| IBIDEN, CO., LTD. Patent applications |
| Patent application number | Title | Published |
|---|
| 20130132046 | SIMULATION DEVICE, SIMULATION SYSTEM, METHOD OF SIMULATION AND PROGRAM - A simulation system ( | 05-23-2013 |
| 20130118138 | HOLDING SEALING MATERIAL, METHOD FOR PRODUCING HOLDING SEALING MATERIAL, AND EXHAUST GAS PURIFYING APPARATUS - A holding sealing material includes a mat, an inorganic binder and an organic binder. The mat includes inorganic fibers and has an upper part, a center part, and a lower part in a thickness direction. The inorganic binder is loaded on the mat. The organic binder is loaded mainly on the upper part and the lower part of the mat. The holding sealing material is disposed between an exhaust gas-treating body and a casing for housing the exhaust gas-treating body to form an exhaust gas purifying apparatus. | 05-16-2013 |
| 20130112469 | MULTILAYER PRINTED WIRING BOARD AND MANUFACTURING METHOD OF MULTILAYER PRINTED WIRING BOARD - This invention provides a multilayer printed wiring board in which electric connectivity and functionality are obtained by improving reliability and particularly, reliability to the drop test can be improved. No corrosion resistant layer is formed on a solder pad | 05-09-2013 |
| 20130081866 | PRINTED WIRING BOARD - A printed wiring board includes a core substrate having a penetrating hole, a first conductive layer on a first surface of the substrate, a second conductive layer on a second surface of the substrate, a first electronic component having an electrode and accommodated in the hole such that the electrode faces the first surface, a first structure on the first surface and including a pad for mounting a second electronic component on the first structure and a via conductor connected to the electrode, and a second structure on the second surface. The electrode has an upper surface facing toward the first surface, the first layer has an upper surface facing away from the first surface, and the first component is positioned in the hole such that the upper surface of the electrode forms a gap with the upper surface of the first layer. | 04-04-2013 |
| 20130075147 | PRINTED WIRING BOARD - A printed wiring board includes a core insulation layer including a resin and having a via conductor through the core insulation layer, a first conductive layer formed on the core layer and including a copper foil and a plated film, an interlayer insulation layer formed on the first layer and including a resin, the interlayer layer having a via conductor through the interlayer layer, and a second conductive layer formed on the interlayer layer and including a copper foil and a plated film. The first layer includes a conductive circuit, the core and interlayer layers have dielectric constants of 4.0 or lower for signal transmission at frequency of 1 GHz and thermal expansion coefficient of 85 ppm/° C. or lower at or below Tg, and the foil of the first layer has thickness greater than thickness of the foil of the second layer. | 03-28-2013 |
| 20130075140 | PRINTED WIRING BOARD - A printed wiring board includes a core insulation layer having via conductors through the core layer, a first structure including an interlayer insulation layer on first surface of the core layer and having via conductors through the interlayer layer in the first structure, and a second structure including an interlayer insulation layer on second surface of the core layer and having via conductors through the interlayer layer in the second structure. The interlayer layers have dielectric constants set to be 4.0 or lower for signal transmission at frequency of 1 GHz, the core layer has thermal expansion coefficient at or below Tg set lower than thermal expansion coefficients of the interlayer layers at or below Tg, the coefficient of the core layer at or below Tg is set to be 75 ppm/° C. or lower, and the conductors in the interlayer layers are stacked on the conductors in the core layer. | 03-28-2013 |
| 20130074973 | EXHAUST PIPE AND METHOD FOR MANUFACTURING EXHAUST PIPE - An exhaust pipe includes a base material, a surface coating layer, and an information display. The base material is made of a metal. The surface coating layer is provided on a surface of the base material. The surface coating layer includes an amorphous inorganic material. The information display includes a character portion and a background portion. At least one of the character portion and the background portion is located in the surface coating layer. | 03-28-2013 |
| 20130068339 | EXHAUST PIPE - An exhaust pipe includes a metal base material and a surface coating layer formed on a surface of the metal base material. The surface coating layer contains an inorganic glass base material and has a concave portion and a convex portion on a surface of the surface coating layer. The concave portion is lower than a first reference surface. The first reference surface has an average height of the surface of the surface coating layer. The convex portion is located on a peripheral edge portion of the concave portion and surrounds the concave portion. The convex portion is higher than the first reference surface. | 03-21-2013 |
| 20130056134 | METHOD FOR CUTTING HONEYCOMB MOLDED BODY AND METHOD FOR MANUFACTURING HONEYCOMB STRUCTURE - A method for cutting a honeycomb molded body includes applying laser in a wavelength range of from about 0.7 μm to about 2.5 μm to the honeycomb molded body to form a cut guide groove on a periphery of the honeycomb molded body. The honeycomb molded body is made of a material including silicon carbide. The honeycomb molded body is manufactured by extrusion molding. The honeycomb molded body has a number of cells, a cell wall interposed between the cells and a peripheral wall formed on a side face of the honeycomb molded body. The cells are placed in parallel with one another in a longitudinal direction of the cells. The honeycomb molded body is cut along the cut guide groove to a predetermined length using a wire. | 03-07-2013 |
| 20130025925 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board has a first rigid wiring board having an accommodation portion, a second rigid wiring board accommodated in the accommodation portion, an insulation layer formed over the first rigid wiring board and the second rigid wiring board, and a joint conductor extending in a direction from a first surface of the first rigid wiring board to a second surface of the first rigid wiring board on the opposite side of the first surface of the first rigid wiring board such that the joint conductor is penetrating through the boundary between the first rigid wiring board and the second rigid wiring board and joining the first rigid wiring board and the second rigid wiring board. | 01-31-2013 |
| 20130025914 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board has wiring board has a first rigid wiring board having an accommodation portion and a conductor, a second rigid wiring board accommodated in the accommodation portion and having a conductor electrically connected to the conductor in the first rigid wiring board, and an insulation layer formed over the first rigid wiring board and the second rigid wiring board. The first rigid wiring board has a wall surface defining the accommodation portion and having a concavo-convex shaped portion, and the second rigid wiring board has a side surface facing against the wall surface of the first rigid wiring board and having a concavo-convex shaped portion such that the concavo-convex shaped portion of the side surface of the second rigid wiring board engages with the concavo-convex shaped portion of the wall surface of the first rigid wiring board. | 01-31-2013 |
| 20130020120 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board has a laminated structure having a recessed portion on a first-surface side of the laminated structure and a solder resist layer on a second-surface side of the laminated structure on the opposite side of the first-surface side. The laminated structure has a first-surface side pad formed in the bottom of the recessed portion and a second-surface side pad formed on the second-surface side of the laminated structure, the solder resist layer has a first opening portion and a second opening portion formed in the solder resist layer, the first opening portion is exposing the second-surface side pad, the second opening portion is formed on a back face of the recessed portion, and the back face of the recessed portion does not include the second-surface side pad. | 01-24-2013 |
| 20130020116 | PRINTED WIRING BOARD - A printed wiring board has a packaging substrate having multiple pads, and a transmission substrate mounted on the multiple pads of the packaging substrate. The packaging substrate has a pad group constituted of pads which mount an electronic component, the multiple pads mounting the transmission substrate includes a first pad positioned in a peripheral portion of the packaging substrate and a second pad positioned between the first pad and the pad group, the second pad is electrically connected to a signal pad of the pads in the pad group, and the transmission substrate includes a horizontal wiring which electrically connects the second pad and the first pad and which transmits a signal between the second pad and the first pad. | 01-24-2013 |
| 20130014982 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board has a first wiring board having a first solder-resist layer, a second wiring board connected to the first wiring board and positioned in a first opening portion formed in the first solder-resist layer of the first wiring board, and a third wiring board connected to the first wiring board and positioned in a second opening portion formed in the first solder-resist layer of the first wiring board such that the second wiring board and the third wiring board are on the same side of the first wiring board. The first opening portion of the first wiring board and the second opening portion of the first wiring board form either a common opening portion accommodating the second and third wiring boards in the first solder-resist layer or separate opening portions separately accommodating the second wiring board and the third wiring board in the first solder-resist layer. | 01-17-2013 |
| 20130008702 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A printed wiring board includes a core substrate having a penetrating hole penetrating through the core substrate and having a first insulation layer, a second insulation layer and an insulative substrate interposed between the first and second layers, a first circuit formed on a surface of the core, a second circuit formed on opposite surface of the core, and a through-hole conductor formed in the penetrating hole of the core and connecting the first and second circuits. The penetrating hole has first and second opening portions, the first opening portion becomes thinner from the first surface toward the second surface, the second opening portion becomes thinner from the second surface toward the first surface, and the first and second insulation layers are comprised of resin materials easier to be processed by laser than resin material of the insulative substrate under same conditions of the laser. | 01-10-2013 |
| 20130008701 | MULTILAYER PRINTED WIRING BOARD - A multilayered printed circuit board including a substrate, a multilayered structure formed on the substrate and including multiple conductor circuits and multiple interlaminar resin insulating layers, and a stack-via structure having multiple via-holes and formed in the multilayered structure such that the via-holes are piled through the interlaminar resin insulating layers in the multilayered structure. The interlaminar resin insulating layers include an outermost interlaminar resin insulating layer forming an outermost layer of the interlaminar resin insulating layers and having a coefficient of linear expansion which is equal to or smaller than coefficients of linear expansion of the interlaminar resin insulating layers other than the outermost interlaminar resin insulating layer. | 01-10-2013 |
| 20120328857 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A method for manufacturing a printed wiring board includes laminating a first core substrate and a second core substrate, forming a first upper buildup layer on a surface of the first core substrate, forming a second upper buildup layer on a surface of the second core substrate, separating the first core substrate and the second core substrate from each other, laminating the first upper buildup layer formed on the first core substrate and the second upper buildup layer formed on the second core substrate, forming a first lower buildup layer on the opposite surface of the first core substrate, forming a second lower buildup layer on the opposite surface of the second core substrate, and separating the first upper buildup layer and the second upper buildup layer. | 12-27-2012 |
| 20120325524 | FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A flex-rigid wiring board has a first rigid wiring board having a first inner layer and a first terminal on the first inner layer, a second rigid wiring board having a second inner layer and a second terminal on the second inner layer, and a flexible wiring board connecting the boards and having third and fourth terminals on the flexible board. The first and second boards have openings and are positioned such that the boards are spaced apart and form a recess portion formed of the openings facing each other, the flexible board is in the recessed portion such that the first terminal is connected to the third terminal and the second terminal is connected to the fourth terminal, and the first board has an interlayer conductor through an insulation layer in the first board such that the conductor is not directly under the first terminal. | 12-27-2012 |
| 20120315213 | METHOD FOR PRODUCING GRAPHITE MATERIAL AND GRAPHITE MATERIAL - There is provided a method for producing a graphite material and a graphite material produced by the method The method includes a kneading step of adding a hydrophobic binding material to a first carbonaceous raw material containing coke powder, followed by heat kneading to obtain a mixture, a pulverizing step of pulverizing the mixture obtained in the kneading step to obtain a second carbonaceous raw material, a granulating step of obtaining a granulated powder using the second carbonaceous raw material obtained in the pulverizing step, a hydrophilic binding material and a solvent, a molding step of subjecting the granulated powder obtained in the granulating step to cold isostatic press molding to obtain a molded body, a burning step of burning the molded body obtained in the molding step to obtain a burnt product, and a graphitizing step of graphitizing the burnt product obtained in the burning step. | 12-13-2012 |
| 20120314389 | WIRING BOARD AND METHOD FOR MANUFACTURING SAME - A wiring board has a core structure having a first surface and a second surface on the opposite side of the first surface of the core structure, a first buildup structure formed on the first surface of the core structure and having insulation layers and conductive layers, and a second buildup structure formed on the second surface of the core structure and having insulation layers, conductive layers and an inductor device. The conductive layers in the second buildup structure include conductive patterns forming the inductor device, and one or more of the conductive patterns forming the inductor device has the thickness which is greater than the thicknesses of the conductive layers in the first buildup structure. | 12-13-2012 |
| 20120311982 | HOLDING SEALING MATERIAL, EXHAUST GAS PURIFYING APPARATUS, AND METHOD FOR MANUFACTURING EXHAUST GAS PURIFYING APPARATUS - A holding sealing material includes a plurality of mats and at least one belt-shaped body. The plurality of mats include inorganic fibers and are layered. The plurality of mats are bundled by the at least one belt-shaped body. The at least one belt-shaped body has no fixing force which fixes the plurality of mats to the at least one belt-shaped body. | 12-13-2012 |
| 20120306608 | WIRING BOARD AND METHOD FOR MANUFACTURING SAME - A wiring board includes a core structure having a first surface and a second surface on the opposite side of the first surface, a first buildup structure formed on the first surface of the core structure and including insulation layers, and a second buildup structure formed on the second surface of the core structure and including insulation layers and an inductor device. The insulation layers in the second buildup structure have the thicknesses which are thinner than the thicknesses of the insulation layers in the first buildup structure, and the inductor device in the second buildup structure is position on the second surface of the core structure and includes at least a portion of a conductive pattern formed in the core structure. | 12-06-2012 |
| 20120304458 | METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD - A method for manufacturing a printed wiring board includes preparing a core substrate having first and second surfaces, forming a penetrating hole from the first surface toward the second surface of the substrate, forming first conductor on the first surface of the substrate, forming second conductor on the second surface of the substrate, and filling conductive material in the hole such that through-hole conductor connecting the first and second conductors is formed. The forming of the hole includes forming a first opening portion on the first-surface side of the substrate, a second opening portion from the bottom of the first portion toward the second surface, and a third opening portion from the bottom of the second portion toward the second surface, and the forming of the hole satisfies X | 12-06-2012 |
| 20120302010 | MULTILAYER PRINTED WIRING BOARD - A method for manufacturing a printed wiring board includes forming an uncalcined layer containing a raw ceramic material on a first metal layer, firing the uncalcined layer formed on the first metal layer such that a high dielectric constant layer having a ceramic body calcined in a sheet form is formed on the first metal layer, forming a second metal layer on the high dielectric constant layer on the opposite side of the high dielectric constant layer with respect to the first metal layer such that a layered capacitor having the high dielectric constant layer and first and second layer electrodes sandwiching the high dielectric constant layer is formed, and disposing the layered capacitor in a main body. | 11-29-2012 |
| 20120291276 | FLEX-RIGID WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a flex-rigid wiring board includes positioning a flexible board and a non-flexible substrate adjacent to each other, forming a metal layer over the flexible board such that the metal layer is formed to stop laser irradiation from reaching into the flexible board, forming an insulating layer such that the insulating layer covers the metal layer, the flexible board and the non-flexible substrate, irradiating laser upon the insulating layer such that a portion of the insulating layer covering the metal layer is cut; and removing the portion of the insulating layer covering the metal layer from the flexible board such that at least a portion of the flexible board is exposed. | 11-22-2012 |
| 20120287586 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a substrate having an opening portion, multiple electronic devices positioned in the opening portion, and an insulation layer formed on the substrate such that the insulation layer covers the electronic devices in the opening portion of the substrate. The substrate has a wall surface defining the opening portion and formed such that the opening portion is partially partitioned and the electronic devices are kept from making contact with each other. | 11-15-2012 |
