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INDUSTRIAL TECHNOLOGY RESEARCH INSITITUTE

Hsinchu, TW

INDUSTRIAL TECHNOLOGY RESEARCH INSITITUTE Patent applications
Patent application numberTitlePublished
20080311699PHASE-CHANGE MEMORY AND FABRICATION METHOD THEREOF - A phase-change memory comprises a bottom electrode formed on a substrate. A first isolation layer is formed on the bottom electrode. A top electrode is formed on the isolation layer. A first phase-change material is formed in the first isolation layer, wherein the top electrode and the bottom electrode are electrically connected via the first phase-change material. Since the phase-change material can have a diameter less than the resolution limit of the photolithography process, an operating current for a state conversion of the phase-change material pattern may be reduced so as to decrease a power dissipation of the phase-change memory device.12-18-2008