IXYS Semiconductor GmbH Patent applications |
Patent application number | Title | Published |
20130021759 | Power Semiconductor Module with Asymmetrical Lead Spacing - A power semiconductor has power terminals arranged in a row at one side of the housing, with control terminals arranged in a row at the other side of the housing. The spacing between adjacent power terminals is greater than the spacing between adjacent control terminals. | 01-24-2013 |
20120305281 | Method of Joining Metal-Ceramic Substrates to Metal Bodies - A method of joining a metal-ceramic substrate having metallization on at least one side to a metal body by using metal alloy is disclosed. The metal body has a thickness of less than 1.0 mm and the metal alloy contains aluminium and has a liquidus temperature of greater than 450° C. The resulting metal-ceramic module provides a strong bond between the metal body and the ceramic substrate. The resulting module is useful as a circuit carrier in electronic appliances, with the metal body preferably functioning as cooling body. | 12-06-2012 |
20110303348 | Method for the Manufacture of Double-Sided Metallized Ceramic Substrates - The invention relates to a method for the manufacture of double-sided metallized ceramic substrates according to the direct-bonding process. The method enables a ceramic substrate to be bonded to a metal plate or foil on the upper side and the underside in only one process sequence. The composite to be bonded is located on a specially designed carrier structured on the upper side with a plurality of contact points. After the bonding process the composite of metal plates and ceramic substrate can be detached from the carrier free of any residue. | 12-15-2011 |