| 20120279770 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing printed wiring board including preparing an electronic component having first and second surfaces and electrode on the first surface, forming in an adhesive tape a mark, mounting based on the mark the component on the tape such that the second surface faces the adhesive of the tape, forming another mark on insulative substrate having first and second surfaces, forming in the substrate an opening larger than the component, mounting based on the marks the substrate on the tape such that the component is in the opening of the substrate, fixing the component to the substrate using resin, forming an insulation layer on the first surface of the substrate where the component is accommodated, removing the tape, forming in the layer an opening reaching the electrode, forming a conductive circuit on the layer, and forming in the opening of the layer a via connected to the electrode. | 11-08-2012 |
| 20120266998 | EXHAUST PIPE PAINT AND EXHAUST PIPE - An exhaust pipe paint includes an inorganic particle, at least one of an inorganic binder and an inorganic binder precursor, and an inorganic glass particle. The inorganic glass particle includes a low-melting glass having a softening temperature lower than a softening temperature of the inorganic binder. The low-melting glass includes at least one of soda-lime glass, alkali-free glass, borosilicate glass, potash glass, lead crystal glass, barium glass, boron glass, strontium glass, alumina silica glass, soda zinc glass, and soda barium glass. | 10-25-2012 |
| 20120264596 | HONEYCOMB STRUCTURE AND METHOD OF MANUFACTURING HONEYCOMB STRUCTURE - A honeycomb structure includes a substantially pillar-shaped honeycomb unit having cells defined by cell walls. The cell walls include silicon carbide particles having a nitrogen-containing layer provided on surfaces of the silicon carbide particles. A method of manufacturing a honeycomb structure includes preparing paste containing silicon carbide particles. The paste is molded to form a honeycomb molded body. The honeycomb molded body is fired in an inert atmosphere containing no nitrogen to obtain a substantially pillar-shaped honeycomb unit having cells defined by cell walls. The honeycomb unit is heated in an environment containing nitrogen to provide a nitrogen-containing layer on surfaces of the silicon carbide particles forming the cell walls. | 10-18-2012 |
| 20120261021 | EXHAUST PIPE - An exhaust pipe includes an exhaust pipe base and a surface coat layer. The surface coat layer is provided on the exhaust pipe base and includes an inorganic glass layer, an inorganic particle, and an inorganic binder. In the inorganic glass layer, a part of the inorganic binder is diffused and the inorganic particle and the rest of the inorganic binder in particulate form are dispersed. The inorganic glass layer includes at least one of SiO | 10-18-2012 |
| 20120252658 | HONEYCOMB STRUCTURE AND METHOD OF MANUFACTURING HONEYCOMB STRUCTURE - A honeycomb structure includes a honeycomb unit containing zeolite and an inorganic binder and having a plurality of cell walls to define a plurality of cells extending from a first end face to a second end face of the honeycomb unit along a longitudinal direction of the honeycomb unit. The honeycomb unit is manufactured by molding and firing raw material paste containing zeolite particles and the inorganic binder. The zeolite particles have a D50 of approximately 3.6 μm or more. An average pore size of the cell walls is more than or equal to approximately 0.10 μm and less than or equal to approximately 0.50 μm. An average particle size of the cell walls is more than or equal to approximately 3.6 μm and less than or equal to approximately 7.0 μm. | 10-04-2012 |
| 20120251767 | HONEYCOMB STRUCTURE - A honeycomb structure includes a plurality of honeycomb fired bodies. Each of the plurality of honeycomb fired bodies is combined with one another by an adhesive layer interposed between the honeycomb fired bodies to form a ceramic body. Each of the honeycomb fired bodies has a peripheral wall around each of the honeycomb fired bodies and has a plurality of cells each of which extends along a longitudinal direction of the honeycomb fired body and in parallel with one another. The cells are separated from one another with a cell wall disposed between the cells. The ceramic body includes at least one center-high-heat-capacity honeycomb fired body which is a honeycomb fired body having a heat capacity per unit volume in a central part in a plane perpendicular to the longitudinal direction larger than a heat capacity per unit volume in a peripheral part in the plane. | 10-04-2012 |
| 20120251419 | EXHAUST GAS CONVERSION SYSTEM AND EXHAUST GAS CONVERSION METHOD - An exhaust gas conversion system includes an oxide catalyst, a filter, a selective catalytic reduction catalyst and an ammonia supplying device. The filter has a honeycomb structural body including a honeycomb unit. The selective catalytic reduction catalyst has a honeycomb structural body including a honeycomb unit. The oxide catalyst, the filter and the selective catalytic reduction catalyst are sequentially arranged in a direction in which an exhaust gas flows. A ratio of an area of a cross section of the selective catalytic reduction catalyst perpendicular to a longitudinal direction of the selective catalytic reduction catalyst with respect to an area of a cross section of the filter perpendicular to a longitudinal direction of the filter is approximately 0.55 or more and approximately 0.90 or less. The area of the cross section of the filter is approximately 300 cm | 10-04-2012 |
| 20120251402 | HONEYCOMB STRUCTURE AND EXHAUST GAS PURIFYING APPARATUS - A honeycomb structure includes a ceramic block including a plurality of honeycomb fired bodies. Each of the plurality of honeycomb fired bodies includes large volume cells and small volume cells. Either one of the end portions of each of the large volume cells and the small volume cells is plugged. An aperture in the cross section in a central part of the honeycomb structure is about 65% or more. A ratio of an aperture of the first end face to an aperture of the second end face of the honeycomb structure is about 1.4 or more. Each of the cell walls except the peripheral walls has a thickness of about 0.1 mm to about 0.2 mm. The honeycomb structure has a diameter of about 200 mm or more. A ratio of a length to the diameter of the honeycomb structure is about 1.0 or less. | 10-04-2012 |
| 20120251401 | HONEYCOMB STRUCTURE, METHOD OF MANUFACTURING HONEYCOMB STRUCTURE, AND EXHAUST GAS CONVERTER - A honeycomb structure includes a honeycomb unit having a plurality of through holes defined by partition walls along a longitudinal direction of the honeycomb unit. The honeycomb unit is manufactured by molding raw material paste by extrusion molding and thereafter by firing the molded raw material paste. The raw material paste contains zeolite obtained by ion-exchange with iron ions and an inorganic binder. A specific surface area of the zeolite is more than or equal to approximately 500 m | 10-04-2012 |
| 20120251400 | HONEYCOMB STRUCTURAL BODY AND EXHAUST GAS CONVERSION APPARATUS - A honeycomb structural body includes at least one honeycomb unit including a β type zeolite, a phosphate group zeolite, and an inorganic binder and having a plurality of through holes divided by partition walls and arranged in a longitudinal direction of the honeycomb unit. The β type zeolite includes secondary particles having an average particle diameter of approximately 0.5 μm or more and approximately 5 μm or less. The phosphate group zeolite includes primary particles having an average particle diameter of approximately 0.5 μm or more and approximately 5 μm or less. A ratio of a mass of the phosphate group zeolite with respect to a total mass of the β type zeolite and the phosphate group zeolite is approximately 5% or more and approximately 35% or less. | 10-04-2012 |
| 20120250281 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board includes a core substrate having first and second surfaces, a first conductor formed on the first surface of the substrate, a second conductor formed on the second surface of the substrate, a first through-hole conductor formed through the substrate and connecting the first and second conductors, and a second through-hole conductor formed through the substrate and connecting the first and second conductors. The second through-hole conductor has a diameter which is greater than a diameter of the first through-hole conductor, the first through-hole conductor has a roughened inner wall forming an interior space, the second through-hole conductor has a roughened inner wall forming an interior space, and the roughened inner wall of the first through-hole conductor has an arithmetic average roughness which is set lower than an arithmetic average roughness of the roughened inner wall of the second through-hole conductor. | 10-04-2012 |
| 20120250277 | PRINTED WIRING BOARD - A printed wiring board includes a core substrate having a penetrating hole extending through the core substrate, an electronic component accommodated in the penetrating hole of the core substrate, a filler resin filling clearance between the component and the core substrate, a first resin insulation layer formed on the component and a first surface of the core substrate, and a second resin insulation layer formed on the component and a second surface of the core substrate on the opposite side of the first surface of the core substrate. The filler resin has elastic modulus which is set to be lower than 0.2 Gpa and thermal expansion coefficient which is set to be higher than 100 ppm and lower than 200 ppm, and the core substrate has elastic modulus which is set to be higher than 30 Gpa, and thermal expansion coefficient which is set to be lower than 10 ppm. | 10-04-2012 |
| 20120247823 | PACKAGE-SUBSTRATE-MOUNTING PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board includes an interlayer insulation layer, first pads positioned to mount a semiconductor element and forming a first pad group on the insulation layer, second pads forming a second pad group on the insulation layer and positioned along a peripheral portion of the first group, a first solder-resist layer formed on the insulation layer and having first openings exposing the first pads, respectively, and second openings exposing the second pads, respectively, conductive posts formed on the second pads through the second openings of the first solder-resist layer, respectively, and a second solder-resist layer formed on the first solder-resist layer and having a third opening exposing the first pads and fourth openings exposing surfaces of the posts, respectively. The second openings have a diameter greater than a diameter of the posts, and the second solder-resist layer is filling gaps formed between the second openings and the posts. | 10-04-2012 |
| 20120247818 | PRINTED WIRING BOARD - A printed wiring board includes a core substrate, a first conductive layer on a first surface of the substrate, a second conductive layer on a second surface of the substrate, and a through-hole conductor connecting the first and second conductive layers. The substrate has an insulation structure and a metal layer, the metal layer has opening through which the conductor passes and has side wall recessed into the metal layer and forming the opening, the structure has first resin layer on one side of the metal layer, second resin layer on the opposite side and filler filling the opening, the conductor has first portion in the first layer and second portion in the second layer, the first and second portions are connected in the filler, the first portion is tapered from the first toward second conductive layers, and the second portion is tapered from the second toward first conductive layers. | 10-04-2012 |
| 20120247813 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A method for manufacturing a printed wiring board includes preparing a metal sheet having metal members and connectors joining the metal members, forming a structure having core substrates which are connected through the connectors and which have insulation structure portions covering the metal members, respectively, cutting the connectors in the structure such that an independent core substrate having a recessed portion is formed and a respective one of the connectors is removed from the independent core substrate, and covering the recess portion of the independent core substrate with a resin. The covering of the recess portion includes either forming an interlayer insulation layer on a surface of the independent core substrate or forming interlayer insulation layers on opposing surfaces of the independent core substrate. | 10-04-2012 |
| 20120247662 | MULTI-PIECE BOARD AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a multi-piece board having a frame section and a multiple piece sections connected to the frame section includes forming a frame section from a manufacturing panel for the frame section, sorting out multiple acceptable piece sections by inspecting quality of piece sections, forming notch portions in the frame section and the acceptable piece sections such that the notch portions allow the acceptable piece sections to be arranged with respect to the frame section, provisionally fixing the piece sections and the frame section in respective positions, injecting an adhesive agent into cavities formed by the notch portions when the frame section and the piece sections are provisionally fixed to each other, and joining the acceptable piece sections with the frame section by curing the adhesive agent injected into the cavities. | 10-04-2012 |
| 20120247091 | EXHAUST GAS CONVERSION SYSTEM AND EXHAUST GAS CONVERSION METHOD - An exhaust gas conversion system includes an oxide catalyst, a filter, a selective catalytic reduction catalyst and an ammonia supplying device. The oxide catalyst, the filter and the selective catalytic reduction catalyst are sequentially arranged in a direction in which an exhaust gas flows in an exhaust path of a diesel engine. The ammonia supplying device is positioned between the oxide catalyst and the filter and configured to supply ammonia. | 10-04-2012 |
| 20120246925 | METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD - A method for manufacturing a printed wiring board includes preparing a core substrate having a first surface and a second surface on the opposite side of the first surface, forming on the first-surface side of the substrate a first opening portion tapering from the first toward second surface, forming on the second-surface side of the substrate a second opening portion tapering from the second toward first surface, forming a third opening portion such that a penetrating hole formed of the first opening portion, the second opening portion and the third opening portion connecting the first and second opening portions is formed in the substrate, forming a first conductor on the first surface of the substrate, forming a second conductor on the second surface of the substrate, and filling a conductive material in the penetrating hole such that a through-hole conductor connecting the first and second conductors is formed. | 10-04-2012 |
| 20120246924 | METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD - A method for manufacturing a printed wiring board includes preparing a core substrate having a metal layer having a first penetrating hole and insulation layers formed on the metal layer such that the metal layer is interposed between the insulation layers, forming in the core substrate a second penetrating hole having a first opening portion aligned with the first penetrating hole on a first-surface side of the core substrate and a second opening portion aligned with the first penetrating hole on a second-surface side of the core substrate, forming a first conductor on a first surface of the core substrate, forming a second conductor on a second surface of the core substrate on the opposite side of the first surface of the core substrate, and filling a conductive material in the second penetrating hole such that a through-hole conductor connecting the first conductor and the second conductor is formed. | 10-04-2012 |
| 20120241205 | WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A wiring board with a built-in electronic component includes a substrate having an accommodation portion, an electronic component having an electrode and accommodated in the accommodation portion of the substrate, a conductive layer having a planar conductive pattern formed over the electrode of the electronic component, and one or more via conductors connecting the planar conductive pattern of the conductive layer and the electrode of the electronic component. The electrode of the electronic component has a portion which faces the planar conductive pattern of the conductive layer and which has a plurality of outer edges facing outward with respect to a surface of the electronic component on which the portion of the electrode is formed, and the planar conductive pattern of the conductive layer has a portion positioned directly over one or more of the outer edges of the electrode of the electronic component. | 09-27-2012 |
| 20120234685 | METHOD FOR PRODUCING EXHAUST PIPE - A method for producing an exhaust pipe includes electrocoating a surface of a metal base material with a paint to form a coat film. The paint includes inorganic glass particles and an electrocoating resin. The coat film is heated to a first temperature that is not lower than a burning-out temperature of the electrocoating resin. The coat film is heated, after heating the coat film to the first temperature, to a second temperature that is not lower than a softening point of the inorganic glass particles to produce the exhaust pipe which includes the metal base material and a surface coating layer formed on the surface of the metal base material. | 09-20-2012 |
| 20120234684 | PAINT COMPOSITION FOR HEAT RELEASING PRODUCTS - A paint composition for heat releasing products includes inorganic glass particles and an organic binder. The organic binder includes an electrocoating resin. The paint composition is to be applied to a base material made of a metal. The electrocoating resin preferably has a weight ratio of from about 1.0 to about 3.5 based on a weight of the inorganic glass particles. The paint composition preferably further includes inorganic particles. | 09-20-2012 |
| 20120229990 | MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD - A printed wiring board has a metal layer, a resin structure having a first resin layer portion formed on a first surface of the metal layer, a second resin layer portion formed on a second surface of the metal layer, and a filler resin portion filling an opening portion of the metal layer, a first circuit formed on the first resin portion, a second circuit formed on the second resin portion, and a through-hole conductor formed through the first resin, filler resin and second resin portions and connecting the first and second circuits. The through-hole conductor has a first portion narrowing from the first circuit toward the second resin portion and a second portion narrowing from the second circuit toward the first resin portion, and the first portion is connected to the second portion at a connected position shifted from the middle point of the thickness of the metal layer. | 09-13-2012 |
