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INFINEON TECHNOLOGIES NORTH AMERICAN CORP.

Milpitas, CA US

INFINEON TECHNOLOGIES NORTH AMERICAN CORP. Patent applications
Patent application numberTitlePublished
20110070732METHOD OF SILICIDE FORMATION BY ADDING GRADED AMOUNT OF IMPURITY DURING METAL DEPOSITION - A method is provided for forming a metal semiconductor alloy that includes providing a deposition apparatus that includes a platinum source and a nickel source, wherein the platinum source is separate from the nickel source; positioning a substrate having a semiconductor surface in the deposition apparatus; forming a metal alloy on the semiconductor surface, wherein forming the metal alloy comprises a deposition stage in which the platinum source deposits platinum to the semiconductor surface at an initial rate at an initial period that is greater than a final rate at a final period of the deposition stage, and the nickel source deposits nickel to the semiconductor surface; and annealing the metal alloy to react the nickel and platinum with the semiconductor substrate to provide a nickel platinum semiconductor alloy.03-24-2011
20100321656TRANSMISSION MASK WITH DIFFERENTIAL ATTENUATION TO IMPROVE ISO-DENSE PROXIMITY - A system and method to compensate for the proximity effects in the imaging of patterns in a photolithography process. A light exposure of a photoresist layer is effectuated in predetermined patterns through an exposure mask having light-transmissive openings in correspondence to the predetermined patterns. The exposure mask has areas densely populated with the light-transmissive openings and areas sparsely populated with the light-transmissive openings. Light is attenuated through the densely populated light-transmissive openings by a different amount than through the sparsely populated light-transmissive openings.12-23-2010