree is acquired by comparing reference data and measurement data corresponding to a feature block except for the merged block and/or the merged block, and the distortion degree is compensated for, to set an inspection area in the target measurement area. Thus, an inspection area, in which distortion is compensated for, may be correctly set.05-24-2012
20120127486METHOD OF INSPECTING A SUBSTRATE - A method of inspecting a substrate is disclosed. The method of inspecting a substrate, comprises: obtaining phase data per projecting part with regard to a substrate, by projecting pattern beam onto the substrate having a target object formed thereon through a plurality of projecting parts in sequence; obtaining height data per projecting part with regard to the substrate by using the phase data per the projecting part; compensating tilt of the height data by using the height data per projecting part; modifying the tilt-compensated height data per projecting part; and obtaining integrated height data by using the modified height data.05-24-2012
20120127463INSPECTION APPARATUS - An inspection apparatus includes a work stage part, an optical module, and an optical module moving part. The work stage part receives a board. The work stage part includes work stages disposed in parallel. The optical module includes a projecting part disposed over the board, an image capturing part disposed at a side portion of the projecting part to receive the grating pattern light and capture a reflection image, and an optical path changing part changing a path of the grating pattern light and guiding the grating pattern light to the image capturing part so that the grating pattern light is downwardly incident into the image capturing part. The optical module moving part is disposed over and coupled to the optical module to move the optical module. Thus, time may be reduced and a space may be secured, required for inspecting a board.05-24-2012
20120127461METHOD OF INSPECTING A SUBSTRATE - A method of inspecting a substrate is disclosed. The method of inspecting a substrate, comprises: obtaining phase data per projecting part with regard to a substrate, by projecting pattern beam onto the substrate having a target object formed thereon through a plurality of projecting parts in sequence; obtaining height data per projecting part with regard to the substrate by using the phase data per the projecting part; setting up a projecting part with highest reliability in the a plurality of projecting parts to be a reference projecting part; modifying height data of remaining projecting part, referenced by height data of the reference projecting part; and obtaining integrated height data by using the modified height data.05-24-2012
20120127305METHOD AND APPARATUS OF PROFILING A SURFACE - A method and an apparatus of profiling a surface are disclosed. The method comprises projecting slit pattern light toward a target object in at least two directions in sequence to obtain pattern images reflected on the target object, obtaining heights by using the pattern images according to the directions, obtaining vector fields showing a direction of maximum variation of height, obtaining confidence indexes of the heights corresponding to the at least two directions, obtaining integrated vector fields by using the confidence indexes and the vector fields, and calculating height of each position of the target object by using the integrated vector fields. Therefore, accuracy is enhanced.05-24-2012
20120123719INSPECTION METHOD - In order to set an inspection area in an inspection apparatus for inspecting a board, a plurality of measurement areas are set on a board, and then reference data and measurement data of at least one adjacent measurement area that is adjacent to a target measurement area for inspecting a measurement target, among the measurement areas, are acquired. Thereafter, at least one feature object is extracted from the adjacent measurement area. Then, a distortion degree is acquired by comparing reference data and measurement data corresponding to the feature object with each other, and thereafter the distortion degree is compensated for, to set an inspection area in the target measurement area. Thus, a conversion relation between the reference data and the measurement data may be correctly acquired, and an inspection area, in which distortion is compensated for, may be correctly set.05-17-2012
20120120414METHOD OF INSPECTING BOARD - A method of establishing a tip location of a terminal includes establishing a virtual tip line by measuring a height of a board, on which a component having a terminal and a body is mounted, and comparing the measured measurement height with a predetermined reference height, establishing a central line with respect to a width direction of the terminal along a longitudinal direction of the terminal, and establishing a tip location of the terminal by using the measurement height along the central line from an intersection point of the virtual tip line and the central line. Thus, a tip location of a terminal may be more correctly acquired.05-17-2012
20110255771METHOD OF DISCRIMINATING BETWEEN AN OBJECT REGION AND A GROUND REGION AND METHOD OF MEASURING THREE DIMENSIONAL SHAPE BY USING THE SAME - A method of discriminating a region and a method of measuring a three dimensional shape are disclosed. The method includes irradiating light onto a substrate having a measurement target formed thereon to capture an image by receiving light reflected by the substrate, setting up an object region in which the measurement target is disposed and a ground region corresponding to a remaining region in an inspection region of the image, irradiating a grating patterned light onto the substrate having the measurement target formed thereon to capture a patterned image by receiving the grating patterned light reflected by the substrate, and obtaining height of each position in the inspection region by using the patterned image to establish a ground height with respect to the measurement target with a height of the ground region.10-20-2011