| 20120229342 | ANTENNA DEVICE - An antenna device has a substrate having a first surface and a second surface on the opposite side of the first surface, a first-surface-side conductive layer formed on the first surface of the substrate, a second-surface-side conductive layer formed on the second surface of the substrate, and through hole conductors connecting the first-surface-side conductive layer and the second-surface-side conductive layer. The first-surface-side conductive layer and the second-surface-side conductive layer are formed such that the first-surface-side conductive layer and the second-surface-side conductive layer are connected via the through hole conductors in a crank form from the first surface to second surface of the substrate. | 09-13-2012 |
| 20120228795 | CERAMIC SUBSTRATE SUPPORTING MEMBER AND METHOD OF MANUFACTURING CERAMIC MEMBER - There is provided a ceramic substrate supporting member configured to support a ceramic substrate at a tip portion thereof and used for forming a ceramic member coat on the ceramic substrate to manufacture a ceramic member in a reaction furnace. The ceramic substrate supporting member includes a core formed of graphite, and a supporting member coat formed at a surface including at least the tip portion with a pyrolytic carbon layer interposed between the core and the supporting member coat. | 09-13-2012 |
| 20120228109 | SENSOR, KEYBOARD AND METHOD FOR MANUFACTURING SENSOR - A sensor includes a first printed wiring board having a first electrode made of a metal film, a second printed wiring board facing the first printed wiring board and having a second electrode made of a metal film, the second electrode being positioned on the second printed wiring board such that the second electrode faces the first electrode of the first printed wiring board, and a dielectric body spacing the first electrode and the second electrode apart such that the first electrode, the second electrode and the dielectric body form a capacitor. | 09-13-2012 |
| 20120228012 | CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD - A circuit board includes an insulation layer having a first surface and a second surface on the opposite side of the first surface, an electronic component positioned in the insulation layer and having a terminal, a conductive pattern formed on the second surface of the insulation layer and electrically connected to the terminal, and an insulative film formed on the second surface of the insulation layer and on the conductive pattern. The terminal of the electronic component has a protruding portion which protrudes from the second surface of the insulation layer. | 09-13-2012 |
| 20120227261 | METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A method for manufacturing a printed wiring board includes forming on a support board a first resin insulation layer, forming a second resin insulation layer on the first resin insulation layer, forming in the second resin insulation layer an opening portion in which an electronic component having an electrode is mounted, accommodating the electronic component in the opening portion of the second resin insulation layer such that the electrode of the electronic component faces an opposite side of the first resin insulation layer, forming on the first surface of the second resin insulation layer and the electronic component an interlayer resin insulation layer, and forming in the interlayer resin insulation layer a via conductor reaching to the electrode of the electronic component. | 09-13-2012 |
| 20120217607 | WIRING BOARD WITH BUILT-IN IMAGING DEVICE AND METHOD FOR MANUFACTURING SAME - A wiring board with a built-in imaging element includes a substrate having an accommodation portion and a first surface and a second surface on the opposite side of the first surface, an imaging device having a light receiver and positioned in the accommodation portion of the substrate such that the light receiver faces the first surface of the substrate, and a buildup structure formed on the first surface of the substrate and having insulation layers and conductive layers. The buildup structure has an opening portion formed such that the light receiver of the imaging device is exposed from the opening portion of the buildup structure, and the insulation layers in the buildup structure include a first insulation layer formed on the first surface of the substrate. | 08-30-2012 |
| 20120217049 | WIRING BOARD WITH BUILT-IN IMAGING DEVICE - A wiring board with a built-in imaging element including a substrate having an accommodation portion, an imaging device having a light receiver and positioned in the accommodation portion such that the light receiver faces a first surface of the substrate, first insulation layers having an opening portion and formed on the first surface of the substrate such that the light receiver is exposed from the opening portion, and second insulation layers formed on a second surface of the substrate. The first insulation layers include a first insulation layer, the second insulation layers include a second insulation layer, the second insulation layer is positioned at a predetermined tier and has a thermal expansion coefficient which is set lower than that of the first insulation layer at a predetermined tier such that imbalance in thermal expansion and contraction between the first and second insulation layers is substantially offset or mitigated. | 08-30-2012 |
| 20120213944 | METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A method for manufacturing a printed wiring board including forming a penetrating hole in a core substrate, forming a first conductor on a first surface of the substrate, forming a second conductor on a second surface of the substrate, and filling a conductive material in the hole such that a through-hole conductor is formed in the hole and the first and second conductors are connected via the through-hole conductor. The forming of the hole includes forming a first opening in the first surface, forming a second opening from the bottom of the first opening toward the second surface such that the second opening has a smaller diameter than the first opening, forming a third opening in the second surface, and forming a fourth opening from the bottom of the third opening toward the first surface such that the fourth opening has a smaller diameter than the third opening. | 08-23-2012 |
| 20120212919 | INDUCTOR COMPONENT AND PRINTED WIRING BOARD INCORPORATING INDUCTOR COMPONENT AND METHOD FOR MANUFACTURING INDUCTOR COMPONENT - A printed wiring board includes a core substrate having a cavity and having first and second surfaces, an inductor component accommodated in the cavity, a filler resin filling a gap formed between the substrate and component in the cavity, and a buildup layer formed on the first surface of the substrate and the component. The component has a coil layer, a second insulation layer formed on the coil layer, an electrode formed on the substance layer, and a via conductor formed in the substance layer and connecting the coil layer and the electrode, the component is accommodated in the cavity such that the electrode faces the first surface of the substrate, and the buildup layer includes an interlayer insulation layer formed on the first surface of the substrate and the component, a conductive layer formed on the insulation layer, and a connection via conductor connecting the conductive layer and electrode. | 08-23-2012 |
| 20120211370 | METHOD FOR MANUFACTURING WIRING BOARD - A method for manufacturing a wiring board including forming an insulative resin layer, forming a power-supply layer on the insulative resin layer, forming a conductive layer made of electrolytic plating and having a conductive pattern on the power-supply layer such that the power-supply layer has an exposed portion not covered by a conductive portion of the conductive pattern, and irradiating the exposed portion of the power-supply layer with laser having a wavelength in a range of approximately 350 nm to approximately 600 nm at a pulse width in a range of approximately 0.1 picosecond to approximately 1,000 picoseconds such that the exposed portion of the power-supply layer is removed from the insulative resin layer. | 08-23-2012 |
| 20120208441 | END FACE PROCESSING APPARATUS, END FACE PROCESSING SYSTEM, END FACE PROCESSING METHOD FOR HONEYCOMB MOLDED BODY, AND MANUFACTURING METHOD FOR HONEYCOMB STRUCTURE - The end face processing apparatus of the present invention is an end face processing apparatus for processing the cut face of a cut ceramic molded body, which comprises an air blowing outlet and an extraneous material removal member, and is configured to remove burrs remaining on the cut face from the time of cutting as well as powder adhering to the cut face and on the periphery thereof using the extraneous material removal member and air from the air blowing outlet. | 08-16-2012 |
| 20120202953 | GAS SEPARATION MEMBRANE - A gas separation membrane is provided which has both excellent gas permeability and gas separation characteristics, particularly permeability of carbon dioxide (CO | 08-09-2012 |
| 20120202045 | STRUCTURE AND METHOD OF MANUFACTURING STRUCTURE - A structure includes a base material made of metal and a surface coating layer provided on a surface of said base material. The surface coating layer includes a first layer provided on the surface of said base material and a second layer provided directly or indirectly on the first layer as an outermost layer of said surface coating layer. The first layer contains an amorphous inorganic material. The second layer contains a crystalline inorganic material having a softening point of about 950° C. or higher. | 08-09-2012 |
| 20120199389 | METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD - A method for manufacturing a printed wiring board, in which filled vias with a reduction in faulty connections are formed, and providing such a printed wiring board. After an electroless plated film is formed on an inner wall of a via opening, electrolytic plating is performed on insulative resin base material; the via opening is filled with plating metal and a filled via is formed. Therefore, during electrolytic plating, a plating metal is deposited from electroless plated film on the side wall of the via opening as well as from the bottom of the via opening. As a result, the via opening may be completely filled through electrolytic plating, forming a filled via with a reduction in faulty connections. | 08-09-2012 |
| 20120199386 | MULTILAYER PRINTED WIRING BOARD - A printed wiring board including a core substrate having a metal layer, a first resin insulation layer on a surface of the metal layer and a second resin insulation layer on the opposite surface of the metal layer, a first conductive circuit formed on the first layer, a second conductive circuit formed on the second layer, and a through-hole conductor formed in a penetrating hole through the substrate and connecting the first and second circuits. The metal layer has an opening filled with a filler resin, the penetrating hole has a first opening in the first layer, a second opening in the second layer and a third opening in the filler resin, the first opening tapers toward the filler resin, the second opening tapers toward the filler resin, and the third opening is connecting the first and second openings. | 08-09-2012 |
| 20120199291 | MANUFACTURING METHOD OF PRINTED WIRING BOARD AND A LAMINATE JOINTING APPARATUS - This invention provides a manufacturing method of printed wiring board which enables a plate-like substrate to be carried and processed without any contact to its product surface. End portions of plate-like copper clad laminates are overlapped vertically and then joined linearly by rotating an ultrasonic horn along the end portions. Consequently, copper foils can be metal-joined and a joining strength necessary for transportation with a roller is obtained. Because belt-like copper clad laminate is obtained by joining the plate-like copper clad laminates and after that, processed, thus, the belt-like copper clad laminate can be carried without any contact to its product surface as it is carried with the roller, and then processed. | 08-09-2012 |
| 20120193780 | SEMICONDUCTOR MOUNTING DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MOUNTING DEVICE - A semiconductor mounting device including a first substrate having first insulation layers, first conductor layers formed on the first insulation layers and via conductors connecting the first conductor layers, a second substrate having a core substrate, second conductor layers, through-hole conductors and buildup layers having second insulation layers and third conductor layers, first bumps connecting the first and second substrates and formed on the outermost first conductor layer on the outermost first insulation layer, and second bumps positioned to connect a semiconductor element and formed on the outermost third conductor layer on the outermost second insulation layer. The second substrate has greater thickness than the first substrate, the second conductor layers are formed on surfaces of the core substrate, respectively, the through-hole conductors are formed through the core substrate and connecting the second conductor layers, and the buildup layers are formed on the core substrate and second conductor layers, respectively. | 08-02-2012 |
| 20120188734 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board including an insulative substrate having a cavity portion, an electronic device positioned in the cavity portion of the insulative substrate, an interlayer insulation layer made of an insulative material and formed on the insulative substrate and on the electronic device, and a conductive layer having a conductive pattern and formed on the interlayer insulation layer. The insulative substrate has a gap formed with respect to the electronic device in the cavity portion, the gap between the electronic device in the cavity portion and the insulative substrate is filled with an insulator made of the insulative material derived from the interlayer insulation layer, and the conductive pattern of the conductive layer has an enlarged-width portion across and directly over the gap. | 07-26-2012 |
| 20120186868 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board having a penetrating hole formed by forming holes with different shapes from both surfaces of a substrate. In such a penetrating hole, the depth of a first opening portion formed in the first-surface side of the substrate is shallower than the depth of a second opening portion formed in the second-surface side, and the diameter of a first opening is greater than the diameter of a second opening. Even if the gravity line of the first opening portion and the gravity line of the second opening portion are shifted from each other, the region of the second opening portion inserted into the inner space of the first opening portion may be made larger. | 07-26-2012 |
| 20120186867 | MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD - A multi-layer printed circuit board including a first insulating layer, a first conductor layer having circuits on one surface of the first insulating layer, a second conductor layer having circuits on the opposite surface of the first insulating layer, a second insulating layer on the second conductor and first insulating layers, and a third conductor layer having circuits on the second insulating layer on the opposite side of the second conductor layer. The first and second insulating layers have first and second via holes formed in openings of the first and second insulating layers and made of conductive materials filling the openings such that circuits in the first and third conductor layers are connected to one or more circuits in the second conductor layer, and the first and second via holes have bottom ends facing the second conductor layer and top ends larger than the bottom ends. | 07-26-2012 |
| 20120186866 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a core substrate having an opening portion and a through hole adjacent to the opening portion, a capacitor positioned in the opening portion, and a through-hole conductor formed in the through hole of the core substrate and having a conductor filling the through hole. The core substrate has a first surface and a second surface on the opposite side of the first surface, the opening portion of the core substrate penetrates from the first surface to the second surface, the through-hole conductor has a first conductive portion and a second conductive portion connected to the first conductive portion in the core substrate, the first conductive portion of the through-hole conductor becomes narrower from the first surface toward the second surface, and the second conductive portion of the through-hole conductor becomes narrower from the second surface toward the first surface. | 07-26-2012 |
| 20120186861 | WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A wiring board with a built-in electronic component includes a substrate having an opening portion and having a first surface and a second surface on the opposite side of the first surface, and an electronic component having a third surface and a fourth surface on the opposite side of the third surface and positioned in the opening portion of the substrate such that the third surface faces the same direction as the first surface of the substrate. The electronic component has a curved surface joining the fourth surface and a side surface of the electronic component, and the opening portion of the substrate has a tapered portion formed by a tapered surface of the substrate joining an inner wall of the opening portion and the first surface and tapering from the first surface toward the second surface. | 07-26-2012 |
| 20120186455 | METHOD OF MANUFACTURING EXHAUST GAS PURIFYING APPARATUS AND EXHAUST GAS PURIFYING APPARATUS - A method of manufacturing an exhaust gas purifying apparatus includes providing an exhaust gas-treating body. A holding sealing material is provided. The holding sealing material includes inorganic fibers. The holding sealing material has a first end face and a second end face each provided approximately in parallel with a width direction. The holding sealing material is wound around a periphery of the exhaust gas-treating body to form a gap between the first end face and the second end face. The exhaust gas-treating body with the holding sealing material is housed in a casing. At least one of a first electrode member and a first sensor is disposed at the gap of the holding sealing material so that at least one of the first electrode member and the first sensor is connected to the exhaust gas-treating body, passes through the holding sealing material, and penetrates the casing. | 07-26-2012 |
| 20120186239 | HOLDING SEALING MATERIAL, AND ELECTRICALLY HEATING EXHAUST GAS PURIFYING APPARATUS - A holding sealing material includes an inorganic fiber sheet having inorganic fibers interlaced with one another, and a water-proof insulation sheet containing a flaky inorganic material. An electrically heating exhaust gas purifying apparatus includes an exhaust gas-treating body made of a resistance heating body, a metal casing to house the exhaust gas-treating body and a holding sealing material. The exhaust gas purifying apparatus includes a first electrode and a second electrode. The first and second electrode each penetrate through the metal casing and the holding sealing material, and have a first end part bonded to the exhaust gas-treating body and a second end part exposed outside of the metal casing. The holding sealing material includes an inorganic fiber sheet which has inorganic fibers interlaced with one another, and a water-proof insulation sheet containing a flaky inorganic material. | 07-26-2012 |
