Inventors list |
Assignees list |
Classification tree browser |
Top 100 Inventors |
Top 100 Assignees |
KINGBRIGHT ELECTRONICS CO., LTD.
| KINGBRIGHT ELECTRONICS CO., LTD. Patent applications | ||
| Patent application number | Title | Published |
|---|---|---|
| 20110103038 | WHITE LED DEVICE - An improved white LED device comprises at least one first LED component, at least one second LED component, and at least one translucent member. The first LED component emits a blue light having a peak wavelength of 440-470 nm; the second LED component emits a red light having the peak wavelength of 600-630 nm; and the translucent member contains at least one fluorescent substance scattered throughout the translucent member. The fluorescent substance is able to absorb some of the blue light, and emits yellow green light having the peak wavelength of 500-570 nm, wherein when the blue light and yellow green light are mixed, the CIE 1931 chromaticity diagram is represented by a polygon with color coordinates (0.20,0.50), (0.20,0.30), (0.29,0.30), and (0.40,0.50), furthermore, after mixing the red light, the blue light, and the yellow green light, the improved white LED device emits a white light with high color rendering, and a color temperature of the white light ranges between 2500-7000 K. | 05-05-2011 |
| 20100079968 | UPRIGHT CIRCUIT BOARD ASSEMBLY STRUCTURE - An improved upright circuit board assembly structure includes: an electronic component to be mounted on an external device so as for electrical functions of the electronic component to be used; and at least one circuit board including at least one first electrical connection portion and at least one second electrical connection portion. The first electrical connection portion and the second electrical connection portion are coupled to the external device by soldering with a solder paste. By soldering the circuit board to the external device in a double-sided, multi-point manner, the electronic component is mounted securely on the external device, and electric connection between the electronic component and the external device is enhanced. | 04-01-2010 |
