| Kemet Electronics Corporation Patent applications |
| Patent application number | Title | Published |
|---|
| 20120110808 | CAPACITOR REFORMATION METHOD AND APPARATUS - A method of reforming a wet-tantalum capacitor includes providing a medical device comprising a wet-tantalum capacitor. The capacitor has a rated voltage and including a hydrated anodic deposit. The method further includes charging the capacitor to a voltage that is less than approximately seventy-five percent of the rated voltage and at least partially discharging the capacitor after the charging step. The charging step is performed at a sufficient voltage to dehydrate the anodic deposit while not significantly decreasing the service life of the capacitor. | 05-10-2012 |
| 20120106032 | SUBSTRATE WITH EMBEDDED PATTERNED CAPACITANCE - A process for forming a laminate with capacitance and the laminate formed thereby. The process includes the steps of providing a substrate and laminating a conductive foil on the substrate wherein the foil has a dielectric. A conductive layer is formed on the dielectric. The conductive foil is treated to electrically isolate a region of conductive foil containing the conductive layer from additional conductive foil. A cathodic conductive couple is made between the conductive layer and a cathode trace and an anodic conductive couple is made between the conductive foil and an anode trace. | 05-03-2012 |
| 20120081870 | ELECTRONIC PASSIVE DEVICE - A capacitive interposer, electronic package having the capacitive interposer and electronic device with the electronic package is described. The interposer has a first planar face and a second planar face. An array of upper connections is on the first planar face and opposing lower connections are on the second planar face with conduction paths between each upper connection of the upper connections and a lower connection of the lower connections. At least one power feed-through capacitor is provided. The capacitor is mounted on the first planar face with the first external termination in direct electrical contact with a first upper connection and the second external termination is in direct electrical contact with a second upper connection. At least one upper connection, first external termination and second external termination are arranged for direct electrical contact with element contact pads of a common element. | 04-05-2012 |
| 20120081834 | CONCENTRATED CAPACITOR ASSEMBLY - A capacitor assembly with a substrate having a first face and a second face. A multiplicity of capacitors are mounted on the first face wherein each capacitor has a first lead and a second lead of opposite polarity to the first lead. A bridge is in electrical contact with multiple first leads. A tree is in electrical contact with the bridge wherein the tree passes through a via of the substrate and is in electrical contact with a first trace of the second face. A second trace is on the second face wherein the second lead is in electrical contact with the second trace. | 04-05-2012 |
| 20120079693 | EXTERNALLY FUSED AND RESISTIVELY LOADED SAFETY CAPACITOR - A capacitor with a combined with a resistor and/or fuse is described. This safe capacitor can rapidly discharge through the resistor when shorted. The presence of a fuse in series with the capacitor and results in a resistive failure when this opens during and overcurrent condition. Furthermore, the presence of a resistor in parallel to the capacitor allows the energy to be rapidly dissipated when a failure occurs. | 04-05-2012 |
| 20120069493 | SOLID ELECTROLYTIC CAPACITOR AND METHOD OF MANUFACTURING A SOLID ELECTROLYTIC CAPACITOR - Provided is a method for forming a capacitor. The method includes: providing an anode with a dielectric thereon and a conductive node in electrical contact with the anode;
| 03-22-2012 |
| 20120063063 | PROCESS FOR SOLID ELECTROLYTIC CAPACITORS USING POLYMER SLURRIES - A process for forming a solid electrolytic capacitor and an electrolytic capacitor formed by the process. The process includes: providing an anode wherein the anode comprises a porous body and an anode wire extending from the porous body; apply a thin polymer layer onto the dielectric, and | 03-15-2012 |
| 20120054994 | SOLID ELECTROLYTICAL CAPACITORS WITH IMPROVED ESR STABILITY - An improved capacitor, and method for making the capacitor, is described. The capacitor has an anode and a dielectric on the anode. A cathode layer is on the dielectric wherein the cathode layer comprises at least one conductive layer and an insulative adhesion enhancing layer. | 03-08-2012 |
