INSTITUTE OF NATIONAL COLLEGES OF TECHNOLOGY, JP
Hachiouji-shi, Tokyo, JP
INSTITUTE OF NATIONAL COLLEGES OF TECHNOLOGY, JP Patent applications | ||
Patent application number | Title | Published |
---|---|---|
20130081515 | METHOD FOR RECOVERING METAL COPPER FROM COATED COPPER WIRES - [Object] A technique is provided which selectively recovers a useful substance from waste including a chlorine-containing synthetic resin and metal copper in a mixed state. | 04-04-2013 |
20100157612 | HEAT RADIATING MEMBER, CIRCUIT BOARD USING THE HEAT RADIATING MEMBER, ELECTRONIC COMPONENT MODULE, AND METHOD OF MANUFACTURING THE ELECTRONIC COMPONENT MODULE - A circuit board using a heat radiating member that can cool an electronic component sufficiently without causing a substrate to break, increasing the total weight of the substrate, lowering the productivity, or increasing cost and device size. A circuit board has a substrate main body ( | 06-24-2010 |