| KABUSHIKI KAISHA NIHON MICRONICS Patent applications |
| Patent application number | Title | Published |
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| 20120129408 | CONTACT AND ELECTRICAL CONNECTING APPARATUS - A contact according to the present invention comprises a plate-shaped first plunger contacting one member, a plate-shaped second plunger contacting the other member in a state of being overlapped with the first plunger and conducting electricity between the one member and the other member in cooperation with the first plunger, and a compression coil spring which is a member coupling the first plunger with the second plunger in a state where contact pieces thereof are in opposite directions from each other, covering outer circumferences of coupling portions of the first plunger and the second plunger, abutting on spring receiving portions of the respective plungers, and supporting the respective plungers to be relatively slidable. In an electrical connecting apparatus, the contacts are incorporated. | 05-24-2012 |
| 20120126844 | CHIP STACK DEVICE TESTING METHOD, CHIP STACK DEVICE REARRANGING UNIT, AND CHIP STACK DEVICE TESTING APPARATUS - A plurality of chip stack devices having different external sizes can be tested accurately and efficiently with low cost. The present invention provides a chip stack device testing method testing a chip stack device configured by stacking a plurality of chips separated by dicing a substrate under test tested in a testing unit. A tray for chip stack devices having equal shape and external dimension to those of the undiced substrate under test is used, one or a plurality of the chip stack devices are attached and supported to an adhesive layer of the tray for chip stack devices to align the chip stack devices with positions of the respective chips of the undiced substrate under test, the tray for chip stack devices is installed in the testing unit in a similar manner to that in a test of the substrate under test, and the respective chip stack devices are tested. | 05-24-2012 |
| 20120068726 | ELECTRICAL TEST PROBE AND PROBE ASSEMBLY - An embodiment disperses a force acting on a border portion between an extending portion and a pedestal portion or a reinforcing member to prevent breakage of a probe tip portion of a probe. An electrical test probe includes a probe main body, a recess provided at an end of the main body and having an inner surface, and a probe tip having a part received in the recess. The inner surface has a central area and two lateral areas on both sides of the central area, and the part of the probe tip is located at the central area and at least at either one of the lateral areas. | 03-22-2012 |
| 20120042516 | METHOD FOR MANUFACTURING PROBE CARD - A method for manufacturing a probe card uses a probe having first and second metal layers made of a material in which wettability of a conductive jointing material to the metal layers is higher than wettability of the jointing material to an attaching portion on an outer circumferential surface of an upper area of the attaching portion and at two opposed surface areas of an area continuing downward from the upper area of the attaching portion, respectively, and having a jointing material layer at the upper area and the two surface areas to cover the first and second metal layers. Each probe is attached to a probe substrate at the attaching portion by melting and thereafter solidifying a material for the jointing material layer in a state where the attaching portion is inserted in a through hole of the probe substrate. | 02-23-2012 |
| 20120042509 | METHOD FOR MANUFACTURING PROBE CARD - A method for manufacturing a probe card includes inserting an attaching portion of each probe into one of first through holes provided on a probe substrate at least in a row, inserting a probe tip portion of each probe into second through holes respectively provided on a plurality of plate-like positioning members piled in their thickness directions at least in a row, relatively displacing the adjacent positioning members in opposite directions to two-dimensionally position the probe tip portions of the probes, and thereafter softening a conductive jointing material to position the attaching portions of the respective probes against the first through holes. | 02-23-2012 |
| 20120021562 | METHOD FOR FORMING TERMINAL OF STACKED PACKAGE ELEMENT AND METHOD FOR FORMING STACKED PACKAGE - A semiconductor chip module having high degree of freedom in assignment of a circuit to each semiconductor chip and in position of a connection terminal of each semiconductor chip is provided. The present invention relates to a semiconductor chip module in which a plurality of semiconductor chips, each provided on the side face thereof with a part of a connection terminal coupled with a circuit pattern formed on the front face, have been stacked and bonded. Connection terminal portions on the side faces of the respective semiconductor chips are interconnected by a wiring pattern. The connection terminal on the semiconductor chip is led from the front face to the side face and formed by applying spraying of a conductive material in a mist state. | 01-26-2012 |
| 20120003864 | ELECTRICAL CONNECTING APPARATUS AND CONTACTS USED THEREFOR - An electrical connecting apparatus | 01-05-2012 |
