Innovative Sensor Technology IST AG Patent applications |
Patent application number | Title | Published |
20160025660 | Thermal flow sensor for determining a gas or the composition of a gas mixture as well as its flow velocity - A thermal flow sensor for determining a gas or the composition of a gas mixture as well as its flow velocity, comprising: a substrate onto which at least a first dielectric layer is applied; at least one heating structure that is applied onto the first dielectric layer and serves to heat the gas or the gas mixture; at least a first temperature sensor element that is applied onto the first dielectric layer at a distance from the heating structure and captures the temperature of the gas or gas mixture heated at the heating structure; a control device that controls the heating structure in a first operating mode in such a way that the heating structure shows a predetermined temperature, and controls the heating structure in a second operating mode in such a way that a power input into the heating structure corresponds to a predetermined power; and an evaluation unit which determines at least one physical characteristic of the gas present or the gas mixture on the basis of the operating modes and determines the gas present or the composition of the gas mixture as well as its flow velocity on the basis of this physical characteristic. | 01-28-2016 |
20110189491 | APPARATUS FOR DETERMINING AND/OR MONITORING A PROCESS VARIABLE - The invention relates to an apparatus for determining and/or monitoring at least one process variable. The apparatus includes: At least one substrate ( | 08-04-2011 |
20100117784 | RESISTANCE THERMOMETER - A resistance thermometer, composed of a plurality of components, at least comprising: at least one substrate, which is composed essentially of a material, whose thermal coefficient of expansion is essentially greater than 10.5 ppm/K; at least one resistive element, which is arranged on the substrate; and at least one electrically insulating, separating layer, which is arranged essentially between the resistive element and the substrate. The invention includes that the effective thermal coefficient of expansion TCE | 05-13-2010 |