Kabushiki KaishaToshiba Patent applications |
Patent application number | Title | Published |
20150255323 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME - In one embodiment, a semiconductor device includes a semiconductor substrate including device regions which extend in a first direction and are adjacent to one another in a second direction perpendicular to the first direction, and isolation regions disposed between the device regions. The device further includes a gate insulator disposed on a device region, a charge storing layer disposed on the gate insulator, and a hafnium containing film disposed on the charge storing layer, a width of the hafnium containing film in the second direction being larger than a width of at least one of a lower face of the charge storing layer, the gate insulator, and an upper face of the device region in the second direction. | 09-10-2015 |
20150161144 | DOCUMENT CLASSIFICATION APPARATUS AND DOCUMENT CLASSIFICATION METHOD - According to one embodiment, there is provided a document classification apparatus including an inter-word corresponding relationship extraction unit configured to extract the corresponding relationship between words in different languages based on a frequency with which the words in the different languages co-occurrently appear between the documents having the corresponding relationship, and an inter-category corresponding relationship extraction unit configured to extract the corresponding relationship between categories into which the documents in the different languages are classified, based on the corresponding relationship between the words. | 06-11-2015 |
20110211323 | CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE - According to one embodiment, a circuit board includes: a substrate on which circuit patterns are formed, a first surface of the substrate being formed substantially flat; and a solder resist film that covers the first surface of the substrate. The solder resist film assumes, as a whole, a convex shape in which the thickness of the solder resist film in the center of the substrate is larger than the thickness of the solder resist film in the periphery of the substrate. | 09-01-2011 |