| 20110175635 | PROBE FOR ELECTRICAL TEST AND METHOD FOR MANUFACTURING THE SAME, AND ELECTRICAL CONNECTING APPARATUS AND METHOD FOR MANUFACTURING THE SAME - A probe for an electrical test has a foot portion coupled with a board, an arm portion extending laterally from a lower end portion of the foot portion, and a needle tip portion projecting downward from a tip end portion of the arm portion. At least one selected from a group consisting of the foot portion, the arm portion, and the needle tip portion comprises a symbol specifying a position of the probe on the board. | 07-21-2011 |
| 20110159444 | METHOD FOR MANUFACTURING PROBE SHEET - An embodiment of the invention provides a method for manufacturing a probe sheet in which a probe tip can be arranged at a predetermined accurate position without the need for troublesome positional adjustment operations of the probe tip in coupling operations of each contactor and a probe sheet main body. It is a method for manufacturing a probe sheet comprising a probe sheet main body having conductive paths and a plurality of contactors formed to be protruded from one surface of the probe sheet main body and connected to the conductive paths. The manufacturing method comprises the steps of forming a plurality of the contactors on a base table by sequentially depositing on the base table metal materials for a plurality of contactors from their respective probe tips toward base portions with use of a photolithographic technique, forming on the base table the probe sheet main body to be coupled with the base portion of each contactor held on the base table, and separating the contactors from the base table integrally with the probe sheet main body. | 06-30-2011 |
| 20110115515 | PROBE FOR ELECTRICAL TEST, ELECTRICAL CONNECTING APPARATUS USING THE SAME, AND METHOD FOR MANUFACTURING PROBE - The embodiment of the subject matter provides a probe that is good both in mechanical characteristics and electrical characteristics. A probe for an electrical test comprises a probe main body portion made of a nickel-boron alloy, and a probe tip portion projecting downward from the probe main body portion and made of a different conductive material from that for the probe main body portion. The crystal size of the nickel-boron alloy is 50 nm at the maximum, and the contained amount of the boron is 0.02 wt % or more and 0.20 wt % or less. | 05-19-2011 |
| 20110095779 | ELECTRICAL CONNECTING APPARATUS AND TESTING SYSTEM USING THE SAME - An embodiment of an electrical connecting apparatus includes a chip unit having a plurality of electronic components arranged on the upper side of a chip supporting body, a probe unit having a plurality of contacts arranged on the lower side of a probe supporting body, and a connecting unit arranged between the chip unit and the probe unit and having a connecting member supporting body and a plurality of connecting members electrically connecting the chip unit to the probe unit. The chip unit, the probe unit and the connecting unit are vacuum-coupled. | 04-28-2011 |
| 20110018569 | TEST APPARATUS OF SEMICONDUCTOR DEVICE AND METHOD THEREOF - A test apparatus according to the present invention includes a probe card recognition unit that recognizes positions of at least two probe card marks formed to a probe card and assumes a probe card mark connection line connecting the positions of the probe card marks, a backing material recognition unit that recognizes positions of at least two backing material marks formed to a backing material where a semiconductor chip is fixed thereto and assumes a backing material mark connection line connecting the positions of the backing material mark, a positional relationship recognition unit that recognizes a positional relationship between the probe card and the backing material according to the probe card mark connection line and the backing material mark connection line, and a correction unit that corrects the position of at least one of the probe card and the backing material according to the positional relationship. | 01-27-2011 |
| 20110001506 | TESTING APPARATUS FOR INTEGRATED CIRCUIT - An apparatus for testing an integrated circuit comprises: a chip unit with a plurality of electronic parts such as chip units arranged on the upside of a chip support; a probe unit having a plurality of contacts arranged on the underside of a probe support and spaced downward from the chip unit; a connection unit supporting the probe unit spaced downward from the chip unit on a pin support so as to penetrate the pin support in an up-down direction; and a coupling unit which couples separably the chip unit, the probe unit and the connection unit and displaces one of the chip support and the probe support and the pin support in a direction to approach each other and to be away from each other relative to the connection unit. | 01-06-2011 |