| 20120186211 | HONEYCOMB FILTER FOR PURIFYING EXHAUST GASES, ADHESIVE, COATING MATERIAL, AND MANUFACTURING METHOD OF HONEYCOMB FILTER FOR PURIFYING EXHAUST GASES - A honeycomb filter includes a ceramic laminated body including columnar porous ceramic members and an adhesive layer combining the columnar porous ceramic members with one another. The columnar porous ceramic members each have a partition wall and through holes, the through holes extend in parallel with one another in a length direction of the columnar porous ceramic members, the partition wall separates the through holes and filters particulates in an exhaust gas, and the adhesive layer includes an inorganic binder, an inorganic fiber, inorganic particles and an inorganic balloon. | 07-26-2012 |
| 20120186210 | HOLDING SEALING MATERIAL, EXHAUST GAS PURIFYING APPARATUS, AND METHOD FOR MANUFACTURING EXHAUST GAS PURIFYING APPARATUS - A holding sealing material includes inorganic fibers, a mat shape, a first and a second end faces, a contact section and a void-forming section. The first end face and the second end face are approximately parallel in a width direction. The contact section includes a first distance between the first and the second end faces. The first distance is longest in a length direction. The void-forming section includes a second distance between the first and the second end faces. The second distance is shorter than the first distance. The holding sealing material has a structure to provide a void in a vicinity of the first and the second end faces of the void-forming section in a state where the holding sealing material is rolled up so that the first end face is made in contact with the second end face of the contact section. | 07-26-2012 |
| 20120186209 | HOLDING SEALING MATERIAL, EXHAUST GAS PURIFYING APPARATUS, AND METHOD OF MANUFACTURING EXHAUST GAS PURIFYING APPARATUS - A holding sealing material includes inorganic fibers, a mat shape, a first end face and a second end face and a penetration portion. The mat shape has a width direction, a length direction and a thickness direction. The first end face and the second end face are each provided approximately in parallel with the width direction. The penetration portion penetrates the holding sealing material in the thickness direction. | 07-26-2012 |
| 20120181738 | ELECTRONIC PART POSITIONING JIG - An electronic part positioning jig is provided, which includes a positioning member which is made of carbon and positions an element part, and a platform which supports the positioning member on a plane. The platform includes a frame member which receives the positioning member, and a body portion which fixes the frame member. The positioning member is sandwiched between the frame member and the body portion so as to be displaceable on the body portion by the frame member being fixed to the body portion by a joining member. | 07-19-2012 |
| 20120181708 | SUBSTRATE FOR MOUNTING SEMICONDUCTOR, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A substrate for mounting a semiconductor includes a first insulation layer having first and second surfaces on the opposite sides and having a penetrating hole penetrating through the first insulation layer, an electrode formed in the penetrating hole in the first insulation layer and having a protruding portion protruding from the second surface of the first insulation layer, a first conductive pattern formed on the first surface of the first insulation layer and connected to the electrode, a second insulation layer formed on the first surface of the first insulation layer and the first conductive pattern and having a penetrating hole penetrating through the second insulating layer, a second conductive pattern formed on the second insulation layer and for mounting a semiconductor element, and a via conductor formed in the penetrating hole in the second insulation layer and connecting the first and second conductive patterns. | 07-19-2012 |
| 20120181560 | LED WIRING BOARD, LIGHT EMITTING MODULE, METHOD FOR MANUFACTURING LED WIRING BOARD AND METHOD FOR MANUFACTURING LIGHT EMITTING MODULE - An LED wiring board includes an insulator layer, a conductor layer (a wiring pattern layer) formed on the insulator layer, and a white reflective film which is formed on the insulator layer and which includes a white colorant and a binder thereof. The conductor layer includes a first wiring pattern and a second wiring pattern, and the white reflective film has a portion which is between the first wiring pattern and the second wiring pattern and which is thinner than both of the first wiring pattern and the second wiring pattern. | 07-19-2012 |
| 20120181078 | MULTILAYER PRINTED WIRING BOARD - An IC chip for a high frequency region, particularly a packaged substrate in which no malfunction or error occurs even if 3 GHz is exceeded. A conductive layer on a core substrate is formed at a thickness of 30 μm and a conductor circuit on an interlayer resin insulation layer is formed at a thickness of 15 μm. By thickening the conductive layer, the volume of the conductor can be increased and resistance can be reduced. Further, by using the conductive layer as a power source layer, the capacity of supply of power to an IC chip can be improved. | 07-19-2012 |
| 20120181076 | DOUBLE-SIDED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A double-sided circuit board including a substrate having a first surface and a second surface on an opposite side of the first surface and having a penetrating hole extending between the first surface and the second surface, a first conductive circuit formed on the first surface of the substrate, a second conductive circuit formed on the second surface of the substrate, and a through-hole conductor formed in the penetrating hole of the substrate and electrically connecting the first conductive circuit and the second conductive circuit. The penetrating hole comprises a first hole having a first opening with a diameter R | 07-19-2012 |
| 20120181074 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board having an insulation layer, and a buildup structure formed on the insulation layer and including insulation layers. The insulation layer and the buildup structure form a board structure in which a cavity portion having an opening on a surface of the buildup structure on the opposite side of the insulation layer is formed. The cavity portion is extending through one or more of the insulation layers in the buildup structure and has a groove portion formed on the bottom surface of the cavity portion along a wall surface of the cavity portion. The board structure composed of the insulation layer and the buildup structure has a pad formed on the bottom surface of the cavity portion in a position farther from the wall surface of the cavity portion than the groove portion. | 07-19-2012 |
| 20120181072 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME - A printed wiring board includes multiple conductive layers having conductive circuits, multiple resin insulation layers having openings and including the uppermost resin insulation layer positioned as the outermost layer of the resin insulation layers, multiple via conductors formed in the openings, respectively, and connecting the conductive circuits in the conductive layers, and multiple component-loading pads formed of a copper foil and positioned to load an electronic component. The resin insulation layers and the conductive layers are alternately laminated, and the component-loading pads are formed on the uppermost resin insulation layer. | 07-19-2012 |
| 20120180313 | MANUFACTURING METHOD FOR PRINTED WIRING BOARD - A manufacturing method for a printed wiring board includes forming an electroless plated film on an interlayer resin insulation layer, forming on the electroless plated film a plating resist with an opening to expose a portion of the electroless plated film, forming an electrolytic plated film on the portion of the electroless plated film exposed through the opening, removing the plating resist using a resist-removing solution containing an amine, reducing a thickness of a portion of the electroless plated film existing between adjacent portions of the electrolytic plated film by using the resist-removing solution, and forming a conductive pattern by removing the portion of the electroless plated film existing between the adjacent portions of the electrolytic plated film by using an etchant. | 07-19-2012 |
| 20120177541 | EXHAUST GAS PROCESSING DEVICE - An exhaust gas processing device includes a pillar honeycomb structure, a first inorganic mat member, a first cylindrical metallic member, a second inorganic mat member, a second cylindrical metallic member, and an insulating layer. The insulating layer has a thickness of about 20 μm to about 400 μm and is provided at least one of a first part between an inner surface of the first cylindrical metallic member and the first inorganic mat member, a second part between an outer surface of the first cylindrical metallic member and the second inorganic mat member, and a third part between an inner surface of the second cylindrical metallic member and the second inorganic mat member. | 07-12-2012 |
| 20120177540 | EXHAUST GAS PROCESSING DEVICE - An exhaust gas processing device includes a honeycomb structure in a pillar shape including a honeycomb unit, a catalytic agent, an inorganic mat member, a cylindrical metallic member and an insulating layer. The honeycomb unit includes cell walls to define a plurality of cells which extend from a first end of the honeycomb unit to a second end of the honeycomb unit along a longitudinal direction. The catalytic agent is provided on the cell walls. The inorganic mat member is wound around an outer peripheral surface of the honeycomb structure. The cylindrical metallic member accommodates the honeycomb structure around which the inorganic mat member is wound. The insulating layer has a thickness of about 20 μm to about 400 μm and is densely formed. The insulating layer is provided between an inner surface of the cylindrical metallic member and the inorganic mat member. | 07-12-2012 |
| 20120175754 | WIRING BOARD - A wiring board including a core substrate made of an insulative material and having a penetrating portion, a first interlayer insulation layer formed on the surface of the core substrate, a first conductive circuit formed on the surface of the first interlayer insulation layer, a first via conductor formed in the first interlayer insulation layer, and an electronic component accommodated in the penetrating portion of the core substrate and including a semiconductor element, a bump body mounted on the semiconductor element, a conductive circuit connected to the bump body, an interlayer resin insulation layer formed on the conductive circuit, and a via conductor formed in the interlayer resin insulation layer. The first via conductor has a tapering direction which is opposite of a tapering direction of the via conductor in the electronic component. | 07-12-2012 |
| 20120175155 | Printed Wiring Board And A Method Of Production Thereof - A printed wiring board has an insulating resin substrate having a first surface and a second surface, the insulating resin substrate having one or more penetrating-holes passing through the insulating resin substrate from the first surface to the second surface, a first conductor formed on the first surface of the insulating resin substrate, a second conductor formed on the second surface of the insulating resin substrate, and a through-hole conductor structure formed in the penetrating-hole of the insulating resin substrate and electrically connecting the first conductor and the second conductor. The penetrating-hole has a first portion having an opening on the first surface and a second portion having an opening on the second surface. The first portion and the second portion are connected such that the first portion and the second portion are set off from each other. | 07-12-2012 |
| 20120170240 | METHOD OF MANUFACTURING A MULTILAYER PRINTED WIRING BOARD FOR PROVIDING AN ELECTRONIC COMPONENT THEREIN - A multilayer printed wiring board and method for manufacturing a multilayer printed wiring board. One method include a method for manufacturing a multilayer printed wiring board having an electronic component housed therein. The method includes forming a conduction circuit on a core substrate and forming an alignment mark on the core substrate separate from the conduction circuit. Also included is forming a concavity in the core substrate, the concavity being formed in an area of the core substrate not including the conductor circuit and alignment mark, and inserting the electronic component into the concavity in the core substrate by using the alignment mark on the core substrate to align the electronic component with the concavity. | 07-05-2012 |
| 20120168995 | METHOD FOR MANUFACTURING HONEYCOMB STRUCTURE - A method for manufacturing a honeycomb structure includes molding a ceramic raw material to manufacture at least one honeycomb molded body having a plurality of cell walls to define cells. First cells and third cells are filled with plug material paste at first end portions and at third portions, respectively, to form first plugs. The at least one honeycomb molded body is fired to manufacture at least one honeycomb fired body. The at least one honeycomb fired body is cut along a plane substantially perpendicular to the longitudinal direction to create a second end face side of the at least one honeycomb fired body. Second end portions of second cells are filled with plug material paste. The plug material paste in the second end portions is solidified through heating to form second plugs. A honeycomb block including at least one honeycomb fired body is produced. | 07-05-2012 |
| 20120160395 | METHOD FOR MANUFACTURING HONEYCOMB FILTER - A method for manufacturing a honeycomb filter includes applying a first sealing material paste to a side face of one of honeycomb fired bodies to form a sealing material paste layer thereon. Another of honeycomb fired bodies is laminated on the first sealing material paste layer to manufacture an aggregated body of honeycomb fired bodies. The aggregated body of honeycomb fired bodies is heated so that the first sealing material paste layer is dried and solidified to produce a ceramic block. A second sealing material paste is applied to a peripheral face of the ceramic block in accordance with irregularities formed thereon so that an outer peripheral surface of the honeycomb filter has surface irregularities thereon. The second sealing material paste is dried and solidified to form a sealing material layer on the peripheral face of the ceramic block. | 06-28-2012 |
| 20120159914 | MAT, METHOD OF MANUFACTURING MAT, AND EXHAUST GAS PURIFICATION APPARATUS - A mat includes inorganic fibers, a first main surface, a second main surface, a first interlaced part group and a second interlaced part group. The first interlaced part group includes a plurality of first interlaced parts arranged in rows. Each of the plurality of first interlaced parts is formed from a point on the first main surface to a point present between the first main surface and the second main surface. The second interlaced part group includes a plurality of second interlaced parts arranged in rows. Each of the plurality of second interlaced parts is formed from a point on the second main surface to a point present between the first main surface and the second main surface. A direction of rows formed by the first interlaced part group and a direction of rows formed by the second interlaced part group are different from each other. | 06-28-2012 |
| 20120152606 | PRINTED WIRING BOARD - A printed wiring board including an insulation layer, a conductive layer formed on the insulation layer and including a via conductor pad and a chip capacitor mounting pad, an outermost resin insulation layer formed on the insulation and conductive layers and having a via hole reaching the conductor pad and an opening exposing the mounting pad, an electrode having a via conductor portion in the hole and a land portion extending from the via conductor such that the electrode protrudes from the surface of the outermost layer, a solder bump for mounting an IC formed on the land portion such that the bump is at a portion of the electrode protruding from the surface of the outermost layer, and a solder structure for mounting a chip capacitor formed on the mounting pad such that the structure extends from the mounting pad and projects from the surface of the outermost layer. | 06-21-2012 |
| 20120152600 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A printed wiring board including an interlayer resin insulation layer, a pad formed on the interlayer resin insulation layer and for mounting an electronic component, a solder-resist layer formed on the interlayer resin insulation layer and the pad and having an opening portion over the pad, and a coating layer formed on the pad and exposed through the opening portion of the solder-resist layer. The solder-resist layer has a protruding portion protruding toward the inside of the opening portion in a bottom portion of the opening portion, and the protruding portion of the solder-resist layer has a flat surface in an end portion of the protruding portion. | 06-21-2012 |
| 20120151764 | METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD - A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal film with an etching resist, etching to reduce thickness of the plated-metal film exposed from the etching resist, removing the resists, and forming a wiring having a pad and a conductive circuit thinner than the pad by removing the metal film exposed through the removing of the plating resist, a solder-resist layer on the surface of the board and wiring, in the layer an opening exposing the pad and a portion of the circuit contiguous to the pad, a solder film on the pad and portion of the circuit exposed through the opening, and a solder bump on the pad by solder reflow. | 06-21-2012 |
| 20120149271 | MAT MATERIAL AND EXHAUST GAS PROCESSING APPARATUS - A mat material includes a glass fiber. The glass fiber includes 52 to 62% by weight of SiO | 06-14-2012 |
| 20120148853 | INSULATOR - An insulator disposed in opposition to an exhaust manifold of an internal combustion engine with spacing therebetween is constituted as follows. A metal base having heat resistance is provided, a surface covering layer obtained by surface treatment is not provided on a first region of an outer surface of the base, the outer surface being on the side that is not in opposition to the exhaust manifold, and a surface covering layer obtained by the surface treatment is provided on a second region. The first region of the outer surface of the base is a region in opposition to peripheral components disposed in the vicinity of the outer surface of the base. In this case, the material of the base is aluminum or an aluminum alloy, and the surface treatment performed on the outer surface of the base is black alumite treatment. | 06-14-2012 |
| 20120148793 | HONEYCOMB STRUCTURE - A honeycomb structure includes a ceramic block and a sealing material layer. The ceramic block includes a plurality of honeycomb fired bodies each having a large number of cells longitudinally disposed substantially in parallel with one another with a cell wall between the cells, an adhesive layer for bonding side faces of the honeycomb fired bodies, and a cavity-holding member placed between the side faces of the honeycomb fired bodies. The sealing material layer is formed on a peripheral face of the ceramic block. The cavity-holding member includes a nonflammable material and has Young's modulus of at least about 0.001 GPa and at most about 0.07 GPa. | 06-14-2012 |
