| ISHIHARA CHEMICAL CO., LTD. Patent applications |
| Patent application number | Title | Published |
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| 20110139626 | ELECTROLYTIC COPPER COATING, METHOD OF MANUFACTURING THE SAME, AND COPPER ELECTROLYTE FOR MANUFACTURING ELECTROLYTIC COPPER COATING - An object of the present invention is to provide an electrolytic copper coating that exhibits a bendability and flexibility equal to or better than those of rolled copper foil after the heat history in a circuit board fabrication process, especially after a heat history equivalent to the heat history applied when bonding with a polyimide film. The present invention provides an electrolytic copper coating and a method of manufacturing the same wherein, when performing heat treatment so that the LMP value shown in Equation 1 becomes 9000 or more, the result becomes a crystal distribution of crystal grains, having a maximum length of crystal grains after heat treatment of 10 μm or more, of 70% or more: | 06-16-2011 |
| 20090321269 | SILVER AND SILVER ALLOY PLATING BATH - To develop stable, non-cyanide silver and silver alloy plating baths. The present invention is a silver and silver alloy plating bath, comprises: (A) a soluble salt, comprising a silver salt or a mixture of a silver salt and a salt of a metal selected from the group consisting of tin, bismuth, cobalt, antimony, iridium, indium, lead, copper, iron, zinc, nickel, palladium, platinum, and gold; and (B) at least one aliphatic sulfide compound comprising a functionality selected from the group consisting of an ether oxygen atom, a 3-hydroxypropyl group, and a hydroxypropylene group, with the proviso that the aliphatic sulfide compound does not comprise a basic nitrogen atom. | 12-31-2009 |
| 20090274833 | METALLIC INK - A metallic ink including a vehicle, a multiplicity of copper nanoparticles, and an alcohol. The conductive metallic ink may be deposited on a substrate by methods including inkjet printing and draw-down printing. The ink may be pre-cured and cured to form a conductor on the substrate. | 11-05-2009 |
| 20090242854 | ADDITIVES AND MODIFIERS FOR SOLVENT- AND WATER-BASED METALLIC CONDUCTIVE INKS - A conductive ink includes metallic nanoparticles, a polymeric dispersant, and a solvent. The polymeric dispersant may be ionic, non-ionic, or any combination of ionic and non-ionic polymeric dispersants. The solvent may include water, an organic solvent, or any combination thereof. The conductive ink may include a stabilizing agent, an adhesion promoter, a surface tension modifier, a defoaming agent, a leveling additive, a rheology modifier, a wetting agent, an ionic strength modifier, or any combination thereof. | 10-01-2009 |
| 20090139372 | Production method of pure metal/alloy super-micro powder - It is to propose a method of producing super-micro powders of pure metal-alloy in which cheap materials can be used and the production is efficient. In the production method of pure metal super-micro powder by heating a starting material containing a metal chloride and reducing the resulting vapor of the metal chloride with hydrogen gas, an elementary metal constituting the metal chloride is added to the starting material containing the metal chloride and a metal chloride having a large valence among metal chlorides having two or more valence is used as the metal chloride. Also, in the production method of alloy super-micro powder, a metal chloride is used as one to (number of all alloying components—1) alloying components in the starting material and an elemental metal is used as the other alloying component. | 06-04-2009 |