| 20100327898 | PROBE CARD AND INSPECTION APPARATUS - An automatic switching mechanism is controlled by a probe card independent from a tester without limitation of the number of control signals from the tester. A probe card and an inspection apparatus include probes to be brought into contact with electrodes of inspection targets and a power supply channel electrically connecting the probes to a tester. The automatic switching mechanism divides each of the power supply channels into a plurality of power supply wiring portions, which are respectively connected to the probes; and shuts off the power supply wiring responsive to electrical fluctuation such as overcurrent. An electrical fluctuation detection mechanism detects an electrical fluctuation due to a defective product among the inspection targets. A control mechanism, responsive to detection of an electrical fluctuation, shuts off the power supply wiring portion if the electrical fluctuation is caused by the automatic switching mechanism. | 12-30-2010 |
| 20100301476 | STACKED PACKAGE AND METHOD FOR FORMING STACKED PACKAGE - A semiconductor chip module including a plurality of semiconductor chips, each provided on the side face thereof with a part of connection terminals coupled with a circuit pattern formed on the front face, the chips being stacked and bonded. The stacked element in the lowermost layer is a semiconductor chip or an interposer dedicated for attachment to an external attachment board, and having a plurality of electrode elements (e.g., solder balls) arranged on a face on the attachment side, with each electrode element connected to any one of the connection terminals by a circuit pattern. Connection terminal portions on the side faces of the respective semiconductor chips and the stacked element in the lowermost layer are interconnected by a wiring pattern extending over the side faces. | 12-02-2010 |
| 20100289514 | INSPECTION APPARATUS - An inspection apparatus is provided to perform an accurate temperature control, cut a noise wave, overcome contact failure, and improve inspection accuracy. The inspection apparatus includes a probe device having a contact for contacting with an electrode of an inspected object and having a built-in heater for correcting dislocation of the contact to the electrode caused by temperature difference between the probe device and the inspected object; a tester for testing probe device and supplying electric power to the heater; an electric power supply system, provided on the tester, for supplying electric power to the heater; and a temperature control unit for controlling electric power to the heater of the probe device through the electric power supply system, wherein the electric power supply system includes at least one open/close switch for switching on and off power supply to the heater. A connector including a male connector and a female connector provided on the other end are provided. A continuity-checking device checks to be able to supply electric power to the heater from the electric power supply system. | 11-18-2010 |
| 20100219854 | PROBE AND ELECTRICAL CONNECTING APPARATUS USING IT - A probe having an alignment mark that is hardly influenced by scraps of an electrode scraped by a probe tip is provided. A probe according to the present invention comprises a base portion having an attaching end and extending in a direction distanced from the attaching end, an arm portion extending from the base portion laterally with a space in the extending direction of the base portion from the attaching end, a probe tip portion protruded from the arm portion and having a probe tip formed on its protruding end, and an alignment mark for alignment of the probe tip. The arm portion has a flat surface area on the opposite side of a side where the attaching end of the base portion is located when seen along the extending direction of the arm portion. The probe tip portion is formed to be protruded from the flat surface area, and the alignment mark is constituted by at least a part of the flat surface area. | 09-02-2010 |
| 20100213956 | PROBE FOR CURRENT TEST, PROBE ASSEMBLY AND PRODUCTION METHOD THEREOF - A probe for current test comprising: a probe body having a plate-like connection portion whose end face becomes a connection face to a probe board; a solder layer formed on at least one side face of said connection portion; and a guide portion formed on the connection portion, penetrating the connection portion in its thickness direction from the one side face with the solder layer formed to the other side face, and when the solder layer is melted, capable of guiding a portion thereof to the other side face. | 08-26-2010 |
| 20100194416 | ELECTRICAL CONNECTING APPARATUS - An embodiment of an electrical connecting apparatus comprises a probe base plate and a plurality of contacts provided with tips to be pressed against electrodes of a device under test and arranged on the underside of the probe base plate. The distance dimensions from an imaginary plane parallel to the probe base plate to the tips of the contacts are made the greater toward the center of the probe base plate. | 08-05-2010 |
| 20100164520 | METHOD AND APPARATUS FOR TESTING INTEGRATED CIRCUIT - An embodiment of a method for testing an integrated circuit comprises a first step for determining at least one of a group selected from whether or not the chuck top receiving the integrated circuit exists near a probe card which transmits and receives electrical signals to and from the integrated circuit, whether or not the integrated circuit is under testing, and whether or not the probe card has a given temperature, and a second step for adjusting power for heating to be supplied to a heating element provided in the probe card according to the determination result in the first step. | 07-01-2010 |
