| IBIDEN, CO., LTD. Patent applications |
| Patent application number | Title | Published |
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| 20120034415 | CARBON FIBER STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - A carbon fiber structure and a manufacturing method of the same are provided. The carbon fiber structure includes a carbon fiber-reinforced carbon composite material having carbon fibers and a carbonaceous matrix. The carbon fibers are configured by a substantially linear fiber. The carbon fibers form thin piece bodies in which a longitudinal direction of the carbon fibers is oriented in parallel to a surface direction of the carbon fiber structure within the carbonaceous matrix. The carbon fiber structure is configured by a laminate having the thin piece bodies laminated therein. | 02-09-2012 |
| 20120034401 | C/C COMPOSITE MATERIAL MOLDED BODY AND METHOD FOR MANUFACTURING THE SAME - A C/C composite material molded body and a method for manufacturing the same are provided. The C/C composite material molded body includes carbon fibers, and a carbonaceous matrix. The C/C composite material molded body has a shell-like structure, an outer surface of which is configured by a three-dimensional curved surface or a combination of a plurality of surfaces, and which is configured by a continuous structure having a uniform composition as a whole. A longitudinal direction of the carbon fibers is oriented along the outer surface. | 02-09-2012 |
| 20120034400 | CARBON FIBER-REINFORCED CARBON COMPOSITE MATERIAL AND METHOD FOR MANUFACTURING THE SAME - A carbon fiber-reinforced carbon composite material and a method for manufacturing the same are provided. The carbon fiber-reinforced carbon composite material includes carbon fibers, and a carbonaceous matrix. The carbon fiber-reinforced carbon composite material is integrally formed. The carbon fibers are a substantially linear fiber existing in a bare-fiber state within the carbonaceous matrix and having an average fiber length of less than about 1.0 mm. The carbon fiber-reinforced carbon composite material has a bulk density of about 1.2 g/cm | 02-09-2012 |
| 20120032335 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - An electronic component including a wiring board having a power-source pattern and a signal pattern, a semiconductor element mounted on the wiring board and having a power-source electrode pad and a signal electrode pad, a first connection portion being made of a conductive material and connecting the signal pattern of the wiring board and the signal electrode pad of the semiconductor element, and a second connection portion being made of a conductive material and connecting the power-source pattern of the wiring board and the power-source electrode pad of the semiconductor element. The conductive material of the first connection portion and the conductive material of the second connection portion are selected such that the conductive material of the second connection portion has an electrical resistance which is lower than an electrical resistance of the conductive material of the first connection portion. | 02-09-2012 |
| 20120031659 | Printed Wiring Board And A Method Of Manufacturing A Printed Wiring Board - A method of manufacturing a printed wiring board with solder bumps includes forming a solder-resist layer having small and large apertures exposing a respective conductive pad of the printed wiring board, loading a solder ball in each of the small and large apertures using a mask with aperture areas corresponding to the apertures of the solder-resist layer, forming a first bump having a first height, from the solder ball in the small aperture, and a second bump having a second height, from the solder ball in the large aperture, the first height being greater than the second height, and pressing a top of the first bump such that the first height becomes substantially the same as the second height. A multilayer printed wiring board includes a solder-resist layer with apertures of differing sizes and solder bumps having substantially equal volumes but a difference in height no greater than | 02-09-2012 |
| 20120031062 | HONEYCOMB STRUCTURAL BODY - An object of the present invention is to provide a honeycomb structural body which is low in pressure loss and can prolong a period up to a regenerating process. The present invention is directed to a columnar honeycomb structural body comprising a large number of through holes placed in parallel with one another in a length direction with wall portion interposed therebetween, wherein: each of the through holes has one of ends sealed; one end face of the through hole differs in opening area from the other end face thereof; a ceramic material which constitutes the wall portion has an average pore diameter in a range from 5 to 30 μm; and the rate of capacity of micro pores each having a pore diameter two or more times larger than the average pore diameter is set to 30% or less of the capacity of the entire micro pores. | 02-09-2012 |
| 20120020612 | OPTICAL INTERCONNECT - An optical interconnect device including a first printed wiring board, a second printed wiring board facing the first printed wiring board, a light-emitting device positioned on the first printed wiring board and electrically connected to the first printed wiring board, a light-receiving device positioned on the second printed wiring board and electrically connected to the second printed wiring board such that the light-receiving device faces the light-emitting device and receives an optical signal transmitted in a direct line from the light-emitting device, and an electrical-connection device mounted on the first printed wiring board and the second printed wiring board such that the first printed wiring board is electrically connected to the second printed wiring board. | 01-26-2012 |
