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International Business Mechines Corporation

International Business Mechines Corporation Patent applications
Patent application numberTitlePublished
20100073893MINIMIZING PLATING STUB REFLECTIONS IN A CHIP PACKAGE USING CAPACITANCE - Embodiments of the present invention are directed to shifting the resonant frequency in a high-frequency chip package away from an operational frequency by connecting a capacitance between an open-ended plating stub and ground. One embodiment provides a multi-layer substrate for interfacing a chip with a printed circuit board. A first outer layer provides a chip mounting location. A signal interconnect is spaced from the chip mounting location, and a signal trace extends from near the chip mounting location to the signal interconnect. A chip mounted at the chip mounting location may be connected to the signal trace by wirebonding. A plating stub extends from the signal interconnect, such as to a periphery of the substrate. A capacitor is used to capacitively couple the plating stub to a ground layer.03-25-2010
20100027423Controlling Data Flow Through A Data Communications Link - Controlling data flow through a data communications link, the link operating according to a data communications protocol in which a receiver of data communications on the link can suspend data communications on the link for a period of time determined by the receiver, including specifying for the sender a duration for flow control periods; specifying for the sender a number of corrupt communications control packets to be transmitted from the sender to the receiver during a flow control period; determining by the sender whether a flow control message is received from the receiver during a flow control period; altering, in dependence upon whether a flow control message is received from the receiver during a flow control period, the number of corrupt communications control packets; and transmitting, among normal data communications during a subsequent flow control period, the altered number of corrupt communications control packets from the sender to the receiver.02-04-2010