| 20120142147 | WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A wiring board with a built-in electronic component includes a core substrate having a penetrating hole formed in the core substrate, an electronic component accommodated in the penetrating hole in the core substrate, a conductive pattern layer formed on a first surface of the core substrate and including a first conductive pattern and a second conductive pattern, and an interlayer insulation layer formed over the conductive pattern layer and the first surface of the core substrate. The second conductive pattern is formed adjacent to a periphery of the penetrating hole and contoured such that a sheet for positioning the electronic component in the penetrating hole is laminated horizontally with respect to the first surface of the core substrate over the penetrating hole. | 06-07-2012 |
| 20120133165 | HOLDING APPARATUS - A holding apparatus includes a first holding unit including at least two supporting rollers rotatable around rotation shafts which extend substantially parallel with each other; a second holding unit including at least one supporting roller rotatable around a rotation shaft; and at least one holding mechanism having the first holding unit and the second holding unit. The rotation shafts of the supporting rollers of the first holding unit and the rotation shaft of the supporting roller of the second holding unit are substantially in parallel with each other. By moving at least one of the first holding unit and the second holding unit, an object to be held is held between the first holding unit and the second holding unit by using the supporting rollers. | 05-31-2012 |
| 20120132352 | OPTO-ELECTRICAL HYBRID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - An opto-electrical hybrid wiring board is formed with a flexible wiring board; a first rigid wiring board and second rigid wiring board connected to each other by the flexible wiring board; a light-emitting element and a light-receiving element, one of which is arranged on the first rigid wiring board and the other on the second rigid wiring board; and a flexible optical waveguide for optically connecting the light-emitting element and the light-receiving element. One end of the flexible wiring board is inserted in and supported by the first rigid wiring board, and the other end is inserted in and supported by the second rigid wiring board; the rigid wiring boards and flexible wiring board are electrically connected to each other by using vias to connect the wiring of the first and second rigid wiring boards and the wiring of the flexible wiring board at the inserted portions. | 05-31-2012 |
| 20120126444 | EXTRUSION-MOLDING MACHINE AND EXTRUSION-MOLDING METHOD - An extrusion-molding machine includes a screw, a die and a high-hardness coat layer. The screw has a blade portion to extrude a molding material. The screw is disposed in a tightly-closed space which is maintained in a reduced-pressure atmosphere. The die molds an extruded molding material. The high-hardness coat layer is provided at least on the blade portion. | 05-24-2012 |
| 20120125680 | MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - An opening is formed in resin | 05-24-2012 |
| 20120124952 | MAT, HOLDING SEALING MATERIAL, METHOD FOR PRODUCING MAT, AND EXHAUST GAS PURIFYING APPARATUS - A mat includes inorganic fibrous substances, first and second main faces, first and second side faces and intertwined portions. The intertwined portions respectively extend from needle piercing points of the first main face to needle piercing points of the second main face. A first virtual straight line and each of second virtual straight lines intersect with each other at a first angle of less than about 90° when viewed from the first side face to the second side face. The first virtual straight line and each of third virtual straight lines intersect with each other at a second angle of more than about 90° when viewed from the first side face to the second side face. The second virtual straight lines and the third virtual straight lines intersect with each other at a third angle when viewed from the first side face to the second side face. | 05-24-2012 |
| 20120111477 | METHOD OF MANUFACTURING HONEYCOMB STRUCTURE AND DEGREASING APPARATUS FOR HONEYCOMB MOLDED BODY - A method of manufacturing a honeycomb structure including a honeycomb unit includes forming a honeycomb molded body having a plurality of cells extending from a first end face to a second end face of the honeycomb molded body along a longitudinal direction of the honeycomb molded body and separated by a plurality of cell walls, placing the honeycomb molded body in a degreasing apparatus so that the first end face faces downward and the second end face faces upward, feeding introduced gas into the degreasing apparatus, degreasing the honeycomb molded body at a temperature of approximately 200° C. to approximately 400° C., and firing the degreased honeycomb molded body at a temperature of approximately 500° C. to approximately 900° C. to obtain the honeycomb unit. | 05-10-2012 |
| 20120110805 | METHOD FOR MANUFACTURING HOLDING SEALING MATERIAL - A method for manufacturing a holding sealing material includes needling a mat containing first inorganic fibers to manufacture a needle mat containing the first inorganic fibers entangled. A binder is allowed to adhere to the needle mat. A sheet-forming slurry containing at least second inorganic fibers and a binder is supplied on the needle mat to which the binder adhered. The sheet-forming slurry is maintained on the needle mat for a predetermined time. The sheet-forming slurry is dehydrated to manufacture a sheet-processed mat precursor laminated on the needle mat. The needle mat and the sheet-processed mat precursor laminated on the needle mat are dried. | 05-10-2012 |
| 20120106108 | MULTILAYERED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - A multilayered printed circuit board or a substrate for mounting a semiconductor device includes a semiconductor device, a first resin insulating layer accommodating the semiconductor device, a second resin insulating layer provided on the first resin insulating layer, a conductor circuit provided on the second resin insulating layer, and via holes for electrically connecting the semiconductor device to the conductor circuit, wherein the semiconductor device is accommodated in a recess provided in the first resin insulating layer, and a metal layer for placing the semiconductor device is provided on the bottom face of the recess. A multilayered printed circuit board in which the installed semiconductor device establishes electrical connection through the via holes is provided. | 05-03-2012 |
| 20120103931 | METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD - A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal film with an etching resist, etching to reduce thickness of the plated-metal film exposed from the etching resist, removing the etching and plating resists, and forming a wiring having a pad for wire-bonding an electrode of an electronic component and a conductive circuit thinner than the pad by removing the metal film exposed after the plating resist is removed, a solder-resist layer on the surface of the board and wiring, an opening in the layer exposing the pad and a portion of the circuit contiguous to the pad, and a metal coating on the pad and portion of the circuit exposed through the opening. | 05-03-2012 |
| 20120103680 | MULTILAYER PRINTED WIRING BOARD WITH FILLED VIAHOLE STRUCTURE - A multilayer printed wiring board includes a multilayered structure having conductor circuit layers and interlaminar insulative layers, the interlaminar insulative layers including an outermost interlaminar insulative layer, the conductor circuit layers including an outermost conductor circuit layer formed over the outermost interlaminar insulative, a filled-viahole formed in the outermost interlaminar insulative layer and having one or more metal plating fillings and completely closing a hole formed through the outermost interlaminar insulative layer such that the metal plating of the filled-viahole extends out of the hole and forms a substantially flat surface, and solder bumps including a first solder bump formed on the substantially flat surface of the filled-viahole and a second solder bump formed on a surface portion in the outermost conductor circuit layer. The substantially flat surface of the filled-viahole is leveled substantially at the same height as the surface portion of the outermost conductor circuit layer. | 05-03-2012 |
| 20120097327 | METHOD OF MANUFACTURING HONEYCOMB STRUCTURE - A method of manufacturing a honeycomb structure including a plurality of honeycomb units includes preparing honeycomb units each containing first inorganic particles. Each of the honeycomb units has at least one joining surface. At least a part of the at least one joining surface of each of the honeycomb units is impregnated with water. An adhesive layer paste containing second inorganic particles, a binder, and water is prepared. The first inorganic particles have a specific surface area of approximately 50 m | 04-26-2012 |
| 20120093697 | HONEYCOMB CATALYST BODY AND METHOD FOR MANUFACTURING HONEYCOMB CATALYST BODY - A honeycomb catalyst body includes a honeycomb structure and a catalyst. The honeycomb structure includes a porous honeycomb fired body having at least one cell wall defining a plurality of cells extending along a longitudinal direction of the porous honeycomb fired body. The plurality of cells is provided in parallel with one another. The honeycomb fired body contains silicon carbide particles and a silica layer formed on a surface of each of the silicon carbide particles. The silica layer has a thickness of from about 5 nm to about 100 nm measured by X-ray photoelectron spectroscopy. The catalyst contains at least one of oxide ceramics and zeolite. The catalyst is provided on a surface of the silica layer. An amount of at least one of the oxide ceramics and the zeolite is about 50 g/L or more. | 04-19-2012 |
| 20120093695 | HONEYCOMB STRUCTURE AND EXHAUST GAS PURIFYING APPARATUS - A honeycomb structure includes a porous silicon carbide honeycomb fired body and a silicon-containing oxide layer. The porous silicon carbide honeycomb fired body has at least one cell wall defining a plurality of cells extending along a longitudinal direction of the silicon carbide honeycomb fired body. The plurality of cells is provided in parallel with one another. The silicon carbide honeycomb fired body contains silicon carbide particles. The silicon-containing oxide layer is provided on a surface of each of the silicon carbide particles. The silicon-containing oxide layer has a thickness of from about 5 nm to about 100 nm measured with an X-ray photoelectron spectroscopy. | 04-19-2012 |
| 20120086153 | MANUFACTURING METHODS OF CERAMIC FIRED BODY, HONEYCOMB STRUCTURE, AND EXHAUST GAS CONVERTING DEVICE, AND DRYING APPARATUS - A manufacturing method of a ceramic fired body includes forming a composition of ceramic raw material containing water to make a ceramic molded body. The ceramic molded body is irradiated with a microwave under a depressurized atmosphere of about 1 KPa or more and about 50 kPa or less to dry the ceramic molded body. The ceramic molded body is fired to make the ceramic fired body. | 04-12-2012 |
| 20120085572 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board including a core substrate having an accommodation portion, an electronic component in the accommodation portion having a substrate, a resin layer on a surface of the substrate and an electrode on the resin layer, a first interlayer resin insulation layer on a surface of the core substrate and a surface of the substrate of the component, and a second interlayer resin insulation layer on the opposite surface of the core substrate and a surface of the substrate having the resin layer and electrode. The first insulation layer has resin in the amount greater than the amount of resin in the second insulation layer such that the total amount of resin component including the resin in the first insulation layer is adjusted to be substantially the same as the total amount of resin component including the resin in the second insulation layer and resin in the resin layer. | 04-12-2012 |
| 20120082779 | MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board including a first interlayer resin insulation layer, a first conductive circuit formed on the first interlayer resin insulation layer, a second interlayer resin insulation layer formed on the first interlayer resin insulation layer and the first conductive circuit and having an opening portion exposing a portion of the first conductive circuit, a second conductive circuit formed on the second interlayer resin insulation layer, a via conductor formed in the opening portion of the second interlayer resin insulation layer and connecting the first conductive circuit and the second conductive circuit, and a coating layer having a metal layer and a coating film and formed between the first conductive circuit and the second interlayer resin insulation layer. The metal layer is formed on the surface of the first conductive circuit and the coating film is formed on the metal layer. | 04-05-2012 |
| 20120080828 | METHOD OF MANUFACTURING HONEYCOMB STRUCTURE - A method of manufacturing a honeycomb structure including a honeycomb unit includes causing inorganic particles to contain water. The inorganic particles have a specific surface area of approximately 50 m | 04-05-2012 |
| 20120080786 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - An electronic component including a wiring board having interlayer insulation layers and conductive patterns, the wiring board having a first surface and a second surface on the opposite side of the first surface, multiple first bumps formed on a first conductive pattern positioned on the first surface of the wiring board among the conductive patterns of the wiring board, a semiconductor element mounted on the first surface of the wiring board through the first bumps, an encapsulating resin encapsulating the semiconductor element and at least a portion of a side surface of the wiring board, the side surface of the wiring board extending between the first surface and second surface of the wiring board, and multiple of second bumps formed on the second surface of the wiring board and connected to a second conductive pattern of the conductive patterns in the wiring board. | 04-05-2012 |
| 20120080505 | Solder Ball Loading Mask, Apparatus and Associated Methodology - A solder ball loading method capable of securely loading solder balls on connection pads includes applying flux on each connection pad group of a printed wiring board flux is not applied to a contact portion between a spacer and the printed wiring board to keep the flux from attaching to the spacer. Because the flux is not attached to the spacer, when the mask is detached from the printed wiring board, the printed wiring board need not be inverted, and damage to the solder resist layer | 04-05-2012 |
| 20120080504 | Solder Ball Loading Mask, Apparatus And Associated Methodology - A solder ball loading method capable of securely loading solder balls on connection pads includes applying flux on each connection pad group of a printed wiring board flux is not applied to a contact portion between a spacer and the printed wiring board to keep the flux from attaching to the spacer. Because the flux is not attached to the spacer, when the mask is detached from the printed wiring board, the printed wiring board need not be inverted, and damage to the solder resist layer | 04-05-2012 |
| 20120080400 | MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board including a first interlayer resin insulation layer, a pad formed on the first interlayer resin insulation layer, a solder resist layer formed on the first interlayer resin insulation layer and the pad, a protective film formed on a portion of the pad exposed by an opening of the solder resist layer, and a coating layer formed between the pad and the solder resist layer. The pad mounts an electronic component. The coating layer has a metal layer and a coating film. The metal layer is formed on the surface of the pad and the coating film is formed on the metal layer. | 04-05-2012 |
| 20120077317 | MULTILAYERED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - A multilayered printed circuit board or a substrate for mounting a semiconductor device includes a semiconductor device, a first resin insulating layer accommodating the semiconductor device, a second resin insulating layer provided on the first resin insulating layer, a conductor circuit provided on the second resin insulating layer, and via holes for electrically connecting the semiconductor device to the conductor circuit, wherein the semiconductor device is accommodated in a recess provided in the first resin insulating layer, and a metal layer for placing the semiconductor device is provided on the bottom face of the recess. A multilayered printed circuit board in which the installed semiconductor device establishes electrical connection through the via holes is provided. | 03-29-2012 |
| 20120073977 | PLATING APPARATUS AND PLATING METHOD - A method for plating a belt substrate including conveying a belt substrate through a plating tank, contacting an immersed cathode power-supply device and/or an auxiliary cathode power-supply device with the belt substrate conveyed into the interior of the plating tank such that the belt substrate becomes a cathode, and electrically plating a surface of the belt substrate in the interior of the plating tank while the immersed cathode power-supply device and/or the auxiliary cathode power-supply device maintains cathode power-supply to the belt substrate conveyed into the interior portion of the plating tank. The immersed cathode power-supply device and the auxiliary cathode power-supply device are positioned in the interior portion of the plating tank and are electrically connected by a short circuit wiring. | 03-29-2012 |
| 20120073868 | MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD - A method for manufacturing a multilayer printed wiring board includes preparing a first resin insulative material having a first conductive circuit on or in the first resin insulative material, forming a second resin insulative material on the first resin insulative material and the first conductive circuit, forming on a surface of the second resin insulative material a first concave portion to be filled with a conductive material for formation of a second conductive circuit, forming on the surface of the second resin insulative material a pattern having a second concave portion and post portions to be filled with the conductive material for formation of a plane conductor, and filling the conductive material in the first concave portion and the second concave portion such that the second conductive circuit and the plane conductor are formed. | 03-29-2012 |
| 20120067938 | METHOD AND APPARATUS FOR LOADING SOLDER BALLS - A solder ball loading apparatus for loading solder balls onto pads of a printed wiring board includes a holding device for holding a printed wiring board having pads and holding a ball array mask having openings that correspond to the pads, one or more cylinder members is positioned over the holding device such that an opening portion of the cylinder member faces the holding device, the cylinder member gathering solder balls on the surface of the ball array mask under the cylinder member by suctioning air through the opening portion. A conveyor mechanism for moving the ball array mask and the printed wiring board relative to the cylinder member such that solder balls gathered under the opening portion of the cylinder member can be loaded onto the pads of the board through the openings of the mask held by the holding device. | 03-22-2012 |
