| KINIK COMPANY Patent applications |
| Patent application number | Title | Published |
|---|
| 20110011628 | HIGHLY THERMAL CONDUCTIVE CIRCUIT BOARD - A highly thermal conductive circuit board includes a composite substrate, and a metal layer, an insulating layer, and a conductor layer sequentially disposed on the composite substrate. When at least one electronic element is electrically disposed on the conductor layer of the highly thermal conductive circuit board, heat produced by the electronic element in operation is rapidly dissipated through characteristics such as a high thermal conductivity and a low thermal expansion coefficient of the highly thermal conductive circuit board. | 01-20-2011 |
| 20110000355 | Multi-Bandsaw Machine - A multi-bandsaw machine includes several bandsaws, for cutting a material into a plurality of plates in a single process. At least one side edge of each bandsaw has a plurality of diamond grits, and the bandsaws rotate in a single direction on the multi-bandsaw machine, so as to cut the material with the diamond grits and form a cutting notch on the material. The cutting notch has a depth to kerf ratio at least larger than 100:1 during the process of cutting the material with the diamond grits in each hour. | 01-06-2011 |
| 20100242544 | OPTICAL LENS FORMING MOLD - An optical lens forming mold is adapted to press and form a glass preform into an optical lens. The forming mold includes a sleeve, a lower mold core, and an upper mold core. The upper mold core and the lower mold core are disposed within the sleeve opposite to each other, and the glass preform is disposed between the upper mold core and the lower mold core. At least one edge of the upper mold core and the lower mold core is surroundingly arrangement with a baffle. The glass preform is pressed and formed into an optical lens by the upper mold core and the lower mold core, and a shape of the optical lens to be formed is controlled by the battle. | 09-30-2010 |
| 20100186887 | DIES FOR MANUFATURING DIAMOND DISCS - A diamond disc manufacturing process includes the following steps. Firstly, a container is provided, and an adhesion layer is formed in the container. A hollow member having a plurality of meshes is covered on the adhesion layer. A plurality of diamond particles is implanted on the hollow member and embedded into the meshes of the hollow member, so that the diamond particles are adhered onto the adhesion layer. Then, a resin material is infused into the container, so that the diamond particles are bonded on the resin material. Finally, the resin material together with the diamond particles is released from the container, so as to obtain a diamond disc base with the diamond particles having uniform distribution and orientation. | 07-29-2010 |
| 20100177409 | OPTICAL ELEMENT AND MANUFACTURING METHOD THEREOF - An optical element and a manufacturing method thereof are described. An optical material is pressed in a holder through a mold, so as to form an optical element with an optical lens embedded in the holder. A groove in the holder has a guiding face, and the guiding face is obliquely disposed in a direction towards a mirror with a relatively smaller radius of curvature of the optical lens, so as to guide the optical material to truly enter the groove, thereby enhancing gas tightness and precision between the optical lens and the holder. | 07-15-2010 |
| 20100022174 | Grinding tool and method for fabricating the same - The present invention relates to a grinding tool and a method for fabricating the same. The method comprises: (A) providing a grinding plate having a working surface and a non-working surface, a mold having an adjustment surface, and a backplane; (B) getting the working surface of the grinding plate to fit precisely and be retained on the adjustment surface of the mold by a binder; (C) forming an adhesive layer on the non-working surface of the grinding plate; (D) disposing the backplane on a surface of the adhesive layer to retain the backplane over the non-working surface of the grinding plate by the adhesive layer; and (E) removing the binder to separate the mold from the grinding plate. Accordingly, the present invention can significantly improve the precision and lifetime of products, reduce the cost of production, and enhance the machining efficiency. | 01-28-2010 |
| 20100000389 | Cutter wheel with surface modification and method for manufacturing the same - A cutter wheel is disclosed, which comprises a cutter wheel body, a cutting unit, and a solder layer. The cutter wheel body consists of the first substrate and the second substrate, wherein each substrate has an inner surface and an outer surface. The inner surface of the first substrate is treated with surface modification. The cutting unit can be formed on a rough surface. The solder layer is formed between the cutting unit and the second substrate. The present invention also provides a method for manufacturing the cutter wheel as mentioned above. | 01-07-2010 |