20110254949METHOD OF CHECKING AN INSPECTION APPARATUS AND METHOD OF ESTABLISHING A MEASUREMENT VARIABLE OF THE INSPECTION APPARATUS - In order to establish a lighting intensity of an inspection apparatus, an inspection board is installed in an inspection apparatus. Then, a width of a histogram of a captured image acquired through a camera of the inspection apparatus is adjusted to avoid from a dark region and a bright region. Thereafter, a lighting intensity of the inspection apparatus is adjusted by adjusting the histogram to be near a middle of a graph. Thus, a setting time of an inspection condition stored in a job file may be reduced to increase the user's convenience, and measurement error due to mis-establishment may be reduced to enhance inspection precision.10-20-2011
20110191050METHOD OF INSPECTING A THREE DIMENSIONAL SHAPE - In order to inspect a three dimensional shape, a predetermined inspection target component formed on a board is selected as the measurement target, a shape of the inspection target component is acquired, a reference point of the inspection target component is detected, relative location information of a polarity mark formed on the inspection target component with respect to the reference point is acquired, and it is judged whether the inspection target component is good or bad by checking whether the polarity mark exists or not by using the relative location information with respect to the reference point. Thus, the location of the polarity mark may be accurately known, and polarity inspection may be more easily and accurately performed.08-04-2011
201100581813D IMAGE MEASURING APPARATUS AND METHOD THEREOF - A 3D measuring apparatus includes a stage, a projection portion, and an imaging portion. The projection portion includes first and second lights, first and second lattices, and first and second projection lenses. The imaging portion includes an imaging lens and a camera. The projection portion further includes a movement instrument which control the first and the second lattice simultaneously with predetermined n times.03-10-2011
20110050893APPARATUS AND METHOD FOR MEASURING A THREE-DIMENSIONAL SHAPE - Provided are an apparatus and a method for measuring a three dimensional shape with improved accuracy. The apparatus includes a stage, at least one lighting unit, a plurality of image pickup units and a control unit. The stage supports an object to be measured. The lighting unit includes a light source and a grid, and radiates grid-patterned light to the object to be measured. The image pickup units capture, in different directions, grid images reflected from the object to be measured. The control unit calculates a three dimensional shape of the object from the grid images captured by the image pickup units. The present invention has advantages in capturing grid images through a main image pickup portion and sub-image pickup portions, enabling the measurement of the three dimensional shape of the object in a rapid and accurate manner.03-03-2011
20110002529METHOD FOR INSPECTING MEASUREMENT OBJECT - An inspection method for inspecting a device mounted on a substrate, includes generating a shape template of the device, acquiring height information of each pixel by projecting grating pattern light onto the substrate through a projecting section, generating a contrast map corresponding to the height information of each pixel, and comparing the contrast map with the shape template. Thus, a measurement object may be exactly extracted.01-06-2011
20110002527BOARD INSPECTION APPARATUS AND METHOD - An inspection method includes photographing a measurement target to acquire image data for each pixel of the measurement target, acquiring height data for each pixel of the measurement target, acquiring visibility data for each pixel of the measurement target, multiplying the acquired image data by at least one of the height data and the visibility data for each pixel to produce a result value, and setting a terminal area by using the produced result value. Thus, the terminal area may be accurately determined.01-06-2011
20110001818THREE DIMENSIONAL SHAPE MEASUREMENT APPARATUS - A three dimensional shape measurement apparatus includes an illumination section and a grating transfer unit. The illumination section includes a light source unit generating a light and a grating unit changing the light generated by the light source unit into a grating pattern light having a grating pattern. The illumination section illuminates the grating pattern light onto a measurement target in a predetermined direction. The grating transfer unit transfers the grating unit in a predetermined inclination direction with respect to an extension direction of the grating pattern and an arrangement direction of the grating pattern. Thus, manufacturing cost may be reduced, and the three dimensional shape measurement apparatus may be easily managed.01-06-2011
20100302364THREE DIMENSIONAL SHAPE MEASUREMENT APPARATUS AND METHOD - A three dimensional shape measurement apparatus includes m projecting sections, each of which includes a light source and a grating element, and, while moving the grating element by n times, projects a grating pattern light onto a measurement target for each movement, wherein the ‘n’ and the ‘m’ are natural numbers greater than or equal to 2, an imaging section photographing a grating pattern image reflected by the measurement target, and a control section controlling that, while photographing the grating pattern image by using one of the m projecting sections, a grating element of at least another projecting section is moved. Thus, measurement time may be reduced.12-02-2010
