Inventors list |
Assignees list |
Classification tree browser |
Top 100 Inventors |
Top 100 Assignees |
International Business Machines Corporation (Yorktown)
| International Business Machines Corporation (Yorktown) Patent applications | ||
| Patent application number | Title | Published |
|---|---|---|
| 20090032962 | CENTRIFUGAL METHOD FOR FILING HIGH ASPECT RATIO BLIND MICRO VIAS WITH POWDERED MATERIALS FOR CIRCUIT FORMATION - The present disclosure relates generally to semiconductor, integrated circuits, and particularly, but not by way of limitation, to centrifugal methods of filling high-aspect ratio vias and trenches with powders, pastes, suspensions of materials to act as any of a conducting, structural support, or protective member of an electronic component. | 02-05-2009 |