Japan Unix Co., Ltd. Patent applications |
Patent application number | Title | Published |
20090321394 | METHOD AND APPARATUS FOR LASER SOLDERING - In accordance with an aspect of the invention, a solder paste feeding device feeds solder paste to a ring-like terminal surrounding a through-hole and a rod terminal fitted in the through-hole so as to fill in the through-hole, the laser beam irradiation device irradiates the solder past with a laser beam, and wire solder is further fed from above the solder past at the same time as melting of the solder paste is started, thereby fusing the wire solder and the solder paste to solder the ring-like terminal and the rod terminal. | 12-31-2009 |
20090294412 | LASER TYPE SOLDERING APPARATUS - A laser type soldering apparatus which performs soldering by projecting a laser beam on a to-be-soldered object, a portion of a plurality of optical lenses is a corn lens, wherein an incident surface or a emitting surface of the corn lens is a conical surface, and a central portion of the corn lens has a central hole having a diameter smaller than that of a circular laser beam that is incident to the corn lens, and the corn lens converts the circular laser beam to a double circular beam having a ring portion with a circular ring shape and a spot portion located at a center of the ring portion, so that the double circular beam is projected on the to-be-soldered object. | 12-03-2009 |