20100295941SHAPE MEASUREMENT APPARATUS AND METHOD - A shape measurement apparatus includes a work stage supporting a target substrate, a pattern-projecting section including a light source, a grating part partially transmitting and blocking light generated by the light source to generate a grating image and a projecting lens part making the grating image on a measurement target of the target substrate, an image-capturing section capturing the grating image reflected by the measurement target of the target substrate, and a control section controlling the work stage, the pattern-projecting section and the image-capturing section, calculating a reliability index of the grating image and phases of the grating image, which is corresponding to the measurement target, and inspecting the measurement target by using the reliability index and the phases. Thus, the accuracy of measurement may be enhanced.11-25-2010
20100290696METHOD OF MEASURING MEASUREMENT TARGET - In order to measure a measurement target on a PCB, height information of the PCB is acquired by using a first image photographed by illuminating a grating pattern light onto the PCB. Then, a first area protruding on the PCB by greater than a reference height is determined as the measurement target by using the height information. Thereafter, color information of the PCB is acquired by using a second image photographed by illuminating light onto the PCB. Then, the first color information of the first area determined as the measurement target out of the color information of the PCB is set as reference color information. Thereafter, the reference color information is compared with color information of an area except for the first area to judge whether the measurement target is formed in the area except for the first area. Thus, the measurement target may be accurately measured.11-18-2010
20100275687HOUSING FOR A MEASURING EQUIPMENT AND MEASURING EQUIPMENT HAVING THE SAME - A housing for a measuring equipment receiving a measurement apparatus includes a body, a predetermined area of which is open, a first door combined with the body to cover at least a portion of the open predetermined area of the body, and a second door combined with the body to cover at least a portion of the open predetermined area of the body. A display unit is installed on the second door to be rotated from a first face toward a second face. Thus, a space required to install the display unit may be reduced, and a viewing scope of the display unit may be increased.11-04-2010
20100246931INSPECTION METHOD - In order to set an inspection area, a measurement target is disposed onto a stage, a reference data of the measurement target is summoned, and a measurement data of the measurement target is acquired. Then, at least one feature object is selected in the measurement data and the reference data of the measurement target, and at least one feature variable for the selected feature object is extracted from each of the reference data and the measurement data. Thereafter, a change amount of the measurement target is produced by using the feature variable and a quantified conversion formula, and the produced change amount is compensated for to set an inspection area. Thus, the distortion of the measurement target is compensated for to correctly set an inspection area.09-30-2010
20100092041METHOD OF MEASURING A THREE-DIMENSIONAL SHAPE - In order to measure a three-dimensional shape, feature information is read from a database. A board is transferred to a measurement position. A measurement head is transferred to an inspection area of the board. Light of a first lighting device for three-dimensional measurement and light of a second lighting device for two-dimensional measurement is illuminated onto the inspection area to photograph a first reflection image and a second reflection image that are reflected from the inspection area. The inspection area is realigned by comparing the feature information with at least one of the photographed first and second reflection images to inspect distortion of the inspection area. The realigned inspection area is inspected. Thus, the three-dimensional shape may be precisely measured.04-15-2010
20100091302APPARATUS AND METHOD FOR MEASURING THREE-DIMENSIONAL SHAPE BY USING MULTI-WAVELENGTH - An apparatus and a method for measuring a three-dimensional shape are disclosed. The apparatus includes a transfer stage, a first projector, a second projector, a camera unit and a control unit. The transfer stage transfers a measurement object to a measurement position. The first projector irradiates a first pattern light having a first equivalent wavelength toward the measurement object in a first direction. The second projector irradiates a second pattern light having a second equivalent wavelength that is different from the first equivalent wavelength toward the measurement object in a second direction. The camera unit takes a first pattern image that is generated when the first pattern light is reflected by the measurement object, and a second pattern image that is generated when the second pattern light is reflected by the measurement object. The control unit controls the first projector and the second projector, and obtains a three-dimensional shape of the measurement object through the first pattern image and the second pattern image.04-15-2010
20090051929THREE-DIMENSIONAL IMAGE MEASURING APPARATUS - The present invention relates to a three-dimensional image measuring apparatus comprising: an XYZ shaft transfer means mounted onto a base member; a work stage mounted to the base member, for moving a measuring object to a measuring position and thereafter supporting it and having a predetermined reference surface set at a side thereof; an image obtaining means in which it is moved toward X,Y and Z shafts by the XYZ shaft transfer means, scans a grating image by the frequency of N times to a side of the measuring object supported and fixed to the work stage, obtains the changed grating image by the measuring object by N times; a light emitting means mounted to a side of the image obtaining means for generating and emitting light with a predetermined wavelength; and a control unit which irradiates light generated from the light emitting means mounted to a side of the image obtaining means to the reference surface set the side of the work stage, receives the changed grating image obtained from the image obtaining means, thereby producing the three-dimensional image.02-26-2009

Patent applications by KOH YOUNG TECHNOLOGY INC.