| 20120019979 | OFFSET RISER WIRE - An anode with a pellet wherein the pellet has a bottom surface. The anode further also has an anode wire with a primary axis and extending beyond the pellet along the primary axis wherein the anode wire has a cross-section perpendicular to the primary axis wherein the cross-section of the anode wire breaches the bottom surface. | 01-26-2012 |
| 20110292572 | METHOD OF IMPROVING ELECTROMECHANICAL INTEGRITY OF CATHODE COATING TO CATHODE TERMINATION INTERFACES IN SOLID ELECTROLYTIC CAPACITORS - A solid electrolytic capacitor with an anode and a dielectric on the anode. A cathode is on the dielectric and a conductive coating on said dielectric. A cathode lead is electrically connected to the conductive coating by an adhesive selected from the group consisting of a transient liquid phase sinterable material and polymer solder. | 12-01-2011 |
| 20110292567 | ELECTRONIC COMPONENT TERMINATION AND ASSEMBLY BY MEANS OF TRANSIENT LIQUID PHASE SINTERING AND POLYMER SOLDER PASTES - A capacitor has first planer internal electrodes in electrical contact with a first external termination. Second planer internal electrodes are interleaved with the first planer internal electrodes wherein the second planer internal electrodes are in electrical contact with a second external termination. A dielectric is between the first planer internal electrodes and the second planer internal electrodes and at least one of the external terminations comprises a material selected from a polymer solder and a transient liquid phase sintering adhesive. | 12-01-2011 |
| 20110265299 | CAPACITOR WITH SACRIFICIAL LEAD WIRE CONFIGURATION AND IMPROVED MANUFACTURING METHOD THEREOF - The capacitor has a monolithic anode and at least one anode lead wire extending from the anode. At least one sacrificial lead wire extends from the anode. A dielectric layer is on said anode and a cathode layer is on the dielectric layer. The anode lead wire is in electrical contact with the anode and a cathode lead is in electrical contact with the cathode. | 11-03-2011 |
| 20110252614 | CAPACITOR COMPRISING FLEX CRACK MITIGATION VOIDS - A ceramic multilayer surface-mount capacitor with inherent crack mitigation void patterning to channel flex cracks into a safe zone, thereby negating any electrical failures. | 10-20-2011 |
| 20110252613 | HIGH VOLTAGE AND HIGH EFFICIENCY POLYMER ELECTROLYTIC CAPACITORS - A capacitor, and method of making a capacitor, is provided wherein the capacitor has exceptionally high break down voltage. The capacitor has a tantalum anode with an anode wire attached there to. A dielectric film is on the tantalum anode. A conductive polymer is on the dielectric film. An anode lead is in electrical contact with the anode wire. A cathode lead is in electrical contact with the conductive polymer and the capacitor has a break down voltage of at least 60 V. | 10-20-2011 |
| 20110002082 | HIGH CAPACITANCE MULTILAYER WITH HIGH VOLTAGE CAPABILITY - New designs for multilayer ceramic capacitors are described with high voltage capability without the need of coating the part to resist surface arc-over. One design combines a high overlap area for higher capacitance whilst retaining a high voltage capability. A variation of this design has increased voltage capability over this design as well as another described in the prior art although overlap area and subsequently capacitance is lowered in this case. These designs are compared to the prior art in examples below. | 01-06-2011 |
| 20080244885 | METHOD FOR FORMING A CAPACITOR HAVING A COPPER ELECTRODE AND A HIGH SURFACE AREA ALUMINUM INNER LAYER - High capacitance value capacitors are formed using bimetal foils of an aluminum layer attached to a copper layer. The copper side of a bimetallic copper/aluminum foil or a monometallic aluminum foil is temporarily protected using aluminum or other materials, to form a sandwich. The exposed aluminum is treated to increase the surface area of the aluminum by at least one order of magnitude, while not attacking any portion of the protected metal. When the sandwich is separated, the treated bimetal foil is formed into a capacitor, where the copper layer is one electrode of the capacitor and the treated aluminum layer is in intimate contact with a dielectric layer of the capacitor. | 10-09-2008 |
| 20080229565 | METHOD OF PRODUCING A CAPACITOR - A method of making an electrolytic capacitor includes providing a first electrode that includes a metal substrate, a carbide layer, and a carbonaceous material. The metal substrate includes a metal selected from the group consisting of titanium, aluminum, tantalum, niobium, zirconium, silver, steel, and alloys and combinations thereof. The method further includes providing a second electrode and an electrolyte. | 09-25-2008 |
