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Kabushiki Kiasha Toshiba

Kabushiki Kiasha Toshiba Patent applications
Patent application numberTitlePublished
20090158236Semiconductor device fabrication method and fabrication apparatus using a stencil mask - A semiconductor device fabrication method includes preparing a substrate having a first circuit pattern of a semiconductor device; providing a mask with at least part of second circuit pattern of the semiconductor device; collimating incident direction of particles; changing at least one of the a substrate angle between a vertical axis of the substrate and the incident direction of the particles and a mask angle between a vertical axis of the mask and the incident direction so that the second circuit pattern on the mask can be aligned to the first circuit pattern on the substrate with a design margin; and selectively irradiating the particles to the substrate using the mask.06-18-2009