| Joinset Co., Ltd. Patent applications |
| Patent application number | Title | Published |
|---|
| 20120026659 | CERAMIC CHIP ASSEMBLY - Provided is a ceramic chip assembly configured to economically and reliably insulate an exposed portion of a metal lead wire from an environmental change. The ceramic chip assembly includes a ceramic base having electrical characteristics, a pair of external electrodes that are disposed on a pair of surfaces of the ceramic base, respectively, the surfaces of the ceramic base being opposed to each other, a pair of metal lead wires as single cores having first ends that are electrically and mechanically connected to the external electrodes, respectively, by an electrical conductive adhesive member, an insulation sealant sealing the ceramic base, the external electrodes, and the first ends of the metal lead wires to expose second ends of the metal lead wires, and an insulation polymer coating layer continuously formed on both the insulation sealant and portions of the metal lead wires exposed out of the insulation sealant. | 02-02-2012 |
| 20110290451 | HEAT COOLER - Provided is a heat cooler configured to rapidly cool a heat-generating device by transferring heat generated from the heat-generating device to an outside area. The heat cooler includes a heat conductive body having a predetermined volume and sealing members. The body includes a plurality of penetration holes formed through top and bottom surfaces of the body. The sealing members are hermetically coupled to the top and bottom surfaces of the body. The bores are sealed with the sealing members to form independent accommodation portions, and a plurality of heat conductive beads and a refrigerant are filled in the accommodation portions in a state where the refrigerant permeates between the heat conductive beads. | 12-01-2011 |
| 20110284271 | HEAT SINK - A heat sink capable of being surface-mounted, the heat sink having a 3D shape and comprising a body made of metal, having a rear side which is horizontal and a front side which is at least partially horizontal, such that the front side is partially surface-mounted on a conductive pattern of a printed circuit board (PCB) by pick-and-place and the rear side is attached to the conductive pattern by reflow-soldering. | 11-24-2011 |
| 20110266031 | ELASTIC ELECTRIC CONTACT TERMINAL - Disclosed is an elastic electric contact terminal including an elastic foam core having a sheet form, a non-foam rubber coating layer adhered to upper and lower surfaces of the elastic foam core and continued along any one side surface of the elastic foam core, and a heat-resistant polymer film, one side of which is adhered to the non-foam rubber coating layer in an enclosing manner and the other side of which is integrally formed with a metal layer. | 11-03-2011 |
| 20110206886 | MULTIPURPOSE ADHESIVE TAPE - A multipurpose adhesive tape with minimized curling is provided. The adhesive tape includes a base formed as a thin sheet, an adhesive attached to the reverse surface of the base, and a projection projecting along the length of the outer surface of the base within a portion of the width thereof. | 08-25-2011 |
| 20110188226 | SHIELD APPARATUS FOR EMI SHIELDING - A shield apparatus for EMI (ElectroMagnetic Interference) shielding is provided. The shield apparatus includes a case and a metal clip. The case is box-shaped with at least one open side, and has a recess defined from the open side into a sidewall. The metal clip is housed in the recess, and is resiliently inserted on the sidewall to retain a certain height. | 08-04-2011 |
| 20100090332 | CERAMIC CHIP ASSEMBLY - A ceramic chip assembly is provided. The ceramic chip assembly includes a ceramic base, a plurality of external electrodes, a pair of cylindrical metal lead wires, and an insulating protection material. The ceramic base has electrical characteristics of a semiconductor. The pair of external electrodes is oppositely formed on both side surfaces of the ceramic base, respectively. The cylindrical metal lead wire has one end thereof electrically and mechanically connected to the external electrodes by an electrical conductive adhesive, respectively, and has an external diameter identical to or greater than the thickness of the ceramic base. The insulating protection material includes a pair of insulating films and an insulating coating layer. | 04-15-2010 |
| 20090108984 | CERAMIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - Provided are a ceramic component and a method of manufacturing the ceramic component. The ceramic component includes a previously fired insulation ceramic base, a functional ceramic sheet bonded to the insulation ceramic base by a diffusion bonding layer having an anchoring structure, internal electrodes embedded into the functional ceramic sheet, and external electrodes connected to the internal electrodes. A functional ceramic paste corresponding to the functional ceramic sheet is applied to the insulation ceramic base and is dried to form a functional ceramic film. The functional ceramic film is pressed against the insulation ceramic base to anchor functional ceramic film into the insulation ceramic base for sure attachment. The functional ceramic film is fired to allow functional oxide materials included in the functional ceramic film to permeate the insulation ceramic base by solid diffusion to form the diffusion bonding layer and to change the functional ceramic film into the functional ceramic sheet. | 04-30-2009 |
| 20090096569 | Ceramic Component Element And Ceramic Component And Method For The Same - A ceramic component element is provided. The ceramic component element includes: an insulating ceramic base with pores formed on its surface and previously fired; and a functional ceramic sheet bonded to the insulating ceramic base and having electrical characteristics. The functional ceramic sheet is physically bonded to the insulating ceramic base by forming pressing a green sheet for the functional ceramic sheet on the insulating ceramic base at constant temperature and pressure so that parts of the green sheet are forced to put into the pores and anchored, and the functional ceramic sheet is chemically bonded to the insulating ceramic base by firing the anchored green sheet in such a manner that functional oxides of the green sheet penetrate the insulating ceramic base by solid diffusion to form a diffusion bonding layer. | 04-16-2009 |
