Keng-Hung Lin
Hsinchu County, TW
Keng-Hung Lin Patent applications | ||
Patent application number | Title | Published |
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20130329374 | Pre-molded Cavity 3D Packaging Module with Layout - A pre-molded cavity 3D packaging module with layout is disclosed. The 3D packaging module includes a pre-molded cavity. A wall and a vertical plane of the pre-molded cavity form an inclined angle of more than 3°. An intersecting region between a bottom and a sidewall of the 3D packaging module has a curved profile to facilitate smooth circuit layout. | 12-12-2013 |