| 20100156449 | PROBE CARD - An embodiment of a probe card comprising: a probe base plate including a ceramic base plate and a plurality of conductive paths; and a plurality of contacts disposed on one face of the probe base plate and electrically connected to the conductive paths. The ceramic base plate may be provided with: a plurality of first layers having a heating element which generates heat by electric power and disposed at intervals in the thickness direction of the ceramic base plate; second layers each interposed between adjoining first layers; and a power supply path for supplying electric power for heating to the heating element. | 06-24-2010 |
| 20100134121 | ELECTRICAL CONNECTING APPARATUS - An electrical connecting apparatus for use in an electrical inspection of a tester and a device under test. The electrical connecting apparatus is provided with a probe assembly to be tightened by tightening screw members toward the support member and having a wiring board interposed between itself and a support member. In order to prevent deformation of the probe board of the probe assembly due to tightening of the screw members, a spacer disposed to penetrate the wiring board is between the support member and probe board and penetrated by the screw members. Both end faces of the spacer are convex spherical surface. | 06-03-2010 |
| 20100120299 | CONTACT AND ELECTRICAL CONNECTING APPARATUS - A contact type electrical connector includes a first plunger in contact with one member; a second plunger in contact with another member and electrically connected to the first plunger, whereby the two members are electrically connected through the first plunger; a cylindrical support member for slidably and elastically supporting the first and second plungers with a connection portion of the first plunger and a connection portion of the second plunger overlapping and electrically connected; and a compression coil spring surrounding the outer peripheries of the first and second plungers with the connection portions thereof supported by the cylindrical support member and brought into contact with a spring receiving portion of each of the plungers so as to urge the plungers apart. | 05-13-2010 |
| 20100105224 | ELECTRICAL CONNECTING APPARATUS - An electrical connecting device includes a supporting substrate, a plate spring arranged on the supporting substrate, an assembling device for assembling the plate spring to the supporting substrate, a block having a mounting surface facing down, and a flexible circuit board whereupon a plurality of contacts are formed. The block has the mounting surface which protrudes downward from the supporting substrate, for mounting the circuit board. The plate spring is applied with an initial load to be in a status where at least a center region whereupon the block is mounted is urged upward. Thus, excellent electric contact status can be obtained without increasing an over drive quantity. | 04-29-2010 |
| 20100099277 | ELECTRICAL CONNECTING APPARATUS - An embodiment of an electrical connecting apparatus comprises an electrical insulating plate, an elastic plate made of an electrical insulating material arranged on the electrical insulating plate, a sheet-like conductive plate arranged on the elastic plate, and first and second contacts. The conductive plate comprises a hole area having at least one first hole portion allowing the probe tip portion of the first contact to abut to the conductive plate and a plurality of second hole portions not allowing the probe tip portions of the second contacts to abut thereon regardless of whether or not overdriving acts on the contacts. | 04-22-2010 |
| 20100062662 | ELECTRICAL CONNECTING APPARATUS - An electrically connecting apparatus comprises a base member provided with slots penetrating in the plate thickness direction, contacts disposed within the slots so as to be able to contact electrodes of a device under test on the base member and for connecting the electrodes to an electric circuit of a tester, and an elastic member. The contacts has a fixed piece to be fixedly held on the base member within the slots for connection with the electric circuit, and a movable piece disposed within the slots for electrical connection with the fixed piece. In the fixed piece, a guide face for guiding the movable piece toward a contact position permitting the movable piece and the electrodes to contact is formed, and the movable piece is supported slidably on the guide face so as to receive elastic biasing force toward the contact position by the elastic member. | 03-11-2010 |
| 20100038766 | METHOD FOR FORMING TERMINAL OF STACKED PACKAGE ELEMENT AND METHOD FOR FORMING STACKED PACKAGE - A semiconductor chip module having high degree of freedom in assignment of a circuit to each semiconductor chip and in position of a connection terminal of each semiconductor chip is provided. The present invention relates to a semiconductor chip module in which a plurality of semiconductor chips each provided on the side face thereof with a part of a connection terminal coupled with a circuit pattern formed on the front face, have been stacked and bonded. Connection terminal portions on the side faces of the respective semiconductor chips are interconnected by a wiring pattern. The connection terminal on the semiconductor chip is led from the front face to the side face and formed by applying spraying of a conductive material in a mist state. | 02-18-2010 |