| 20120067633 | MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD - A multi-layer printed circuit board including a core substrate, lower interlayer resin insulating layers formed on the surfaces of the core substrate, respectively, through-hole conductors formed in penetrating holes penetrating through the core substrate and the lower interlayer resin insulating layers, conductor circuits formed on the lower interlayer resin insulating layers, respectively, upper interlayer resin insulating layers formed on the conductor circuits and the lower interlayer resin insulating layers, respectively and via hole conductors formed in the upper interlayer resin insulating layers and positioned on the through-hole conductors, respectively. | 03-22-2012 |
| 20120067632 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a printed wiring board including forming an insulative resin layer containing a resin and an inorganic filler, forming a conductor layer including a conductive material and having a conductor on the insulative resin layer, irradiating a laser beam upon the conductor of the conductor layer such that the conductor is sectioned or a width of the conductor is narrowed, and forming a conductive pattern on the insulative resin layer. The inorganic filler is in an amount of 30 wt. % or more of the insulative resin layer. | 03-22-2012 |
| 20120067628 | PRINTED WIRING BOARD - A printed wiring board including solder pads excellent in frequency characteristic is provided. To do so, each solder pad | 03-22-2012 |
| 20120066901 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board includes a resin insulation layer having a first surface and a second surface on an opposite side of the first surface, the resin insulation layer having an opening for a first via conductor, a pad formed on the first surface of the resin insulation layer and provided to mount an electronic component, a first conductive circuit formed on the second surface of the resin insulation layer, and a first via conductor formed in the opening and connecting the pad and the first conductive circuit. The pad has an embedded portion embedded in the resin insulation layer and a protruding portion protruding from the resin insulation layer, and the embedded portion has an external shape which is greater than an external shape the protruding portion. | 03-22-2012 |
| 20120061347 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A method for manufacturing a printed wiring board including preparing a carrier, forming a metal layer on the carrier, forming an etching resist on the metal layer, forming a metal film from the metal layer underneath the resist by removing portion of the metal layer exposed through the resist and part of the metal layer contiguous to the portion of the metal layer and underneath the resist, forming a coating layer on side surface of the film and the carrier, forming a pad on the coating layer, removing the resist, forming a resin insulation layer on the film and surface of the pad, forming an opening reaching the surface of the pad in the insulation layer, forming a conductive circuit on the insulation layer, forming a via conductor connecting the circuit and the pad in the opening, removing the carrier from the film and coating layer, and removing the film. | 03-15-2012 |
| 20120060367 | FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a flex-rigid wiring board including forming a rigid substrate including a rigid base material, a separator provided over the rigid base material, and insulation layers laminated over the rigid base material after the separator is provided, removing the separator together with a portion of the insulation layers after the laminating of the insulation layers, and forming a recessed portion configured to accommodate an electronic component according to a shape of the separator on a surface of the rigid substrate. | 03-15-2012 |
| 20120058018 | SILICO-ALUMINO PHOSPHATE, HONEYCOMB STRUCTURAL BODY AND EXHAUST GAS CONVERSION APPARATUS - A silico-alumino phosphate includes Si, Al, and P. A ratio of an amount of substance of Si to a sum of an amount of substance of Al and an amount of substance of P is approximately 0.22 or more and approximately 0.33 or less. An acid point is approximately 1.2 mmol/g or more. A honeycomb structural body includes a honeycomb unit. The honeycomb unit includes the silico-alumino phosphate and an inorganic binder. The honeycomb unit has a plurality of through-holes divided by a plurality of partition walls and arranged in a longitudinal direction of the honeycomb unit. An exhaust gas conversion apparatus includes the honeycomb structural body, a holding sealing member and a metal pipe. The holding sealing member is provided at an outer peripheral portion of the honeycomb structural body. The honeycomb structural body and the holding sealing member are installed in the metal pipe. | 03-08-2012 |
| 20120043123 | PRINTED WIRING BOARD AND A METHOD OF MANUFACTURING A PRINTED WIRING BOARD - [Subject Matter] To provide a printed wiring board in which no warping occurs even if interlayer insulation layers without core material are laminated on a core substrate. | 02-23-2012 |
| 20120037414 | MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A multilayer printed wiring board including a layered capacitor section provided on a first interlayer resin insulation layer and a high dielectric layer and first and second layered electrodes that sandwich the high dielectric layer. A second interlayer resin insulation layer is provided on the first insulation layer and the capacitor section, and a metal thin-film layer is provided over the capacitor section and on the second insulation layer. An outermost interlayer resin insulation layer is provided on the second insulation layer and the metal thin-film layer. A mounting section is provided on the outermost insulation layer and has first and second external terminals to mount a semiconductor element. Multiple via conductors penetrate each insulation layer. The via conductors include first via conductors that electrically connect the first layered electrode to the first external terminals. Second via conductors electrically connect the second layered electrode to the second external terminals. | 02-16-2012 |
| 20120034415 | CARBON FIBER STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - A carbon fiber structure and a manufacturing method of the same are provided. The carbon fiber structure includes a carbon fiber-reinforced carbon composite material having carbon fibers and a carbonaceous matrix. The carbon fibers are configured by a substantially linear fiber. The carbon fibers form thin piece bodies in which a longitudinal direction of the carbon fibers is oriented in parallel to a surface direction of the carbon fiber structure within the carbonaceous matrix. The carbon fiber structure is configured by a laminate having the thin piece bodies laminated therein. | 02-09-2012 |
| 20120034401 | C/C COMPOSITE MATERIAL MOLDED BODY AND METHOD FOR MANUFACTURING THE SAME - A C/C composite material molded body and a method for manufacturing the same are provided. The C/C composite material molded body includes carbon fibers, and a carbonaceous matrix. The C/C composite material molded body has a shell-like structure, an outer surface of which is configured by a three-dimensional curved surface or a combination of a plurality of surfaces, and which is configured by a continuous structure having a uniform composition as a whole. A longitudinal direction of the carbon fibers is oriented along the outer surface. | 02-09-2012 |
| 20120034400 | CARBON FIBER-REINFORCED CARBON COMPOSITE MATERIAL AND METHOD FOR MANUFACTURING THE SAME - A carbon fiber-reinforced carbon composite material and a method for manufacturing the same are provided. The carbon fiber-reinforced carbon composite material includes carbon fibers, and a carbonaceous matrix. The carbon fiber-reinforced carbon composite material is integrally formed. The carbon fibers are a substantially linear fiber existing in a bare-fiber state within the carbonaceous matrix and having an average fiber length of less than about 1.0 mm. The carbon fiber-reinforced carbon composite material has a bulk density of about 1.2 g/cm | 02-09-2012 |
| 20120032335 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - An electronic component including a wiring board having a power-source pattern and a signal pattern, a semiconductor element mounted on the wiring board and having a power-source electrode pad and a signal electrode pad, a first connection portion being made of a conductive material and connecting the signal pattern of the wiring board and the signal electrode pad of the semiconductor element, and a second connection portion being made of a conductive material and connecting the power-source pattern of the wiring board and the power-source electrode pad of the semiconductor element. The conductive material of the first connection portion and the conductive material of the second connection portion are selected such that the conductive material of the second connection portion has an electrical resistance which is lower than an electrical resistance of the conductive material of the first connection portion. | 02-09-2012 |
| 20120031659 | Printed Wiring Board And A Method Of Manufacturing A Printed Wiring Board - A method of manufacturing a printed wiring board with solder bumps includes forming a solder-resist layer having small and large apertures exposing a respective conductive pad of the printed wiring board, loading a solder ball in each of the small and large apertures using a mask with aperture areas corresponding to the apertures of the solder-resist layer, forming a first bump having a first height, from the solder ball in the small aperture, and a second bump having a second height, from the solder ball in the large aperture, the first height being greater than the second height, and pressing a top of the first bump such that the first height becomes substantially the same as the second height. A multilayer printed wiring board includes a solder-resist layer with apertures of differing sizes and solder bumps having substantially equal volumes but a difference in height no greater than | 02-09-2012 |
| 20120031062 | HONEYCOMB STRUCTURAL BODY - An object of the present invention is to provide a honeycomb structural body which is low in pressure loss and can prolong a period up to a regenerating process. The present invention is directed to a columnar honeycomb structural body comprising a large number of through holes placed in parallel with one another in a length direction with wall portion interposed therebetween, wherein: each of the through holes has one of ends sealed; one end face of the through hole differs in opening area from the other end face thereof; a ceramic material which constitutes the wall portion has an average pore diameter in a range from 5 to 30 μm; and the rate of capacity of micro pores each having a pore diameter two or more times larger than the average pore diameter is set to 30% or less of the capacity of the entire micro pores. | 02-09-2012 |
| 20120020612 | OPTICAL INTERCONNECT - An optical interconnect device including a first printed wiring board, a second printed wiring board facing the first printed wiring board, a light-emitting device positioned on the first printed wiring board and electrically connected to the first printed wiring board, a light-receiving device positioned on the second printed wiring board and electrically connected to the second printed wiring board such that the light-receiving device faces the light-emitting device and receives an optical signal transmitted in a direct line from the light-emitting device, and an electrical-connection device mounted on the first printed wiring board and the second printed wiring board such that the first printed wiring board is electrically connected to the second printed wiring board. | 01-26-2012 |
| 20120018198 | ELECTRONIC COMPONENT AND PRINTED WIRING BOARD - An electronic component including a substrate having a surface and one or more trench portions opening on the surface, a capacitor portion having a lower electrode formed on the surface of the substrate and on the wall surface of the trench portion, a dielectric layer formed on the lower electrode, and an upper electrode formed on the dielectric layer, a resin filler filling the space inside the trench portion lined by the upper electrode, an insulation layer formed on the surface of the substrate, a conductive portion formed on the insulation layer and positioned to cover the trench portion, and a via conductor connecting the conductive portion and one of the lower electrode and the upper electrode. | 01-26-2012 |
| 20120014862 | GRAPHITE MATERIAL - A graphite material includes a plurality of graphite particles and a plurality of pores. The plurality of graphite particles and the plurality of pores form a microstructure. A ratio of an elastic modulus to a compression strength of the graphite material ranges from 109 to 138. Preferably, a ratio of a total area of the pores to a whole area of the graphite material in a cross-section of the graphite material ranges from 17.94% to 19.97%. | 01-19-2012 |
| 20120012464 | PRINTED WIRING BOARD AND A METHOD OF PRODUCTION THEREOF - A method for manufacturing a printed wiring board including providing an insulating resin substrate having first and second surfaces, irradiating laser upon the first surface such that a first opening portion having an opening on the first surface and tapering inward is formed, irradiating laser upon the second surface such that a second opening portion having an opening on the second surface, tapering inward and communicated to the first opening portion is formed and that a penetrating-hole having the first and second opening portions is formed, forming an electroless plated film on an inner wall surface of the penetrating-hole, and forming an electrolytic plated film on the electroless plated film such that a through hole conductor structure is formed in the penetrating-hole. The opening of the first portion has an axis of the center of gravity offset with respect to that of the opening of the second opening portion. | 01-19-2012 |
| 20120012368 | MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board including a main substrate including a base material and having an opening portion, and a flex-rigid printed wiring board connected to the main substrate in the opening portion of the main substrate and including a rigid substrate and a flexible substrate, the rigid substrate including a non-flexible base material, the flexible substrate including a flexible base material. | 01-19-2012 |
| 20120008297 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board including a first rigid wiring board including a conductor and having an accommodation portion, the accommodation portion having wall surfaces, a second rigid wiring board accommodated in the accommodation portion and including a conductor electrically connected to the conductor of the first rigid wiring board, the second rigid wiring board having side surfaces, an insulation layer formed on the first rigid wiring board and the second rigid wiring board, and a metal film having a solid pattern formed directly on a boundary portion formed between the wall surfaces of the accommodation portion and the side surfaces of the second rigid wiring board. | 01-12-2012 |
| 20120008296 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board including a first rigid wiring board having an accommodation portion and a conductor, a second rigid wiring board accommodated in the accommodation portion of the first rigid wiring board and having a conductor electrically connected to the conductor of the first rigid wiring board, and an insulation layer formed on the first rigid wiring board and the second rigid wiring board. The accommodation portion of the first rigid wiring board has wall surfaces tapering from a first surface of the first rigid wiring board to a second surface on the opposite side of the first surface, and the second rigid wiring board has side surfaces tapering such that the side surfaces of the second rigid wiring board substantially fit into the wall surfaces of the accommodation portion of the first rigid wiring board. | 01-12-2012 |
| 20120008295 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board has a first resin insulation layer, a first conductive pattern formed on the first resin insulation layer, a second resin insulation layer formed on the first conductive pattern and having an opening portion exposing at least a portion of the first conductive pattern, a second conductive pattern formed on the second resin insulation layer, and a via conductor formed in the opening portion of the second resin insulation layer and electrically connecting the first conductive pattern and the second conductive pattern. The via conductor has a side surface extending between the first conductive pattern and the second conductive pattern and a bent portion where an inclination of the side surface of the via conductor changes in a depth direction of the via conductor. | 01-12-2012 |
| 20120008293 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A wiring board has a base substrate, a conductive pattern formed on the base substrate, an insulation layer formed on the conductive pattern and the base substrate and including a resin-impregnated inorganic cloth, a conductive pattern formed on the insulating layer, a via formed in the insulation layer and connecting the conductive pattern formed on the base substrate and the conductive pattern formed on the insulating layer, and a through-hole connected to the conductive pattern formed on the base substrate, penetrating through the base substrate and having a hole diameter in a range of 10 μm to 150 μm. | 01-12-2012 |
| 20120008290 | FLEX-RIGID WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A flex-rigid wiring board includes a flexible board including a flexible substrate and a conductor pattern formed over the flexible substrate, a non-flexible substrate disposed adjacent to the flexible board, an insulating layer covering the flexible board and the non-flexible substrate and exposing one or more portions of the flexible board, a conductor pattern formed on the insulating layer, and a plating layer connecting the conductor pattern of the flexible board and the conductor pattern on the insulating layer. | 01-12-2012 |
| 20120006592 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board including a first insulation layer, a conductive pattern formed on the first insulation layer, a second insulation layer formed on the conductive pattern and the first insulation layer and having an opening portion exposing at least a portion of the conductive pattern, and a connection conductor formed in the opening portion of the second insulation layer such that the connection conductor is positioned on the portion of the conductive pattern. The connection conductor has a tip portion which protrudes from a surface of the second insulation layer and which has a tapered side surface tapering toward an end of the tip portion. | 01-12-2012 |
| 20120006587 | MULTILAYERED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a multilayered printed circuit board including forming a first insulating resin substrate having a metal layer substantially corresponding to dimensions of a semiconductor device, forming a second insulating resin substrate, forming a recess extending to the metal layer of the first insulating resin substrate such that a surface of the metal layer is exposed, accommodating the semiconductor device in the recess such that the semiconductor device is mounted on the surface of the metal layer, and forming a resin insulating layer on the first insulating resin substrate such that the semiconductor device accommodated in the recess is covered. | 01-12-2012 |