| 20120018198 | ELECTRONIC COMPONENT AND PRINTED WIRING BOARD - An electronic component including a substrate having a surface and one or more trench portions opening on the surface, a capacitor portion having a lower electrode formed on the surface of the substrate and on the wall surface of the trench portion, a dielectric layer formed on the lower electrode, and an upper electrode formed on the dielectric layer, a resin filler filling the space inside the trench portion lined by the upper electrode, an insulation layer formed on the surface of the substrate, a conductive portion formed on the insulation layer and positioned to cover the trench portion, and a via conductor connecting the conductive portion and one of the lower electrode and the upper electrode. | 01-26-2012 |
| 20120014862 | GRAPHITE MATERIAL - A graphite material includes a plurality of graphite particles and a plurality of pores. The plurality of graphite particles and the plurality of pores form a microstructure. A ratio of an elastic modulus to a compression strength of the graphite material ranges from 109 to 138. Preferably, a ratio of a total area of the pores to a whole area of the graphite material in a cross-section of the graphite material ranges from 17.94% to 19.97%. | 01-19-2012 |
| 20120012464 | PRINTED WIRING BOARD AND A METHOD OF PRODUCTION THEREOF - A method for manufacturing a printed wiring board including providing an insulating resin substrate having first and second surfaces, irradiating laser upon the first surface such that a first opening portion having an opening on the first surface and tapering inward is formed, irradiating laser upon the second surface such that a second opening portion having an opening on the second surface, tapering inward and communicated to the first opening portion is formed and that a penetrating-hole having the first and second opening portions is formed, forming an electroless plated film on an inner wall surface of the penetrating-hole, and forming an electrolytic plated film on the electroless plated film such that a through hole conductor structure is formed in the penetrating-hole. The opening of the first portion has an axis of the center of gravity offset with respect to that of the opening of the second opening portion. | 01-19-2012 |
| 20120012368 | MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board including a main substrate including a base material and having an opening portion, and a flex-rigid printed wiring board connected to the main substrate in the opening portion of the main substrate and including a rigid substrate and a flexible substrate, the rigid substrate including a non-flexible base material, the flexible substrate including a flexible base material. | 01-19-2012 |
| 20120008297 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board including a first rigid wiring board including a conductor and having an accommodation portion, the accommodation portion having wall surfaces, a second rigid wiring board accommodated in the accommodation portion and including a conductor electrically connected to the conductor of the first rigid wiring board, the second rigid wiring board having side surfaces, an insulation layer formed on the first rigid wiring board and the second rigid wiring board, and a metal film having a solid pattern formed directly on a boundary portion formed between the wall surfaces of the accommodation portion and the side surfaces of the second rigid wiring board. | 01-12-2012 |
| 20120008296 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board including a first rigid wiring board having an accommodation portion and a conductor, a second rigid wiring board accommodated in the accommodation portion of the first rigid wiring board and having a conductor electrically connected to the conductor of the first rigid wiring board, and an insulation layer formed on the first rigid wiring board and the second rigid wiring board. The accommodation portion of the first rigid wiring board has wall surfaces tapering from a first surface of the first rigid wiring board to a second surface on the opposite side of the first surface, and the second rigid wiring board has side surfaces tapering such that the side surfaces of the second rigid wiring board substantially fit into the wall surfaces of the accommodation portion of the first rigid wiring board. | 01-12-2012 |
| 20120008295 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board has a first resin insulation layer, a first conductive pattern formed on the first resin insulation layer, a second resin insulation layer formed on the first conductive pattern and having an opening portion exposing at least a portion of the first conductive pattern, a second conductive pattern formed on the second resin insulation layer, and a via conductor formed in the opening portion of the second resin insulation layer and electrically connecting the first conductive pattern and the second conductive pattern. The via conductor has a side surface extending between the first conductive pattern and the second conductive pattern and a bent portion where an inclination of the side surface of the via conductor changes in a depth direction of the via conductor. | 01-12-2012 |
| 20120008293 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A wiring board has a base substrate, a conductive pattern formed on the base substrate, an insulation layer formed on the conductive pattern and the base substrate and including a resin-impregnated inorganic cloth, a conductive pattern formed on the insulating layer, a via formed in the insulation layer and connecting the conductive pattern formed on the base substrate and the conductive pattern formed on the insulating layer, and a through-hole connected to the conductive pattern formed on the base substrate, penetrating through the base substrate and having a hole diameter in a range of 10 μm to 150 μm. | 01-12-2012 |