| 20100029099 | ELECTRICAL CONNECTING APPARATUS - An embodiment of an electrical connecting apparatus comprises a support board having an upper surface and a lower surface, a block having an attachment surface directing downward and attached to the support board in a state where at least the attachment surface is located below the support board, a flexible circuit board having a contactor area in which a plurality of contactors are arranged and an outside area around the contactor area and attached at part of the outside area to the lower surface of the support board in a state where at least the contactor area is opposed to the attachment surface of the block, and a reference mark member having a lower end surface and a reference mark for positioning provided on the lower end surface and attached to the block in a state where the lower end surface is exposed to the lower side of the circuit board. Accordingly, the measurement accuracy of the probe tip position is heightened. | 02-04-2010 |
| 20100013072 | STACKED PACKAGE AND METHOD FOR FORMING STACKED PACKAGE - The present invention provides an inexpensive semiconductor chip module enabling sufficient heat dissipation without complicating the manufacture process. | 01-21-2010 |
| 20090295480 | AMPLIFIER CIRCUIT - An amplifier circuit with favorable linearity is provided. | 12-03-2009 |
| 20090284273 | METHOD FOR ASSEMBLING ELECTRICAL CONNECTING APPARATUS - A method for assembling an electrical connecting apparatus having a support member, a probe board, and spacers arranged between the support member and the probe board. A height of at least either each abutting part of the support member or each abutting part of the probe board facing the abutting part is measured, and a length of each of the plurality of spacers is measured. Based on measurement values obtained by these measurements, a spacer appropriate for maintaining tips of numerous probes provided on the probe board on the same plane is selected for each pair of the both abutting parts. | 11-19-2009 |
| 20090273357 | CONTACT FOR ELECTRICAL TEST OF ELECTRONIC DEVICES, METHOD FOR MANUFACTURING THE SAME, AND PROBE ASSEMBLY - A contact for an electrical test comprises a first area to be bonded to a board, a second area extending in the right-left direction from the lower end portion of the first area, a third area projecting downward from the tip end portion of the second area, and a low light reflective film having lower light reflectance than that of the first area. The third area has a probe tip to be contacted an electrode of an electronic device. The low light reflective film is formed on a surface of at least the bonding part of the first area to the board and its proximity. | 11-05-2009 |
| 20090264025 | PROBE SHEET AND ELECTRICAL CONNECTING APPARATUS - An embodiment of a probe sheet enabling to restrict misalignment of the posture of each contactor accurately positioned on a probe sheet main body caused by deformation of the probe sheet main body is provided. The probe sheet comprises a probe sheet main body having a flexible insulating synthetic resin film and conductive paths buried in the synthetic resin film and a plurality of contactors formed to be protruded from a contactor area on one surface of the probe sheet main body and connected to the conductive paths. In the probe sheet main body is buried a plate-shaped member having higher rigidity than that of the synthetic resin film and restricting deformation of the contactor area. | 10-22-2009 |
| 20090242254 | MULTILAYER WIRING BOARD AND ELECTRICAL CONNECTING APPARATUS USING THE SAME - The present invention makes repair easy and reduces effects on the electrical connection conditions of an electronic component to an internal wiring after repair and on the mechanical strength of the repair part in a case of breakage or separation of an electrode for implementation of the electronic component. In a multilayer wiring board, a plurality of wiring sheets each having an internal wiring and a plurality of electrical insulating sheets are arranged alternately in the thickness directions of these sheets, and a plurality of electrodes for implementing an electronic component electrically connected to the internal wirings are formed on the surface of an uppermost sheet. The multilayer wiring board further comprises a plurality of spare electrodes corresponding to the electrodes and electrically connected to the internal wirings connected to the corresponding electrodes directly under the corresponding electrodes on a sheet located directly under the uppermost sheet. | 10-01-2009 |