| 20120006469 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - A method for manufacturing a printed circuit board including providing a first resin substrate having a resin plate and a circuit pattern formed on a surface of the resin plate, providing a second resin substrate having a resin plate and an accommodation portion formed in the resin plate of the second substrate, connecting an electrode of a capacitor to the circuit pattern of the first substrate with a bonding material such that the capacitor is mounted to the first substrate, attaching the second substrate to the resin substrate through a bonding resin layer such that the capacitor on the first substrate is accommodated in the accommodation portion of the second substrate, and forming a via hole in the first substrate such that the via hole is electrically connected to the electrode of the capacitor in the accommodation portion of the second substrate. | 01-12-2012 |
| 20120005889 | MULTILAYER PRINTED WIRING BOARD - A method for manufacturing a multilayer printed wiring board including forming a multilayer printed wiring board structure comprising first and second buildup portions, the first buildup portion including insulating layers, conductor layers and first viaholes electrically connecting the conductor layers through the insulation layers such that the first viaholes are formed in the insulating layers, respectively, the second buildup portion including insulating layers, conductor layers and second viaholes electrically connecting the conductor layers through the insulation layers such that the first viaholes are tapered toward the second viaholes, and the second via holes are tapered toward the first viaholes. The viaholes are formed by plating openings formed after lamination of respective ones of the insulating layers of the buildup portions, and each insulating layer in the buildup portions is about 100 μm or less in thickness. | 01-12-2012 |
| 20120005888 | PLATING APPARATUS, PLATING METHOD AND MULTILAYER PRINTED CIRCUIT BOARD - A method for manufacturing a multilayer printed circuit board including providing a core substrate having a penetrating-hole, forming an electroless plated film on a surface of the substrate and an inner wall surface of the penetrating-hole, electrolytically plating the substrate while moving with respect to the surface of the substrate an insulating member in contact with the surface of the substrate such that an electrolytic plated film is formed on the electroless plated film, an opening space inside the penetrating-hole is filled with an electrolytic material, and a through-hole conductor structure is formed in the penetrating-hole, forming an etching resist having an opening pattern on the electrolytic plated film, and removing an exposed pattern of the electrolytic plated film exposed by the opening pattern and a pattern of the electroless plated film under the exposed pattern such that a conductor circuit is formed on the surface of the substrate. | 01-12-2012 |
| 20120000068 | PRINTED CIRCUIT BOARD MANUFACTURING METHOD - A method for manufacturing a printed circuit board, including providing a core substrate having an electronic component accommodated in the core substrate; forming a positioning mark on the core substrate; forming an interlayer insulating layer over the core substrate, the positioning mark and the electronic component; forming a via hole opening connecting to the electronic component through the interlayer insulating layer in accordance with the positioning mark on the core substrate; and forming a via hole structure in the via hole opening in the interlayer insulating layer such that the via hole structure is electrically connected to the electronic component. | 01-05-2012 |
| 20110314668 | MULTILAYERED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a multilayered printed circuit board including forming a first insulating resin substrate having a metal layer substantially corresponding to dimensions of a semiconductor device, forming a second insulating resin substrate, forming a recess extending to the metal layer of the first insulating resin substrate such that a surface of the metal layer is exposed, accommodating the semiconductor device in the recess such that the semiconductor device is mounted on the surface of the metal layer, and forming a resin insulating layer on the first insulating resin substrate such that the semiconductor device accommodated in the recess is covered. | 12-29-2011 |
| 20110308079 | FLEX-RIGID WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A flex-rigid wiring board includes a flexible board including a flexible substrate and a conductor pattern formed over the flexible substrate, a non-flexible substrate disposed adjacent to the flexible board, an insulating layer covering the flexible board and the non-flexible substrate and exposing one or more portions of the flexible board, a conductor pattern formed on the insulating layer, and a plating layer connecting the conductor pattern of the flexible board and the conductor pattern on the insulating layer. | 12-22-2011 |
| 20110304997 | PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND PRINTED WIRING BOARD MANUFACTURING METHOD - A printed wiring board includes an insulating resinous substrate having an aperture unit, a first terminal unit and a second terminal unit consisting of a conductor and formed on top of the resinous substrate, and a fuse unit that electrically couples the first terminal unit and the second terminal unit to each other. At least a part of the fuse unit is disposed over the aperture unit, and in addition, is covered by a porous inorganic covering material having insulating properties. | 12-15-2011 |
| 20110304084 | METHOD FOR PRODUCING HONEYCOMB FILTER AND METHOD FOR PRODUCING CERAMIC FILTER ASSEMBLY - A method for producing a honeycomb filter includes mixing ceramic particles and a binder to obtain a ceramic raw material slurry. The ceramic raw material slurry is provided into an extruder to obtain a molded honeycomb filter. The molded honeycomb filter includes cell walls extending along a longitudinal direction of the molded honeycomb filter to define cells having a substantially square shape. The molded honeycomb filter is dried using a microwave dryer. A sealing paste is provided in at least one of the cells at one end face of the honeycomb filter to seal the at least one of the cells at the one end face. The sealing paste is dried using a microwave dryer. The dried molded honeycomb filter is sintered. | 12-15-2011 |
| 20110303451 | MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board including a core substrate, a first conductor layer on a first surface of the substrate, a second conductor layer on a second surface of the substrate, a third conductor layer inside the substrate between the first and second conductor layers, a conductive post connecting the third conductor layer with the first and second conductor layers, a first conductor circuit on the first surface of the substrate, a second conductor circuit on the second surface of the substrate, and a through hole formed through the substrate and connecting the first and second conductor circuits. The through hole is not connected to the third conductor layer, the third conductor layer has thickness larger than thicknesses of the first and second conductor layers, each of the first, second and third conductor layers forms one of power supply and ground layers, and the through hole forms a signal line. | 12-15-2011 |
| 20110302779 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME - A method for manufacturing a printed wiring board including providing a support member having a metal surface, securing a metal foil to the metal surface such that the metal foil is joined or bonded to a peripheral portion of the metal surface, forming a resin insulation layer on the metal foil secured on the metal surface, forming an opening for a via conductor in the resin insulation layer, forming a conductive circuit on the resin insulation layer, forming in the opening a via conductor electrically connecting the conductive circuit and the metal foil such that a laminated sheet body is formed, and cutting a portion of the laminated sheet body inside the peripheral portion of the metal surface of the support member such that the metal foil releases the portion of the laminated sheet body from the support member. | 12-15-2011 |
| 20110300307 | METHOD FOR MANUFACTURING WIRING BOARD - A method for manufacturing a wiring board includes forming a conductive pattern on an insulation layer, forming on the conductive pattern a resin insulation layer containing a resin and a silica-type filler, and irradiating a laser beam having an absorption rate with respect to the conductive pattern is in an approximate range of 30˜60% such that an opening portion reaching the conductive pattern is formed through the resin insulation layer. The silica-type filler in the resin insulation layer is in an amount of approximately 2˜60 wt. %. | 12-08-2011 |
| 20110296682 | MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board includes a first interlaminar resin insulating layer, a first conductor circuit formed on the first interlaminar resin insulating layer, a second interlaminar resin insulating layer formed on the first interlaminar resin insulating layer and the first conductor circuit, a second conductor circuit formed on the second interlaminar resin insulating layer. A via conductor can be formed in the opening portion. The opening portion of the second interlaminar resin insulating layer can expose a face of the first conductor circuit. The via conductor connects the first conductor circuit and the second conductor circuit. The via conductor includes an electroless plating film formed on inner wall face of the opening portion and includes an electrolytic plating film formed on the electroless plating film and on the exposed face of the first conductor circuit exposed by the opening portion. The second conductor circuit includes the electroless plating film and the electrolytic plating film. | 12-08-2011 |
| 20110296681 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME - A method for manufacturing a printed wiring board, including providing a support board having a metal foil secured to the support board, forming a resin insulation layer on the metal foil, forming openings in the resin insulation layer, forming a conductive circuit on the resin insulation layer, forming in the openings via conductors to electrically connect the conductive circuit and the metal foil, separating the support board and the metal foil, and forming from the metal foil external terminals to electrically connect to another substrate or electronic component. | 12-08-2011 |
| 20110296679 | WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD - A method of manufacturing a wiring board including forming a first wiring board, the forming of the first board including forming a substrate, forming a first insulation layer on a surface of the substrate and a second insulating layer on the opposite surface of the substrate, forming a via in one of the layers, and cutting the first layer in a first area and cutting the second layer in a second area offset from the first area to form a first substrate laminated to a second substrate with the substrate interposed therebetween, the second substrate having a smaller mounting area than that of the first substrate such that the first substrate extends beyond edge of the second substrate, connecting a pliable member to the substrate, and connecting the member to a second wiring board to connect the first and second boards. One or more insulation layers are a non-pliable layer. | 12-08-2011 |
| 20110290544 | PRINTED WIRING BOARD AND MANUFACTURING METHOD OF PRINTED WIRING BOARD - A printed wiring board including a core substrate, a build-up layer formed over the core substrate and including a first insulating layer, a conductor layer formed over the first insulating layer, and a second insulating layer formed over the conductor layer, and one or more wiring patterns formed over the first insulating layer. The conductor layer includes conductor portions, and the conductor portions have notched portions, respectively, facing each other across the wiring pattern. | 12-01-2011 |
| 20110289773 | METHOD OF MANUFACTURING PRINTED WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT - A printed wiring board is manufactured by a method in which a base substrate having a first insulation layer, a second insulation layer, and a conductive film is provided. An electronic component is placed on the first insulation layer at a position determined based on an alignment mark. After the electronic component is enclosed inside an opening of the second insulation layer, a via hole exposing a terminal of the electronic component is formed at a position determined based on the alignment mark, which is used to determine the position of the electronic component. A via conductor is formed in the via hole, and a conductive layer is formed on the conductive film and patterned to form a conductive circuit connected to the via conductor. | 12-01-2011 |
| 20110284282 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board wiring board including a substrate having a first penetrating hole and multiple second penetrating holes formed around the first penetrating hole, a first conductive portion and a second conductive portion formed on one surface of the substrate, a third conductive portion and a fourth conductive portion formed on the opposite surface of the substrate, a first through-hole conductor formed in the first penetrating hole and connecting the first conductive portion and the third conductive portion, and multiple second through-hole conductors formed in the second penetrating holes and connecting the second conductive portion and the fourth conductive portion. The first through-hole conductor and the second through-hole conductors are made of conductive material filled in the first penetrating hole or the second penetrating holes. | 11-24-2011 |
| 20110284277 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A printed wiring board including an insulation layer, a conductive circuit on the insulation layer, an outermost interlayer resin insulation layer formed on the insulation layer and the conductive circuit and having a via-conductor opening connected to the conductive circuit, a land structure including a first land formed on the outermost interlayer resin insulation layer around the via-conductor opening and a second land formed on the outermost interlayer resin insulation layer around the first land, and a via conductor formed in the via-conductor opening through the outermost interlayer resin insulation layer such that the first land of the land structure on the outermost interlayer resin insulation layer is connected to the conductive circuit on the insulation layer. The land structure has a space between the first land and second land of the land structure, and the first land of the land structure is directly connected to the via conductor. | 11-24-2011 |
| 20110283532 | FLEXIBLE WIRING BOARD AND METHOD OF MANUFACTURING SAME - A flexible wiring board includes a first flexible base material with a conductor pattern formed thereon, a second flexible base material disposed adjacent to the first flexible base material and an insulating layer covering the first flexible base material and the second flexible base material. The insulating layer exposes at least one portion of the first flexible base material. A conductor pattern is formed on the insulating layer, and a plating layer is provided connecting the conductor pattern of the first flexible base material and the conductor pattern on the insulating layer. | 11-24-2011 |
| 20110280772 | HOLDING SEALING MATERIAL, METHOD FOR WINDING THE HOLDING SEALING MATERIAL AROUND OBJECT AND EXHAUST GAS PURIFYING APPARATUS - A holding sealing material includes laminated mats. One or more fixed parts partially combine the mats. Each of the mats has a basic rectangular shape. Each of the mats has a recess on one of shorter sides of the rectangular shape and a projection on another shorter side and is designed to be wound around an object to be wound so that the projection and the recess are fitted to each other. The mats have respective longitudinal lengths that increase as a distance from the object to each of the mats increases. A mat that is placed at a closest position to the object has a shortest longitudinal length. An area of the projection of the mat that is placed at a closest position to the object is smaller than an area of the projection of a mat that is placed at a farthest position from the object. | 11-17-2011 |
| 20110280771 | HOLDING SEALING MATERIAL, METHOD FOR ROLLING HOLDING SEALING MATERIAL, AND EXHAUST GAS PURIFYING APPARATUS - A holding sealing material includes a mat including an inorganic fibrous material. In a plan view, the mat has a basic quadrangular shape consisting of long sides extending in a longitudinal direction and short sides substantially perpendicular to the long sides. The mat has a recessed portion at one of the short sides and a projected portion at another of the short sides, whereby the projected and recessed portions should fit to each other when the mat is rolled around a periphery of a member to be wrapped. In a cross-sectional view, the projected portion is a quadrangle and the recessed portion is a gap between two quadrangles. At least one corner portion of the projected portion is cut out on a side of the member to be wrapped or another corner portion of the quadrangle of the projected or recessed portions is cut out. | 11-17-2011 |
| 20110277432 | MAT, METHOD FOR PRODUCING THE MAT, AND EXHAUST GAS PURIFYING APPARATUS - A mat includes a first main face and a second main face opposite to the first main face. At least two layers include a first layer occupying a first area from the first main face along a thickness direction of the mat. The first layer includes a first long fibrous substance which includes an inorganic fibrous substance. A second layer is adjacent to the first layer. The second layer includes a short fibrous substance which includes an inorganic fibrous substance and which has an average fiber length shorter than an average fiber length of the first long fibrous substance. An intertwined portion extends from the first main face to the second main face. The intertwined portion includes the first long fibrous substance and the short fibrous substance being more closely intertwined with each other than the inorganic fibrous substances in a portion except the intertwined portion. | 11-17-2011 |
| 20110277322 | WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD - A wiring board and method of forming the wiring board. The wiring board includes a first substrate, and a second substrate having a smaller mounting area than a mounting area of the first substrate. A base substrate is laminated between the first substrate and the second substrate such that the first substrate extends beyond an edge of the second substrate, and at least one via formed in at least one of the first substrate or the second substrate. A thickness of a portion of the base substrate that is sandwiched between the first substrate and the second substrate is greater than a thickness of a portion of the base substrate that is not sandwiched between the first substrate and the second substrate. | 11-17-2011 |
