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INSTITUTE OF NATIONAL COLLEGES OF TECHNOLOGY, JP
Hachiouji-shi, Tokyo, JP
| INSTITUTE OF NATIONAL COLLEGES OF TECHNOLOGY, JP Patent applications | ||
| Patent application number | Title | Published |
|---|---|---|
| 20100157612 | HEAT RADIATING MEMBER, CIRCUIT BOARD USING THE HEAT RADIATING MEMBER, ELECTRONIC COMPONENT MODULE, AND METHOD OF MANUFACTURING THE ELECTRONIC COMPONENT MODULE - A circuit board using a heat radiating member that can cool an electronic component sufficiently without causing a substrate to break, increasing the total weight of the substrate, lowering the productivity, or increasing cost and device size. A circuit board has a substrate main body ( | 06-24-2010 |