| 20090230982 | CONTACT FOR ELECTRICAL TEST, ELECTRICAL CONNECTING APPARATUS USING IT, AND METHOD OF PRODUCING THE CONTACT - A contact comprises a contact body at least provided with an arm region extending in the right-left direction, and a tip region extending downward from the front end portion of the arm region. The tip region is provided with a pedestal portion integrally continuous to the lower edge portion on the front end side of the arm region, and a contact portion projecting downward from the lower end portion of the pedestal portion and having a tip to be brought into contact with an electrode of a device under test at the lower end. The pedestal portion includes an underside region having at least four inclined faces located around the contact portion when the tip region is seen from below, and inclined such that a portion closer to the side of the contact portion becomes lower. | 09-17-2009 |
| 20090212800 | ELECTRICAL CONNECTING APPARATUS - The object of the present invention is to prevent an operator from touching electronic elements arranged on an upper surface of a probe assembly of an electrical connecting apparatus at the time of carrying the electrical connecting apparatus and to restrict bowing of the probe assembly caused by the temperature difference between the upper surface and the lower surface of the probe assembly. An electrical connecting apparatus | 08-27-2009 |
| 20090160473 | CONTACTOR FOR ELECTRICAL TEST, ELECTRICAL CONNECTING APPARATUS USING THE SAME, AND METHOD FOR MANUFACTURING CONTACTOR - An electrical test contactor comprises a contactor main body including a plate-shaped attachment portion extending in the up-down direction, a plate-shaped arm portion extending from the lower end portion of the attachment portion at least to one side in the right-left direction, and a plate-shaped pedestal portion projecting downward from the tip end portion of the arm portion, a contact portion projecting downward from the lower end of the pedestal portion and having the lower end of the contact portion acting as a probe tip, and a resistor having a higher resistance value than the contactor main body and the contact portion and arranged at the contactor main body so as to heighten the resistance value of the contactor. | 06-25-2009 |
| 20090160469 | ELECTRIC CONNECTING APPARATUS - In an electrical connecting apparatus, a thermal deformation restriction member, a reinforcing plate, and an auxiliary member are made of materials having smaller thermal expansion coefficients in this order, and a wiring board supporting a probe assembly is coupled with the reinforcing plate. The auxiliary member has a void inside the coupling region with the reinforcing plate. The void receives the deformed part when the center portion of the wiring board is deformed toward the reinforcing plate. Thus, the thermal deformation restriction member, the reinforcing plate, and the auxiliary member function as a three-layer bimetal having a sandwich structure, and the thermal deformation of the wiring board is restricted effectively. | 06-25-2009 |
| 20090117759 | ELECTRICAL CONNECTING APPARATUS - The present invention prevents damage of adjacent mounting portions caused by heat at the time of mounting of contactors and further reduces the arrangement pitch of the contactors. An electrical connecting apparatus uses at least four types of contactors different in terms of at least the shapes of seat portions and the height positions of arm portions. Each of such contactors has a seat portion mounted on a mounting portion of a board, an arm portion extending in the left-right direction from the lower end of the seat portion, and a probe tip portion extending downward from the tip end portion of the arm portion and having a probe tip at the lower end. These contactors are mounted in parallel in a cantilevered manner alternately in the front-back direction with the mounting positions to the board displaced in the left-right direction. | 05-07-2009 |
| 20090104795 | CONTACTS AND ELECTRICAL CONNECTING APPARATUS USING THE SAME - An electrical connecting apparatus uses a plurality of contacts each of which includes: a principal portion having an outer face curved and directed to a conductive portion of a base plate and received in a recess and a slit of a housing; a front end portion continuous to the front end side of the principal portion and projected upward from the slit so as to be relatively pressed against an electrode of a device under test; and a rear end portion continuous to the rear end side of the principal portion and located in the recess. The front end portion of each contact is projected upward from the slit by the dimension of the thickness of the front end portion or more than that and has an arc-shaped front end face extend in the longitudinal direction of the slit. | 04-23-2009 |
| 20090061658 | ELECTRICAL CONNECTING APPARATUS - The electrical connecting apparatus comprises: a wiring base plate having a first surface provided with a plurality of first conductive portions; a probe base plate having a second surface provided with a plurality of second conductive portions with its second surface opposed to the lower surface; a plurality of screws for removably coupling the wiring base plate and the probe base plate; and a connecting device for electrically connecting the first and second conductive portions. | 03-05-2009 |