| 20120008290 | FLEX-RIGID WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A flex-rigid wiring board includes a flexible board including a flexible substrate and a conductor pattern formed over the flexible substrate, a non-flexible substrate disposed adjacent to the flexible board, an insulating layer covering the flexible board and the non-flexible substrate and exposing one or more portions of the flexible board, a conductor pattern formed on the insulating layer, and a plating layer connecting the conductor pattern of the flexible board and the conductor pattern on the insulating layer. | 01-12-2012 |
| 20120006592 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board including a first insulation layer, a conductive pattern formed on the first insulation layer, a second insulation layer formed on the conductive pattern and the first insulation layer and having an opening portion exposing at least a portion of the conductive pattern, and a connection conductor formed in the opening portion of the second insulation layer such that the connection conductor is positioned on the portion of the conductive pattern. The connection conductor has a tip portion which protrudes from a surface of the second insulation layer and which has a tapered side surface tapering toward an end of the tip portion. | 01-12-2012 |
| 20120006587 | MULTILAYERED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a multilayered printed circuit board including forming a first insulating resin substrate having a metal layer substantially corresponding to dimensions of a semiconductor device, forming a second insulating resin substrate, forming a recess extending to the metal layer of the first insulating resin substrate such that a surface of the metal layer is exposed, accommodating the semiconductor device in the recess such that the semiconductor device is mounted on the surface of the metal layer, and forming a resin insulating layer on the first insulating resin substrate such that the semiconductor device accommodated in the recess is covered. | 01-12-2012 |
| 20120006469 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - A method for manufacturing a printed circuit board including providing a first resin substrate having a resin plate and a circuit pattern formed on a surface of the resin plate, providing a second resin substrate having a resin plate and an accommodation portion formed in the resin plate of the second substrate, connecting an electrode of a capacitor to the circuit pattern of the first substrate with a bonding material such that the capacitor is mounted to the first substrate, attaching the second substrate to the resin substrate through a bonding resin layer such that the capacitor on the first substrate is accommodated in the accommodation portion of the second substrate, and forming a via hole in the first substrate such that the via hole is electrically connected to the electrode of the capacitor in the accommodation portion of the second substrate. | 01-12-2012 |
| 20120005889 | MULTILAYER PRINTED WIRING BOARD - A method for manufacturing a multilayer printed wiring board including forming a multilayer printed wiring board structure comprising first and second buildup portions, the first buildup portion including insulating layers, conductor layers and first viaholes electrically connecting the conductor layers through the insulation layers such that the first viaholes are formed in the insulating layers, respectively, the second buildup portion including insulating layers, conductor layers and second viaholes electrically connecting the conductor layers through the insulation layers such that the first viaholes are tapered toward the second viaholes, and the second via holes are tapered toward the first viaholes. The viaholes are formed by plating openings formed after lamination of respective ones of the insulating layers of the buildup portions, and each insulating layer in the buildup portions is about 100 μm or less in thickness. | 01-12-2012 |
| 20120005888 | PLATING APPARATUS, PLATING METHOD AND MULTILAYER PRINTED CIRCUIT BOARD - A method for manufacturing a multilayer printed circuit board including providing a core substrate having a penetrating-hole, forming an electroless plated film on a surface of the substrate and an inner wall surface of the penetrating-hole, electrolytically plating the substrate while moving with respect to the surface of the substrate an insulating member in contact with the surface of the substrate such that an electrolytic plated film is formed on the electroless plated film, an opening space inside the penetrating-hole is filled with an electrolytic material, and a through-hole conductor structure is formed in the penetrating-hole, forming an etching resist having an opening pattern on the electrolytic plated film, and removing an exposed pattern of the electrolytic plated film exposed by the opening pattern and a pattern of the electroless plated film under the exposed pattern such that a conductor circuit is formed on the surface of the substrate. | 01-12-2012 |
| 20120000068 | PRINTED CIRCUIT BOARD MANUFACTURING METHOD - A method for manufacturing a printed circuit board, including providing a core substrate having an electronic component accommodated in the core substrate; forming a positioning mark on the core substrate; forming an interlayer insulating layer over the core substrate, the positioning mark and the electronic component; forming a via hole opening connecting to the electronic component through the interlayer insulating layer in accordance with the positioning mark on the core substrate; and forming a via hole structure in the via hole opening in the interlayer insulating layer such that the via hole structure is electrically connected to the electronic component. | 01-05-2012 |