| 20110272286 | METHOD OF MANUFACTURING MULTILAYER PRINTED WIRING BOARD - A method of manufacturing a multilayer printed wiring board includes forming a first interlaminar resin insulating layer, a first conductor circuit on the first interlaminar resin insulating layer, a second interlaminar resin insulating layer, opening portions in the second interlaminar resin insulating layer to expose a face of the first conductor circuit, an electroless plating film on the second interlaminar resin insulating layer and the exposed face, and a plating resist on the electroless plating film. The method further includes substituting the electroless plating film with a thin film conductor layer, having a lower ion tendency than the electroless plating film, and a metal of the exposed face, forming an electroplating film including the metal on a portion of the electroless plating film and the thin film conductor layer, stripping the plating resist, and removing the electroless plating film exposed by the stripping. | 11-10-2011 |
| 20110271524 | MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A multilayer printed wiring board includes a core substrate, a resin insulation layer laminated on the core substrate and a capacitor section coupled to the resin insulating layer. The capacitor section includes a first electrode including a first metal and configured to be charged by a negative charge, and a second electrode including a second metal and opposing the first electrode, the second electrode configured to be charged by a positive charge. A dielectric layer is interposed between the first electrode and second electrode, and an ionization tendency of the first metal is larger than and ionization tendency of the second metal. | 11-10-2011 |
| 20110265439 | HONEYCOMB STRUCTURE - A honeycomb structure includes a ceramic block, a coating layer and at least one of the bonding layer and the coating layer. The ceramic block includes a plurality of honeycomb units that are bonded together and that have a plurality of cells partitioned by cell walls using a bonding layer. The coating layer is provided on an outer peripheral portion of the ceramic block. The at least one of the bonding layer and the coating layer includes bubble marks having a diameter in a range of approximately 100 μm to approximately 300 μm and includes no bubble marks having a size exceeding approximately 300 μm. | 11-03-2011 |
| 20110265324 | INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER - A method for manufacturing an interposer including forming a first insulating layer comprising an inorganic material on a supporting substrate, forming a first wire in the first insulating layer, forming a second insulating layer on a first side of the first insulating layer, forming a second wire with a longer wire length and a greater thickness than the first wire on the second insulating layer, and removing the supporting substrate. | 11-03-2011 |
| 20110265323 | INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER - A method of manufacturing an interposer including forming an inorganic insulating layer over a support substrate, forming a first wiring in or on a surface of the inorganic insulating layer, forming an organic insulating layer over the inorganic insulating layer and the first wiring, forming a second wiring on the organic insulating layer, and forming a conductor portion connecting the second wiring and the first wiring. | 11-03-2011 |
| 20110263419 | HONEYCOMB STRUCTURE - A honeycomb structure includes a ceramic block including honeycomb fired bodies. The honeycomb fired bodies include an assembly including a plurality of substantially quadrangular-cross-section units which are combined with one another with an adhesive layer interposed between the plurality of substantially quadrangular-cross-section units. A peripheral face of the assembly of substantially quadrangular-cross-section units has a concave portion and a convex portion formed in a substantially step-shaped pattern. At least one substantially triangular-cross-section unit has an outer wall on a periphery portion of the at least one substantially triangular-cross-section unit. The at least one substantially triangular-cross-section unit is fit in the concave portion with the adhesive layer interposed between the at least one substantially triangular-cross-section unit and the concave portion. A sealing material layer is provided on a peripheral face of the ceramic block. The sealing material layer has partially different thickness. | 10-27-2011 |
| 20110263413 | HONEYCOMB STRUCTURE - A honeycomb structure includes a ceramic block. A plurality of honeycomb fired bodies include first-shaped units, second-shaped units, and third-shaped units. The first-shaped units include peripheral first-shaped units. Each of the peripheral first-shaped units is disposed in such a manner as to have two sides. One side of the two sides faces one of adjacent sides of one third-shaped unit among the third-shaped units with an adhesive layer therebetween. Another side of the two sides faces one of adjacent sides of another third-shaped unit among the third-shaped units with the adhesive layer therebetween. The two sides of each of the peripheral first-shaped units or extensions of the two sides are each neither substantially parallel nor substantially perpendicular to an extension of a second side and an extension of a first side of each of the second-shaped units. | 10-27-2011 |
| 20110262691 | HONEYCOMB STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a honeycomb structure includes extrusion-molding honeycomb molded bodies. The honeycomb molded bodies are fired to form honeycomb fired bodies. A molding frame optionally having a vent portion with air permeability is provided. The honeycomb fired bodies are fixed in the molding frame. A member having an other vent portion with air permeability is optionally disposed on an inner face side of the molding frame. A gap between the honeycomb fired bodies and a gap between the molding frame and the honeycomb fired bodies are filled with a sealing material paste. The sealing material paste includes inorganic particles and/or inorganic fibers. The sealing material paste is dried to solidify the sealing material paste and to form an adhesive layer and a coat layer. The sealing material paste is in contact with at least a part of the vent portion during the drying. | 10-27-2011 |
| 20110262688 | HONEYCOMB STRUCTURE AND METHOD FOR MANUFACTURING THE HONEYCOMB STRUCTURE - A honeycomb structure includes a ceramic block including honeycomb fired bodies. The honeycomb fired bodies includes at least one first-shaped unit having a substantially quadrangular shape in a cross section perpendicular to the longitudinal direction. At least one second-shaped unit has a shape that includes at least a first side, a second side making a substantially right angle with the first side, and an inclined side facing the substantially right angle in the cross section. The at least one second-shaped unit is located in a peripheral portion of the ceramic block and is disposed with the second side adjacent to the at least one first-shaped unit. The second side forming a periphery of the at least one second-shaped unit is longer than a longest side of four sides forming a periphery of the at least one first-shaped unit in the cross section. | 10-27-2011 |
| 20110259629 | HIGH-DIELECTRIC SHEET, A PRINTED CIRCUIT BOARD HAVING THE HIGH-DIELECTRIC SHEET AND PRODUCTION METHODS THEREOF - A method of producing a capacitor for a printed circuit board includes producing high-dielectric sheets and selecting ones of the high-dielectric sheets, which are substantially free from a defect after the heat process. Each of the high-dielectric sheets is produced by providing a first electrode, forming a first sputter film on the first electrode, forming an intermediate layer on the first sputter film by calcining a sol-gel film, forming a second sputter film on the intermediate layer, and providing a second electrode on the second sputter film. The high-dielectric sheets are subjected to a heat process in which the high-dielectric sheets are subjected to a first temperature at least once and a second temperature higher than the first temperature at least once. | 10-27-2011 |
| 20110259270 | CARBON COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A carbon component having a hole therein and an outer surface covered with a ceramic coating, and a method for manufacturing the carbon component are provided. The carbon component includes two carbon plate members joined together. The hole is defined by a groove formed on a mating surface of at least one of the carbon plate members and a mating portion of the other of the carbon plate members, which opposes the groove. An inner surface of the hole including a surface of the groove is entirely covered with a ceramic coating. | 10-27-2011 |
| 20110259192 | EXHAUST GAS PURIFYING SYSTEM, METHOD FOR MANUFACTURING THE EXHAUST GAS PURIFYING SYSTEM AND EXHAUST GAS PURIFYING METHOD USING THE EXHAUST GAS PURIFYING SYSTEM - An exhaust gas purifying system includes an exhaust gas purifying apparatus provided with a gas inlet side connected to an inlet pipe and a gas outlet side connected to an exhaust pipe. A holding sealing material of the exhaust gas purifying apparatus has a first side face and a second side face. The first side face is positioned on the gas outlet side and has a first slanting face formed on the first side face. The first slanting face has a first inside end point and a first outside end point. The first inside end point is positioned between the gas inlet side and the first outside end point. The first slanting face extends from the first inside end point to the first outside end point and is tilted relative to an end face of an exhaust gas treating body of the exhaust gas purifying apparatus. | 10-27-2011 |
| 20110253306 | MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD - A method of manufacturing a printed circuit board includes the following steps (A) to (D). (A) Laminating a resin insulating layer on each of two sides of a core member to form a core substrate, (B) forming penetrating openings in the core substrate by applying laser beams, (C) forming a rough surface on the core substrate, and (D) providing a metal film for each penetrating opening to form through holes. | 10-20-2011 |
| 20110252641 | MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD - A method of manufacturing a multi-layer printed circuit board includes the following steps (A) and (B). (A) Providing penetrating openings which are formed into through holes and each of which has a small diameter for a core substrate, and (B) providing penetrating openings which are formed into through holes each having a large diameter for the core substrate. | 10-20-2011 |
| 20110252640 | WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD - A method of manufacturing a wiring board including forming a base substrate, forming a first insulation layer on a first surface of the base substrate and a second insulating layer on a second surface of the substrate opposing the first surface, forming an IVH (Interstitial Via Hole) that penetrates the base substrate, and cutting the first insulating layer in a first area and cutting the second insulating layer in a second area offset from said first area to form a first substrate laminated to a second substrate with the base layer interposed therebetween, the second substrate having a smaller mounting area than that of the first substrate such that the first substrate extends beyond an edge of the second substrate. | 10-20-2011 |
| 20110252639 | PRINTED WIRING BOARD WITH A BUILT-IN RESISTIVE ELEMENT - A printed wiring board with a built-in resistive element comprising a first electrode formed on the surface of an insulating member, a second electrode provided adjacent to the first electrode to form a space therebetween, a resistor-filling part formed by the space between the first electrode and the second electrode, and a resistive element comprising a resistive material provided in the resistor-filling part wherein the resistor-filling part is substantially enclosed by the first electrode and the second electrode. | 10-20-2011 |
| 20110252638 | MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A multilayer printed wiring board including an insulation layer and a first interlayer resin insulation layer provided on the insulation layer. A layered capacitor section is provided on the first interlayer resin insulation layer and has a high dielectric layer and first and second layered electrodes that sandwich the high dielectric layer. Also included is a second interlayer resin insulation layer provided on the first interlayer resin insulation layer and the layered capacitor section, and a metal thin-film layer provided over the layered capacitor section and on the second interlayer resin insulation layer. An outermost interlayer resin insulation layer is provided on the second interlayer resin insulation layer and the metal thin-film layer, and a mounting section is provided on the outermost interlayer resin insulation layer and has first and second external terminals to mount a semiconductor element. Multiple via conductors penetrate each interlayer resin insulation layer. The via conductors include first via conductors that electrically connect the first layered electrode to the first external terminals, and second via conductors that electrically connect the second layered electrode to the second external terminals. | 10-20-2011 |
| 20110250382 | HONEYCOMB STRUCTURE AND METHOD FOR MANUFACTURING HONEYCOMB STRUCTURE - A honeycomb structure includes at least one pillar-shaped honeycomb unit and a pair of electrodes. The pillar-shaped honeycomb unit includes an outer peripheral wall and cell walls. The cell walls extend along a longitudinal direction of the honeycomb unit to define cells. The cell walls are composed of a ceramic aggregate having pores. The cell walls contain a substance having an electrical resistivity lower than an electrical resistivity of ceramic forming the ceramic aggregate. The pair of electrodes is arranged at the cell walls and/or the outer peripheral wall. | 10-13-2011 |
| 20110250097 | HONEYCOMB STRUCTURE - A honeycomb structure has a substantially circular-pillar-shape. The honeycomb structure includes at least one electrically conductive honeycomb unit, a first electrode, and a second electrode. The at least one electrically conductive honeycomb unit includes walls extending along a longitudinal direction of the at least one electrically conductive honeycomb unit to define a plurality of through holes. The first electrode is provided on an outer circumferential surface of the honeycomb structure. The second electrode is provided in a vicinity of a central axis of the honeycomb structure extending along the longitudinal direction. | 10-13-2011 |
| 20110250096 | HONEYCOMB STRUCTURE - A honeycomb structure includes at least one honeycomb unit. The at least one honeycomb unit includes a pair of electrodes and cell walls. The cell walls extend along a longitudinal direction of the at least one honeycomb unit to define a plurality of through holes. The cell walls have pores filled with a substance under a formation region of the pair of electrodes. The substance has an electrical resistivity lower than an electrical resistivity of a material to form the at least one honeycomb unit. | 10-13-2011 |
| 20110250095 | HONEYCOMB STRUCTURAL BODY AND EXHAUST GAS CONVERSION APPARATUS - A honeycomb structural body includes a plurality of honeycomb units adhered to each other by interposing an adhesive layer. Each of the honeycomb units has a substantially fan shaped cross section or a substantially elliptical fan shaped cross section perpendicular to a longitudinal direction of each of the honeycomb units. First and second electrodes are provided at a part of an outer peripheral surface of each of the honeycomb units that does not face the adhesive layer and are provided at a first area between each of the honeycomb units and the adhesive layer. And/or the first and second electrodes are provided at a second area between the outer peripheral surface of each of the honeycomb units and the adhesive layer and are provided at a third area including a center of the substantially fan shaped cross section or the substantially elliptical fan shaped cross section. | 10-13-2011 |
| 20110250094 | HONEYCOMB STRUCTURAL BODY AND EXHAUST GAS CONVERSION APPARATUS - A honeycomb structural body includes a plurality of honeycomb units, first and second electrodes, and first and second conductive members. The plurality of honeycomb units are adhered to each other by interposing an adhesive layer. Each of the plurality of honeycomb units contains a conductive ceramic material. Each of the plurality of honeycomb units includes cell walls extending along a longitudinal direction of each of the plurality of honeycomb units to define a plurality of through-holes. The first and second electrodes are provided on an outer peripheral surface of each of the plurality of honeycomb units. The first and second conductive members are electrically connected to the first and second electrodes, respectively. | 10-13-2011 |
| 20110247212 | WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD - A method of manufacturing a wiring board including forming a base substrate, forming a first insulation layer on a first surface of the base substrate and a second insulating layer on a second surface of the base substrate opposing the first surface, forming an IVH (Interstitial Via Hole) that penetrates the base substrate, forming vias in at least one of the first substrate or second substrate, and cutting the first insulating layer in a first area and cutting the second insulating layer in a second area offset from said first area to form a first substrate laminated to a second substrate with the base layer interposed therebetween, the second substrate having a smaller mounting area than a mounting area of the first substrate such that the first substrate extends beyond an edge of the second substrate. | 10-13-2011 |
| 20110247208 | MULTILAYERED PRINTED WIRING BOARD - A method of manufacturing a multilayered printed wiring board including forming a multilayered core substrate including insulation layers and one or more stacked via structures formed through the insulation layers, the stacked via structure including vias formed in the insulation layers, respectively, the insulation layers in the multilayered core substrate including at least three insulation layers and each of the insulation layers in the multilayered core substrate including a core material impregnated with a resin, and forming a build-up structure over the multilayered core substrate and including interlaminar insulation layers and conductor circuits, each of the interlaminar insulation layers including a resin material without a core material. | 10-13-2011 |
| 20110244198 | HOLDING SEALING MATERIAL - A holding sealing material includes at least one mat and at least one thread. The at least one mat includes inorganic fibers. The at least one thread is sewn in the at least one mat to provide identification information on the at least one mat. | 10-06-2011 |
| 20110240358 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes an insulation layer containing a resin and a silica-type filler and having a roughened surface, and a conductive layer formed on the roughened surface of the insulation layer and having a first conductive portion and a second conductive portion positioned adjacent to the first conductive portion. The roughened surface of the insulation layer has a roughness under the first conductive portion, a roughness under the second conductive portion, and a roughness between the first conductive portion and the second conductive portion, and the roughness between the first conductive portion and the second conductive portion is set less than at least one of the roughness under the first conductive portion and the roughness under the second conductive portion. | 10-06-2011 |