| 20090058441 | ELECTRICAL TEST PROBE - A probe for electrical test comprises a plate-shaped main portion having a base end to be attached to a support board and a tip end opposite the base end, and a probe tip portion arranged at the tip end of the main portion and having a probe tip to contact an electrode of a device under test, the main portion being made of a tenacity material. The main portion includes a conductive material extending from the base end to the tip end and at least part of which is buried within the tenacity material, and the tenacity material has higher resiliency than that of the conductive material while the conductive material has higher conductivity than that of the tenacity material. As a result, disorder of a signal provided via the probe is decreased without losing elastic deformation. | 03-05-2009 |
| 20090058440 | PROBE ASSEMBLY, METHOD OF PRODUCING IT AND ELECTRICAL CONNECTING APPARATUS - A probe assembly for use in electrical measurement of a device under test. The probe assembly comprises a plate-like probe base plate with bending deformation produced in a free state without load, and a plurality of probes formed on one face of the probe base plate to project from the face. All the tips of the probes are positioned on the same plane parallel to an imaginary reference plane of the probe base plate. | 03-05-2009 |
| 20090051382 | PROBE FOR ELECTRICAL TEST AND ELECTRICAL CONNECTING APPARATUS USING IT - A probe includes an arm region extending in the back and forth direction, and a tip region extending downward from the front end portion of the arm region. The tip region has a pedestal portion integrally continuous to a lower edge portion at the front end side of the arm region and having an underside inclined to an imaginary axis extending in the vertical direction; and a contact portion projected from the underside of the pedestal portion and having a tip orthogonal to an imaginary axis. Thus, the position of the tip can be accurately determined. | 02-26-2009 |
| 20090035960 | ELECTRICAL CONNECTING APPARATUS - The electrical connecting apparatus disclosed herein includes a frame member having a recess for receiving a device under test provided with a plurality of electrodes, a plurality of contacts provided in correspondence to the electrodes, a plurality of slots formed in the bottom portion of the recess of the frame member and arranged parallel to each other so as to receive the contacts such that the tip of each contact can abut the corresponding electrode, an elastic member disposed across the slots over the bottom portion within the recess to elastically hold the contacts, and a cap member mounted on the frame member and sandwiching the elastic body together with the frame member. | 02-05-2009 |
| 20090021274 | ELECTRICAL CONNECTING APPARATUS - An electrical connecting apparatus comprises a plurality of plate-shaped probes. Each probe has a cut-off portion opening on its inside surface side and both sides in the thickness direction of the probe and is engaged with a dropout preventing member disposed in a plate-shaped housing at the cut-off portion, thereby being prevented from dropping out of the housing. | 01-22-2009 |
| 20090015276 | PROBE ASSEMBLY AND METHOD FOR PRODUCING IT - A method of producing a probe assembly which uses thermal energy of a laser light for bonding a plurality of connection pads provided on a probe board and a probe disposed on each connection pad. In the neighborhood of at least one of the connection pads on the probe board, a dummy connection pad with no probe adhered is formed in order to uniform the thermal energy by irradiation of each bonding portion of each connection pad and the corresponding probe. | 01-15-2009 |
| 20090009201 | Probe for Electrical Test and Probe Assembly - A probe for electrical test provided with positioning marks parallel to a plane where tips are provided and at a height position lower than the plane on a plane directed in the same direction as the plane, the positioning marks are in a predetermined positional relation to said tips. The positioning marks contain information indicating an existing direction of the tips when the positioning marks are observed from the projecting direction of the tips. | 01-08-2009 |
| 20090009197 | PROBE FOR ELECTRICAL TEST - A probe for electrical test comprises an arm region extending in a first direction, and a tip region leading to one side in a second direction intersecting the first direction of the arm region, and has a plate form making a direction interesting the first and second directions a thickness direction. The tip region includes a pedestal portion leading to the arm region and a contact portion leading to the pedestal portion, and the contact portion includes a base portion forming a part of the pedestal portion and a projecting portion leading to the base portion and projecting from the pedestal portion in the second direction. By this, damage to the contact portion is prevented. | 01-08-2009 |