| 20110314668 | MULTILAYERED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a multilayered printed circuit board including forming a first insulating resin substrate having a metal layer substantially corresponding to dimensions of a semiconductor device, forming a second insulating resin substrate, forming a recess extending to the metal layer of the first insulating resin substrate such that a surface of the metal layer is exposed, accommodating the semiconductor device in the recess such that the semiconductor device is mounted on the surface of the metal layer, and forming a resin insulating layer on the first insulating resin substrate such that the semiconductor device accommodated in the recess is covered. | 12-29-2011 |
| 20110308079 | FLEX-RIGID WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A flex-rigid wiring board includes a flexible board including a flexible substrate and a conductor pattern formed over the flexible substrate, a non-flexible substrate disposed adjacent to the flexible board, an insulating layer covering the flexible board and the non-flexible substrate and exposing one or more portions of the flexible board, a conductor pattern formed on the insulating layer, and a plating layer connecting the conductor pattern of the flexible board and the conductor pattern on the insulating layer. | 12-22-2011 |
| 20110304997 | PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND PRINTED WIRING BOARD MANUFACTURING METHOD - A printed wiring board includes an insulating resinous substrate having an aperture unit, a first terminal unit and a second terminal unit consisting of a conductor and formed on top of the resinous substrate, and a fuse unit that electrically couples the first terminal unit and the second terminal unit to each other. At least a part of the fuse unit is disposed over the aperture unit, and in addition, is covered by a porous inorganic covering material having insulating properties. | 12-15-2011 |
| 20110304084 | METHOD FOR PRODUCING HONEYCOMB FILTER AND METHOD FOR PRODUCING CERAMIC FILTER ASSEMBLY - A method for producing a honeycomb filter includes mixing ceramic particles and a binder to obtain a ceramic raw material slurry. The ceramic raw material slurry is provided into an extruder to obtain a molded honeycomb filter. The molded honeycomb filter includes cell walls extending along a longitudinal direction of the molded honeycomb filter to define cells having a substantially square shape. The molded honeycomb filter is dried using a microwave dryer. A sealing paste is provided in at least one of the cells at one end face of the honeycomb filter to seal the at least one of the cells at the one end face. The sealing paste is dried using a microwave dryer. The dried molded honeycomb filter is sintered. | 12-15-2011 |
| 20110303451 | MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board including a core substrate, a first conductor layer on a first surface of the substrate, a second conductor layer on a second surface of the substrate, a third conductor layer inside the substrate between the first and second conductor layers, a conductive post connecting the third conductor layer with the first and second conductor layers, a first conductor circuit on the first surface of the substrate, a second conductor circuit on the second surface of the substrate, and a through hole formed through the substrate and connecting the first and second conductor circuits. The through hole is not connected to the third conductor layer, the third conductor layer has thickness larger than thicknesses of the first and second conductor layers, each of the first, second and third conductor layers forms one of power supply and ground layers, and the through hole forms a signal line. | 12-15-2011 |
| 20110302779 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME - A method for manufacturing a printed wiring board including providing a support member having a metal surface, securing a metal foil to the metal surface such that the metal foil is joined or bonded to a peripheral portion of the metal surface, forming a resin insulation layer on the metal foil secured on the metal surface, forming an opening for a via conductor in the resin insulation layer, forming a conductive circuit on the resin insulation layer, forming in the opening a via conductor electrically connecting the conductive circuit and the metal foil such that a laminated sheet body is formed, and cutting a portion of the laminated sheet body inside the peripheral portion of the metal surface of the support member such that the metal foil releases the portion of the laminated sheet body from the support member. | 12-15-2011 |
| 20110300307 | METHOD FOR MANUFACTURING WIRING BOARD - A method for manufacturing a wiring board includes forming a conductive pattern on an insulation layer, forming on the conductive pattern a resin insulation layer containing a resin and a silica-type filler, and irradiating a laser beam having an absorption rate with respect to the conductive pattern is in an approximate range of 30˜60% such that an opening portion reaching the conductive pattern is formed through the resin insulation layer. The silica-type filler in the resin insulation layer is in an amount of approximately 2˜60 wt. %. | 12-08-2011 |
| 20110296682 | MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board includes a first interlaminar resin insulating layer, a first conductor circuit formed on the first interlaminar resin insulating layer, a second interlaminar resin insulating layer formed on the first interlaminar resin insulating layer and the first conductor circuit, a second conductor circuit formed on the second interlaminar resin insulating layer. A via conductor can be formed in the opening portion. The opening portion of the second interlaminar resin insulating layer can expose a face of the first conductor circuit. The via conductor connects the first conductor circuit and the second conductor circuit. The via conductor includes an electroless plating film formed on inner wall face of the opening portion and includes an electrolytic plating film formed on the electroless plating film and on the exposed face of the first conductor circuit exposed by the opening portion. The second conductor circuit includes the electroless plating film and the electrolytic plating film. | 12-08-2011 |
