| Interplex NAS, Inc. Patent applications |
| Patent application number | Title | Published |
|---|
| 20090239398 | PRESS FIT (COMPLIANT) TERMINAL AND OTHER CONNECTORS WITH TIN-SILVER COMPOUND - A tin-silver press-fit interconnect which includes a press-fit terminal having a coating or finish of a tin-silver compound for use with a terminal receiving device. The tin-silver compound serves to prevent the formation of tin whiskers which appear most frequently in pure tin coated electrical components under mechanical stress and which make the electronic device susceptible to short circuits. The tin-silver compound may include between 85 and 99.5% weight of tin and between 0.5 and 15% weight of silver and is applied at a thickness range between 0.4 and 5 microns using a technique such as electroplating, hot dip or immersion. | 09-24-2009 |
| 20090173517 | SOLDER WIRE CONSTRUCTION - A solder construction carrier device for connecting electrical components including a carrier with a plurality of compartments and a solder construction disposed in each of the plurality of compartments. Each solder construction includes a conductive wire and a solder component disposed adjacent to the conductive wire. | 07-09-2009 |
| 20090127982 | PLANAR SPRING ASSEMBLY WITH ATTACHED SOLDER STRIP AND METHOD FOR MAKING SAME - There is disclosed for use with a piezoelectric stack, first and second side electrodes, each side electrode having two serpentine shape members positioned in a common plane, where the two serpentine shape members of an electrode have alternately spaced conductive fingers which project outward toward each other. The conductive fingers are adapted to be electrically coupled to the ends of alternate ones of internal electrode layers of the piezoelectric stack. The undersides of the conductive fingers which contact the ends of the internal electrodes are provided with a solder material to provide good electrical contact by applying the soldered finger to the internal electrode and applying heat to reflow the solder. The serpentine shape of the side electrodes here disclosed provides high flexibility which can absorb displacement of the internal electrodes as they move up, down, in and out as the piezoelectric layers of the stack expand and contract. This flexibility helps to avoid electrical contact separation between the side electrodes and the internal electrodes. | 05-21-2009 |
| 20090017324 | METHOD AND APPARATUS FOR DIE CASTING OF PARTS - A cold-chamber die-casting apparatus and method for making a die-cast part with an open space within the geometry of the part. The apparatus includes an injection shaft which receives molten material for casting the part. The molten material is pushed with a plunger through a gate and into a tool cavity corresponding to the part. The gate is disposed at an end of the injection shaft and adjacent the tool cavity at a position that corresponds to the open space of the part and is inside the geometry of the part. | 01-15-2009 |
