| Kaijo Corporation Patent applications |
| Patent application number | Title | Published |
|---|
| 20120027898 | METHOD AND APPARATUS FOR CONTROLLING MICROORGANISMS IN FOOD MATERIALS BY VACUUM AND RESONANT ULTRASONICATION - An object of the present invention is to provide a method for controlling microorganisms in food materials, by which bacterial groups that cause deterioration of the quality of food materials such as poultry and pathogenic microorganisms that cause food poisoning can be efficiently controlled. Specifically, the present invention relates to a method for controlling microorganisms in food materials, comprising a step of subjecting a food material immersed in a sterilizing solution to repeated treatment with negative pressure and ordinary pressure and/or a step of subjecting the food material immersed in the sterilizing solution to resonant ultrasonication. | 02-02-2012 |
| 20110079253 | Ultrasonic Cleaning Apparatus - The invention provides an ultrasonic cleaning apparatus in which unevenness of sound pressure among a plurality of oscillating elements is solved by emitting uniform ultrasonic waves, the rate of removal of fine particles is improved, and the uneven cleaning is avoided. The ultrasonic cleaning apparatus includes a cleaning bath that stores an object to be cleaned and cleaning solvent; a plurality of oscillating elements attached to the cleaning bath; a plurality of oscillators connected respectively to the plurality of oscillating elements for exciting the plurality of oscillating elements; and a controller connected to the plurality of oscillators for controlling the plurality of oscillators to output signals having the same phase or substantially the same phase to the plurality of oscillating elements. | 04-07-2011 |
| 20110030741 | OUTPUT ADJUSTMENT CIRCUIT, ULTRASONIC TRANSDUCER DEVICE COMPONENT, AND ULTRASONIC TRANSDUCER DEVICE - Provided is an ultrasonic transducer device component that can change a transducer with another one having the same frequency or a different frequency without adjustment inside a generator main body or a change of the generator main body. An ultrasonic transducer device component according to the present invention comprises: a connection unit | 02-10-2011 |
| 20100206940 | WIRE BONDING METHOD, WIRE BONDING APPARATUS, AND WIRE BONDING CONTROL PROGRAM - The invention provides a wire bonding method which enables formation of a low loop having a height not exceeding two times the wire diameter and secures sufficient pull strength of the wire even with the low loop shape. After having formed a contact-bonded ball at a first bonding point, a capillary moves upward and then toward a second bonding point to press a side surface of an upper portion of the contact-bonded ball, so that a protruded portion is formed on a top portion of the contact-bonded ball on the side of the second bonding point. After having formed the protruded portion of the contact-bonded ball, the capillary moves upward, and then downward while moving toward the second bonding point to press the protruded portion, so that a wire drawing portion for drawing the wire from the top portion of the contact-bonded ball horizontally is formed. | 08-19-2010 |
| 20100059574 | WIRE BONDING METHOD, WIRE BONDING APPARATUS, AND WIRE BONDING CONTROL PROGRAM - The invention provides a wire bonding method which enables formation of a low loop having a height not exceeding two times the wire diameter and secures sufficient pull strength of the wire even with the low loop shape. After having formed a contact-bonded ball at a first bonding point, a capillary moves upward and then toward a second bonding point to press a side surface of an upper portion of the contact-bonded ball, so that a protruded portion is formed on a top portion of the contact-bonded ball on the side of the second bonding point. After having formed the protruded portion of the contact-bonded ball, the capillary moves upward, and then downward while moving toward the second bonding point to press the protruded portion, so that a wire drawing portion for drawing the wire from the top portion of the contact-bonded ball horizontally is formed. | 03-11-2010 |
