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KABUSHIKI KAISHA MEIKI SEISAKUSHO
Aichi, JP
| KABUSHIKI KAISHA MEIKI SEISAKUSHO Patent applications | ||
| Patent application number | Title | Published |
|---|---|---|
| 20080217802 | Filling Method and Filling Apparatus of Powder-Particle Material in Compression Molding - Powder-particle material in compression molding is transferred using air suction power and filled thinly, evenly and rapidly in a female mold. An adsorption pad | 09-11-2008 |