20090039382 | LIGHT EMITTING DIODE PACKAGE STRUCTURE - A light emitting diode (LED) package structure includes a substrate, an LED, a heat conducting layer, and a lead layer. The substrate is provided with a recess, in which the LED is disposed. The heat conducting layer is plated on outer surfaces of the substrate for transferring heat energy generated by the LED. The lead layer is formed on an outer side of the heat conducting layer and is electrically connected to the LED. In the embodiment, the heat conducting layer is made of a diamond material, which has high heat conductivity to enable quick transfer of heat energy generated by the LED to an external environment, so that the LED is protected against overheating and shortened service life. | 02-12-2009 |