| 20090152568 | Method for packaging submount adhering light emitting diode and package structure thereof - A method for packaging submount adhering LED comprises providing a first substrate which has an upper surface, a lower surface forming a plurality of heat-dissipating cavities and a plurality of die-attaching regions defined on the upper surface. Each of the heat-dissipating cavities corresponds to the die-attaching region and has a bottom surface, wherein there is a carrier base located between the bottom surface and the die-attaching region. Next, a heat conductor is formed in the heat-dissipating cavity and a plurality of LEDs are disposed on the die-attaching regions of the first substrate. Then, a second substrate is provided which has a first surface facing to the upper surface of the first substrate, a second surface opposite to the first surface and a plurality of reflective slots communicating with the first and second surfaces. Each of the reflective slots corresponds to the LED and the die-attaching region and couples the first and second substrates thereby allowing each of the LEDs to be located in the reflective slot. | 06-18-2009 |
