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Interconnect Portfollo LLC
| Interconnect Portfollo LLC Patent applications | ||
| Patent application number | Title | Published |
|---|---|---|
| 20110215475 | MULTI-SURFACE IC PACKAGING STRUCTURES - An IC package having multiple surfaces for interconnection with interconnection elements making connections from the IC chip to the I/O terminations of the package assembly which reside on more than one of its surfaces and which make interconnections to other devices or assemblies that are spatially separated. | 09-08-2011 |