| KOA CORPORATION Patent applications |
| Patent application number | Title | Published |
|---|
| 20110128107 | CHIP INDUCTOR AND MANUFACTURING METHOD THEREOF - To provide a chip inductor, which can make magnetic loss of the inductor element reduced, excellent in electrical property such as high Q etc., and high reliability, which is demanded for use in vehicles. The chip inductor comprises a ferrite core ( | 06-02-2011 |
| 20100328021 | RESISTOR DEVICE - The resistor device is provided with a resistive plate ( | 12-30-2010 |
| 20100072898 | LED DRIVING CIRCUIT - An LED driving circuit is provided for making it possible to economically drive a serially connected LED circuit by means of a switching device with a relatively low withstanding voltage even if the number of serially connected LED devices increases. In an LED driving circuit provided with a serially connected LED circuit ( | 03-25-2010 |
| 20090322468 | Chip Resistor and Manufacturing Method Thereof - [Problem] To provide a chip resistor and a method for manufacturing thereof, the chip resistor keeping easily soldering strength even if mounted in a horizontal position, and never projects from a holding recess of a positioning jig in a mounting process, and further does not hinder miniaturization thereof from being promoted, while keeping a good appearance thereof. | 12-31-2009 |
| 20090134967 | RESISTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - To provide a glazed metal film resistor device excellent in TCR characteristics with using an economical base body containing glass by reducing affection to TCR characteristics caused by glass contained in the base body. The resistor device comprises base body | 05-28-2009 |
| 20090115569 | Chip Resistor - [Problem] To provide a chip resistor that is unlikely to suffer from mounting failure and capable of readily lowering its resistance. | 05-07-2009 |
| 20090108986 | Chip Resistor - [Problem] To provide a chip resistor that readily lowers its resistance and exhibits excellent manufacturing yield. | 04-30-2009 |
| 20080311360 | Thick film circuit component and method for manufacturing the same - A thick film circuit component has a thick film electrode interconnect which allows an electrode on a semiconductor chip and an aluminum wire to be directly bonded to each other with a sufficient bonding strength. The thick film circuit component has an insulated substrate | 12-18-2008 |
