KAWASAKI ROBOTICS (USA), INC. Patent applications |
Patent application number | Title | Published |
20140277727 | METHOD OF WAFER SYSTEM INTERLOCK FOR THE PROTECTION OF EQUIPMENT AND PRODUCT IN SEMICONDUCTOR PROCESSING BRIDGE TOOL - The present disclosure is directed to methods and systems for evaluating wafer size handling capabilities of wafer handling robots and wafer stations in a wafer processing environment. In one embodiment, a method is provided in which size parameters for each of one or more wafer stations and one or more robot hands of a wafer handling robot are set based on user input. A user command identifying a desired robot hand and a desired wafer station is received. A first size parameter of the desired robot hand is compared to a second size parameter of the desired wafer station. If the first size parameter is equal to the second size parameter, or if the second size parameter is an all-size parameter, the user command is executed. If the first size parameter is not equal to the second size parameter, an error is generated. | 09-18-2014 |
20140190951 | WELD DAMMING AND BACKING - The present disclosure is directed to methods for damming and backing welds. In one embodiment, a method of welding a workpiece is provided in which the workpiece includes a first section, a second section, and a weld groove disposed therebetween. Opposing edges of the first and second sections are positioned adjacent to each other and at least partially form a bottom of the weld groove. A silicon dioxide weld dam is abutted against a terminal end of the workpiece relative to a weld direction. The weld dam is positioned at a weld joint termination point to prevent molten metal from flowing through a terminal end opening of the groove at the weld joint termination point. The first and second sections are welded together along opposing edges in the weld direction up to the weld joint termination point. Finally, the dam is removed, exposing the terminal end of the workpiece. | 07-10-2014 |
20140190950 | WELD COMPENSATION DEVICE - The present disclosure is directed to devices and methods for automating weld termination. In one embodiment, a compensation device is provided to grip a weld dam comprised of silicon dioxide. The compensation device is used to impart linear motion along an x-axis, y-axis, and z-axis, and rotational motion about the z-axis, to the weld dam. Via the imparted linear and rotational motion, the weld dam is then abutted against a surface of a workpiece, the workpiece comprising a first and a second section. In some embodiments, the workpiece surface includes uneven terminal ends of the first and second sections. In other embodiments, the workpiece surface is a bottom surface. | 07-10-2014 |