| KABUSHIKI KAISHA NIPPON FILLER METALS, Patent applications |
| Patent application number | Title | Published |
|---|
| 20110274937 | LEAD-FREE SOLDER ALLOY, FATIGUE RESISTANT SOLDERING MATERIALS CONTAINING THE SOLDER ALLOY, AND JOINED PRODUCTS USING THE SOLDERING MATERIALS - [PROBLEMS TO BE SOLVED] To provide a low-silver lead-free solder alloy having an excellent wettability and being excellent in heat-fatigue resistance, and a solder-paste soldering material and resin-flux cored soldering material being excellent in fatigue resistance, and a joined product by using the soldering material. | 11-10-2011 |
| 20100233018 | LEAD-FREE SOLDER ALLOY - Provided is an SnCu lead-free solder alloy which eliminates a drawback that an intermetallic compound excessively precipitates and the precipitate serves as nuclei to form dross to thereby cause soldering defects including a needle-like protrusion to occur, thus to satisfy all of the properties required for practical use. | 09-16-2010 |
