KaZak Composites, Inc. Patent applications |
Patent application number | Title | Published |
20110167638 | METHOD OF FORMING A BUCKLING RESTRAINED BRACE FOR STRUCTURAL REINFORCEMENT AND SEISMIC ENERGY DISSIPATION - A buckling restrained brace includes a deformable core contained within an outer casing. Ends of the core protrude from the casing for connection to a frame or other structure. A length of the deformable core between its ends, referred to as the gauge or yielding section, is capable of deforming during an earthquake or blast loading. The gauge section is differentially heat treated from the ends so that the gauge section has a lower yield strength than the ends. The casing provides containment of the core to prevent buckling of the core. A metal foil interface or unbonding layer is provided between the deformable core and the casing so that the deformable core does not bind to the casing. The buckling restrained brace provides significant performance improvements over prior art BRBs coupled with simplified assembly. | 07-14-2011 |
20110041425 | BUCKLING RESTRAINED BRACE FOR STRUCTURAL REINFORCEMENT AND SEISMIC ENERGY DISSIPATION - A buckling restrained brace includes a deformable core contained within an outer casing. Ends of the core protrude from the casing for connection to a frame or other structure. A length of the deformable core between its ends, referred to as the gauge or yielding section, is capable of deforming during an earthquake or blast loading. The gauge section is differentially heat treated from the ends so that the gauge section has a lower yield strength than the ends. The casing provides containment of the core to prevent buckling of the core. A metal foil interface or unbonding layer is provided between the deformable core and the casing so that the deformable core does not bind to the casing. The buckling restrained brace provides significant performance improvements over prior art BRBs coupled with simplified assembly. | 02-24-2011 |
20100155033 | THERMAL MANAGEMENT SYSTEM USING MICRO HEAT PIPE FOR THERMAL MANAGEMENT OF ELECTRONIC COMPONENTS - A thermal management system includes a base element and a heat producing element disposed for heat transfer from the heat producing element to the base element. An adherent zone includes an adherent element in physical attachment between the heat producing element and the base element. A heat transfer zone, separate from the adherent zone, includes a heat pipe between the heat producing element and the base element. The heat pipe includes a circulatory flow path between an evaporator section and a condenser section, and a working fluid on the circulatory flow path. | 06-24-2010 |
20090126860 | Prepeg pultrusion - Continuous pultrusion of prepreg material systems is provided. A prepreg material, comprising fibers infiltrated with a partially cured resin, is introduced into a pultrusion die with a barrier layer between surfaces of the prepreg material and facing inner surfaces of the die. The prepreg material and the barrier layers are continuously pulled through the pultrusion die. The barrier layer is removed from each surface of the prepreg material after exiting the die. | 05-21-2009 |