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INTEL CORPORATION (A DELAWARE CORPORATION)
| INTEL CORPORATION (A DELAWARE CORPORATION) Patent applications | ||
| Patent application number | Title | Published |
|---|---|---|
| 20080254611 | INTERCONNECTION DESIGNS AND MATERIALS HAVING IMPROVED STRENGTH AND FATIGUE LIFE - Methods and designs for increasing interconnect areas for interconnect bumps are disclosed. An interconnect bump may be formed on a substrate such that the interconnect bump extends beyond a contact pad onto a substrate. An interconnect bump may be formed on a larger contact pad, the bump having a large diameter. | 10-16-2008 |