JX NIPPON MINING AND METALS CORPORATION Patent applications |
Patent application number | Title | Published |
20130015061 | Sputtering Target of Nonmagnetic-Particle-Dispersed Ferromagnetic Material - A sputtering target of nonmagnetic-particle-dispersed ferromagnetic material is provided having a phase (A) such that nonmagnetic particles are dispersed in a ferromagnetic material formed from a Co—Cr alloy containing 5 at % or more and 20 at % or less of Cr and Co as the remainder thereof, and schistose textures (B) with a short side of 30 to 100 μm and a long side of 50 to 300 μm formed from a Co—Cr alloy phase in the phase (A); wherein each of the foregoing nonmagnetic particles has such a shape and size that the particle is smaller than all hypothetical circles with a radius of 1 μm around an arbitrary point within the nonmagnetic particle, or a shape and size with at least two contact points or intersection points between the respective hypothetical circles and the interface of the ferromagnetic material and the nonmagnetic material. | 01-17-2013 |
20130001079 | Sputtering Target of Nonmagnetic-Particle-Dispersed Ferromagnetic Material - A sputtering target of nonmagnetic-particle-dispersed ferromagnetic material is provided having a phase (A) such that nonmagnetic particles are dispersed in a ferromagnetic material formed from a Co—Cr alloy containing 5 at % or more and 20 at % or less of Cr and Co as the remainder thereof, and schistose textures (B) with a short side of 30 to 100 μm and a long side of 50 to 300 μm formed from a Co—Cr alloy phase in the phase (A); wherein each of the foregoing nonmagnetic particles has such a shape and size that the particle is smaller than all hypothetical circles with a radius of 1 μm around an arbitrary point within the nonmagnetic particle, or a shape and size with at least two contact points or intersection points between the respective hypothetical circles and the interface of the ferromagnetic material and the nonmagnetic material. | 01-03-2013 |
20120148862 | Copper Foil for Printed Circuit Board and Copper Clad Laminate for Printed Circuit Board - A copper foil for a printed circuit board is provided. The copper foil includes a layer including nickel, zinc, a compound of nickel and that of zinc (hereinafter referred to as a “nickel zinc layer”) on a roughened surface of a copper foil and a chromate film layer on the nickel zinc layer. The zinc add-on weight per unit area of the nickel zinc layer is 180 μg/dm | 06-14-2012 |
20120132531 | Process and Apparatus for Producing a Metal Covered Polyimide Composite - A metal covered polyimide composite comprising a tie-coat layer and a metal seed layer formed on a surface of a polyimide film by electroless plating or a drying method is provided. A copper layer or a copper alloy layer is formed thereon by electroplating. The copper plated layer or copper alloy plated layer includes three layers to one layer of the copper layer or copper alloy layer. The metal covered polyimide composite effectively prevents peeling in a non-adhesive flexible laminate (especially a two-layer flexible laminate), and more particularly, effectively inhibits peeling from the interface of a copper layer and tin plating. A method of producing the composite and apparatus for producing the composite are also provided. | 05-31-2012 |