Inventors list |
Assignees list |
Classification tree browser |
Top 100 Inventors |
Top 100 Assignees |
Jiangsu Changjiang Electronics Technology Co., Ltd
| Jiangsu Changjiang Electronics Technology Co., Ltd Patent applications | ||
| Patent application number | Title | Published |
|---|---|---|
| 20080315412 | Package Structure with Flat Bumps for Integrate Circuit or Discrete Device and Method of Manufacture the Same - The invention discloses a novel package structure of integrate circuit or discrete device and packaging method, and includes the lead pins adjacent to the island; another metal layer formed at the bottom of the island; another metal layer formed at the bottom of lead pins; chip mounted on the island; wires bonded between the chip and the lead pins; the molded body encapsulating the top surface and side surface of the island and the lead pins, small protrusions of the island and the lead pins below the molded body; in the individual package, the number of the island can be one or more, lead pins can be arrayed at one side of the island, also can be arrayed at two sides or three sides of the island, one or two rows of lead pins can be located around the island. The invention provides strong welding, good quality, low cost, smooth production, wide applicability, flexible arrangement of the chips. | 12-25-2008 |
| 20080258273 | Package Structure With Flat Bumps For Electronic Device and Method of Manufacture the Same - The invention discloses an ultra thin package structure of leadless electronic device and the packaging method, and includes lead support base adjacent to the chip support base; chip mounted on the chip support base; wires bonded between chip and lead support base; the molded body encapsulating the top surface and side surface of the chip support base, small protrusions of the chip support base and lead support base below the molded body; in the individual package, the number of the chip support base island can be one or more, the lead pins can be arrayed at one side of the island, also can be arrayed at two sides or three sides of the island, one or two rows of lead pins can be located around the island. | 10-23-2008 |