| 20080315901 | MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME AND PROBE APPARATUS - The present invention provides a multilayer wiring board in which resistive elements each of whose error from a desired value is smaller than in a conventional case are built, a method for manufacturing the same, and a probe apparatus utilizing the multilayer wiring board. The present invention is based on a basic concept of forming a flat surface on a surface of a multilayer wiring layer on which a resistive element material is to be deposited and depositing the resistive element material on the flat surface. The multilayer wiring board comprises a multilayer wiring layer on whose surface convexo-concave is formed, a dummy layer burying the convexo-concave within a desired area of the surface of the multilayer wiring layer and having an approximately flat surface, a resistance material layer made of an electrical resistance material deposited on the dummy layer and at an area going beyond the dummy layer, and a wire made of a conductive material deposited on the resistance material layer and ranging from the area going beyond the dummy layer to a part of the flat surface area of the dummy layer, wherein a resistive element is formed at an area of the resistance material layer that the wire does not reach. | 12-25-2008 |
| 20080315893 | Contact and connecting apparatus - A contact and a connecting apparatus are provided to enable miniaturization and shortening and cost reduction in response to further miniaturization and finer pitch of inspection objects. The contact is one electrically for contacting a terminal of a wire and includes a one-side plunger portion, an other-side plunger portion, and an elastic deformation portion provided between the plunger portions. The elastic deformation portion is made of an annular and conductive elastic member integrally connected to the one-side plunger portion and the other-side plunger portion. The plurally arranged elastic deformation portions are disposed in a zigzag shape in the up-down direction with their adjacent heights different from each other. The connecting apparatus includes the plurality of contacts electrically contacting terminals disposed on an inspection object and a contact plate for integrally supporting the respective contacts to make the contacts contact with the respective terminals of the inspection object. | 12-25-2008 |
| 20080297184 | SEMICONDUCTOR TEST APPARATUS - The present invention provides a semiconductor test apparatus that can reduce influence of noise in high-frequency measurement and that can be manufactured inexpensively by simplification of the constitution. A semiconductor test apparatus according to the present invention is one for use in an electrical test of a semiconductor wafer in which numerous integrated circuits each having electrode pads are incorporated. It comprises a probe card and a tester having a connection portion to the probe card. The probe card has numerous probes that can be connected to the electrode pads of the semiconductor wafer and a probe board having on one surface probe lands to which the probes are attached, having on the other surface tester lands corresponding to the probes, and having wiring paths each connecting the probe land and the tester land corresponding to each other. The tester is directly connected to the probe card as the connection portion contacts the tester lands. | 12-04-2008 |
| 20080280542 | CLEANING APPARATUS FOR A PROBE - The present invention provides a cleaning apparatus capable of removing foreign matters attached to a tip of a probe effectively without impairing the durability of the probe. The cleaning apparatus for the probe comprises a base plate having a rough surface and a surface layer formed to conform to and cover the rough surface for the purpose of providing a polishing surface for the probe and having lower hardness than hardness of the probe tip of the probe. | 11-13-2008 |
| 20080210663 | METHOD FOR MANUFACTURING A PROBE - The present invention provides a probe manufacturing method in which, after a metal material for a probe is deposited on a base table, the probe can be detached from the base table relatively easily. A sacrificial layer is formed on a base table. The sacrificial layer is partially removed so as to form a recess in the sacrificial layer. A mask that exposes an area formed in a desired probe flat surface shape containing the recess is formed on the sacrificial layer. A probe material exhibiting different etching resistance characteristics from those of the sacrificial layer is deposited in the area exposed from the mask. By the deposition of the material, a coupling portion corresponding to the recess and a probe that is integral with the coupling portion are formed. After the mask is removed, the sacrificial layer is removed with use of etchant. Thereafter, the probe held on the base table at the coupling portion is detached from the base table together with the coupling portion. | 09-04-2008 |
| 20080197869 | ELECTRICAL CONNECTING APPARATUS - To restrain misregistration of tips due to change in temperature, an electrical connecting apparatus is used for connection of a tester, and electrical connection terminals of a device under test to undergo electrical test by the tester. The electrical connecting apparatus comprises a probe board having a plurality of probe lands on its underside; and a plurality of contacts having tip portions to be brought into contact with a base end portion fixed at the respective probe lands and the connection terminals of the device under test. The measure from the tip of each contact and the probe land ranges from 1.1 to 1.3 mm, and the coefficient of thermal expansion of the probe board is greater than the coefficient of thermal expansion of the device under test within the range from 1 to 2 ppm/° C. | 08-21-2008 |
