| KELK LTD. Patent applications |
| Patent application number | Title | Published |
| 20110315985 | SENSOR-FITTED SUBSTRATE AND METHOD FOR PRODUCING SENSOR-FITTED SUBSTRATE - A sensor-fitted substrate allowing a sensor-fitted wafer for measuring the temperature or strain to be produced inexpensively, moreover, allowing measurements of the temperature or strain to be carried out with satisfactory accuracy, and a method for producing such a sensor-fitted substrate. An undercoat film is formed on the surface of a substrate, the film being configured, compared to when no undercoat film is formed, to allow the strength of close contact of a dispersed nano-particle ink with the substrate to be increased, the diffusion of the dispersed nano-particle ink into the substrate to be suppressed, and the growth of metal crystal particles contained in the dispersed nano-particle ink to be suppressed. A wiring pattern of the sensor is traced on the surface of the undercoat film of the substrate surface by using the dispersed nano-particle ink, and the dispersed nano-particle ink is baked and metalized. | 12-29-2011 |
| 20110283715 | TEMPERATURE ADJUSTMENT APPARATUS - A temperature adjustment apparatus suppresses decline in temperature adjustment performance by avoiding even partial impairment of the function of a thermoelectric module in respective zones, which is accomplished due to the presence of terminals. A terminal is provided via an electrode extension section on a heat exchange plate side electrode of the thermoelectric module of inner zones apart from an outermost zone, of four zones. The electrode extension section is disposed at a position which is sandwiched between adjacent thermoelectric elements and over which a temperature adjustment side electrode spans. The terminals are disposed outside the thermoelectric module in the outermost zone. | 11-24-2011 |
| 20110277983 | TEMPERATURE CONTROLLER, FLUID CIRCULATOR AND TEMPERATURE CONTROL METHOD USING TEMPERATURE CONTROLLER - A temperature controller includes: a closed first circulation circuit having a fluid cooler; a closed second circulation circuit having a halogen lamp heater as a fluid heater and feeding a thermal fluid heated by the halogen lamp heater to a vacuum chamber as an object to be temperature-controlled; a feed path that feeds the thermal fluid from the first circulation circuit to the second circulation circuit; and a discharge path that discharges the thermal fluid from the second circulation circuit and returns the thermal fluid to the first circulation circuit. A flow-rate control valve that adjusts and controls a feed flow-rate of the thermal fluid from the first circulation circuit is provided in the feed path. A pressure control valve that compensates a pressure of the thermal fluid at a predetermined pressure level or less is provided in the discharge path. | 11-17-2011 |
| 20110066294 | APPARATUS AND METHOD FOR CONTROLLING TEMPERATURE OF SEMICONDUCTOR WAFERS - A manufacturing time of a semiconductor device is shortened by raising and dropping a base temperature of a semiconductor wafer such as silicon wafer to a target temperature at a high speed, a semiconductor device is manufactured with high qualities by making an in-plane temperature distribution of the semiconductor wafer a desired temperature distribution with high accuracy (by uniformizing an in-plane temperature and varying the in-plane temperature distribution for each region), and furthermore, an apparatus with excellent energy efficiency can be simply configured. When the temperature of the semiconductor wafer is controlled to be the target temperature by raising the temperature of the semiconductor wafer, control means performs switching so as to supply a high-temperature circulating liquid at a temperature higher than the target temperature in a high-temperature tank to a channel in a stage, and controls the thermoelectric element in plural zones so that the temperature of the semiconductor wafer coincides with the target temperature and the in-plane temperature distribution of the semiconductor wafer becomes the desired temperature distribution. | 03-17-2011 |
| 20110048486 | THERMOELECTRIC MODULE - A thermoelectric module includes: a plurality of thermoelectric elements that is electrically series-connected via a plurality of electrodes; and a pair of substrates on which the plurality of electrodes are formed on facing surfaces of the pair of substrates, the pair of substrates being provided perpendicularly to a heat transfer direction with the plurality of thermoelectric elements being interposed. An electrode of an upper substrate includes a first electrode having a size enough to electrically connect the thermoelectric elements that are spaced apart from each other by a distance corresponding to an area equivalent to an adjacent pair of the thermoelectric elements. An electrode of a lower substrate is provided correspondingly to a maximum placement number of the thermoelectric elements interposed between the substrates, and also has a size enough to electrically connect the adjacent pair of the thermoelectric elements. | 03-03-2011 |
| 20100031989 | THERMOELECTRIC MODULE AND METALLIZED SUBSTRATE - A thermoelectric module ( | 02-11-2010 |
| 20090236072 | Device and method for adjusting temperature of fluid - An estimator estimates the outlet temperature of fluid at an outlet of heating tanks to which no outlet temperature sensor is provided. For a heating tank to which an outlet temperature sensor is provided, a control unit determines an manipulated variable on the basis of the outlet temperature which has been measured and a target temperature, while it determines an manipulated variable for a heating tank to which no outlet temperature sensor is provided, on the basis of the estimated temperature estimated by the estimator and a target temperature. | 09-24-2009 |