JFE PRECISION CORPORATION
JFE PRECISION CORPORATION Patent applications | ||
Patent application number | Title | Published |
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20120186800 | HEAT SINK FOR ELECTRONIC DEVICE AND PROCESS FOR PRODUCTION THEREOF - A heat sink for an electronic device includes a Cr—Cu alloy layer including a Cu matrix and more than 30 mass % and not more than 80 mass % of Cr; and Cu layers provided on top and rear surfaces of the Cr—Cu alloy layer. | 07-26-2012 |