| 20090266599 | Circuit board with high thermal conductivity and method for manufacturing the same - A circuit board having high thermal conductivity comprises a substrate, a plurality of thermal conductive insulating layers, a patterned electrical conductive layer, a plurality of through-holes and a soldering layer. The substrate has an upper surface and a lower surface; the thermal conductive insulating layers are respectively formed on the upper surface and the lower surface of the substrate. The patterned electrical conductive layer is disposed on the surfaces of the thermal conductive insulating layers. The plurality of through-holes are extended through the substrate and electrically connected to the patterned electrical conductive layer, and the soldering layer is partially formed on the patterned electric conductive layer. The present invention also discloses a method for manufacturing the circuit board as above-mentioned. | 10-29-2009 |
| 20090250248 | Support substrate structure for supporting electronic component thereon and method for fabricating the same - A support substrate structure for supporting an electronic component thereon comprises a thermal conductive substrate, a first ceramic layer, an insulating thermal conductive layer and a conductive pattern. The thermal conductive substrate has an upper surface and a lower surface; the first ceramic layer is disposed on the upper surface of the thermal conductive substrate; the insulating thermal conductive layer is disposed on the first ceramic layer; and the conductive pattern is formed on a surface of the insulating thermal conductive layer. The present invention also discloses a method for fabricating the aforementioned support substrate structure. | 10-08-2009 |
| 20090085180 | Packaging carrier with high heat dissipation and method for manufacturing the same - The present invention relates a packaging carrier with high heat dissipation for packaging a chip, comprising: a carrier body, an interfacial metal layer, at least one diamond-like carbon thin film, a plated layer, and an electrode layer. Herein, the packaging carrier further comprises through holes. The present invention further discloses a method for manufacturing the aforementioned packaging carrier, comprising: providing a carrier body; forming an interfacial metal layer on the upper surface of the carrier body; forming a diamond-like carbon thin film on the interfacial metal layer; forming a plated layer on the diamond-like carbon thin film; forming an electrode layer on the lower surface of the carrier body; and forming through holes extending through all or part of the aforementioned elements. The present invention uses a diamond-like carbon thin film and through holes for heat dissipation in three dimensions to improve heat dissipation of an electronic device. | 04-02-2009 |
| 20090019782 | ABRASIVE TOOL HAVING SPRAY-FORMED BRAZING FILLER LAYER AND MANUFACTURING PROCESS THEREOF - An abrasive tool having a spray-formed brazing filler layer and a manufacturing process thereof are described, in which drawing and adhering steps performed on a conventional brazing filler layer are simplified through spraying. A solvent, an adhesive, and a powder are sequentially mixed to form a brazing filler slurry; next, the brazing filler is sprayed on a substrate, so as to form a brazing filler layer with an appropriate thickness; and then, abrasive particles are adhered to the brazing filler layer, and then the abrasive particles are combined with the substrate through the brazing filler layer by brazing. The conventional drawing and adhering steps are omitted through spraying, and it is applicable for substrates with complicated shapes. | 01-22-2009 |
| 20080209817 | Diamond polishing disc process - A diamond polishing disc process includes the following steps. First, an adhesive material is coated on outer sides of the woven layer with a plurality of meshes, so as to form an adhesive layer. Next, the adhesive layer is adhered in an accommodation unit. Afterwards, pluralities of diamond particles are implanted in the adhesive layer, and are respectively adhered in each mesh of the adhesive layer. Then, a polymer material is filled into the accommodation unit, so as to fix the diamond particles to the polymer material. Finally, cure the polymer material, and remove it with the diamond particles from the accommodation unit, thus obtaining a diamond polishing disc base with the diamond particles arranged uniformly and having consistent in orientations. | 09-04-2008 |
