| 20110211323 | CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE - According to one embodiment, a circuit board includes: a substrate on which circuit patterns are formed, a first surface of the substrate being formed substantially flat; and a solder resist film that covers the first surface of the substrate. The solder resist film assumes, as a whole, a convex shape in which the thickness of the solder resist film in the center of the substrate is larger than the thickness of the solder resist film in the periphery of the substrate. | 09-01-2011 |