| 20110296681 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME - A method for manufacturing a printed wiring board, including providing a support board having a metal foil secured to the support board, forming a resin insulation layer on the metal foil, forming openings in the resin insulation layer, forming a conductive circuit on the resin insulation layer, forming in the openings via conductors to electrically connect the conductive circuit and the metal foil, separating the support board and the metal foil, and forming from the metal foil external terminals to electrically connect to another substrate or electronic component. | 12-08-2011 |
| 20110296679 | WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD - A method of manufacturing a wiring board including forming a first wiring board, the forming of the first board including forming a substrate, forming a first insulation layer on a surface of the substrate and a second insulating layer on the opposite surface of the substrate, forming a via in one of the layers, and cutting the first layer in a first area and cutting the second layer in a second area offset from the first area to form a first substrate laminated to a second substrate with the substrate interposed therebetween, the second substrate having a smaller mounting area than that of the first substrate such that the first substrate extends beyond edge of the second substrate, connecting a pliable member to the substrate, and connecting the member to a second wiring board to connect the first and second boards. One or more insulation layers are a non-pliable layer. | 12-08-2011 |
| 20110290544 | PRINTED WIRING BOARD AND MANUFACTURING METHOD OF PRINTED WIRING BOARD - A printed wiring board including a core substrate, a build-up layer formed over the core substrate and including a first insulating layer, a conductor layer formed over the first insulating layer, and a second insulating layer formed over the conductor layer, and one or more wiring patterns formed over the first insulating layer. The conductor layer includes conductor portions, and the conductor portions have notched portions, respectively, facing each other across the wiring pattern. | 12-01-2011 |
| 20110289773 | METHOD OF MANUFACTURING PRINTED WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT - A printed wiring board is manufactured by a method in which a base substrate having a first insulation layer, a second insulation layer, and a conductive film is provided. An electronic component is placed on the first insulation layer at a position determined based on an alignment mark. After the electronic component is enclosed inside an opening of the second insulation layer, a via hole exposing a terminal of the electronic component is formed at a position determined based on the alignment mark, which is used to determine the position of the electronic component. A via conductor is formed in the via hole, and a conductive layer is formed on the conductive film and patterned to form a conductive circuit connected to the via conductor. | 12-01-2011 |
| 20110284282 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board wiring board including a substrate having a first penetrating hole and multiple second penetrating holes formed around the first penetrating hole, a first conductive portion and a second conductive portion formed on one surface of the substrate, a third conductive portion and a fourth conductive portion formed on the opposite surface of the substrate, a first through-hole conductor formed in the first penetrating hole and connecting the first conductive portion and the third conductive portion, and multiple second through-hole conductors formed in the second penetrating holes and connecting the second conductive portion and the fourth conductive portion. The first through-hole conductor and the second through-hole conductors are made of conductive material filled in the first penetrating hole or the second penetrating holes. | 11-24-2011 |
| 20110284277 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A printed wiring board including an insulation layer, a conductive circuit on the insulation layer, an outermost interlayer resin insulation layer formed on the insulation layer and the conductive circuit and having a via-conductor opening connected to the conductive circuit, a land structure including a first land formed on the outermost interlayer resin insulation layer around the via-conductor opening and a second land formed on the outermost interlayer resin insulation layer around the first land, and a via conductor formed in the via-conductor opening through the outermost interlayer resin insulation layer such that the first land of the land structure on the outermost interlayer resin insulation layer is connected to the conductive circuit on the insulation layer. The land structure has a space between the first land and second land of the land structure, and the first land of the land structure is directly connected to the via conductor. | 11-24-2011 |
| 20110283532 | FLEXIBLE WIRING BOARD AND METHOD OF MANUFACTURING SAME - A flexible wiring board includes a first flexible base material with a conductor pattern formed thereon, a second flexible base material disposed adjacent to the first flexible base material and an insulating layer covering the first flexible base material and the second flexible base material. The insulating layer exposes at least one portion of the first flexible base material. A conductor pattern is formed on the insulating layer, and a plating layer is provided connecting the conductor pattern of the first flexible base material and the conductor pattern on the insulating layer. | 11-24-2011 |
| 20110280772 | HOLDING SEALING MATERIAL, METHOD FOR WINDING THE HOLDING SEALING MATERIAL AROUND OBJECT AND EXHAUST GAS PURIFYING APPARATUS - A holding sealing material includes laminated mats. One or more fixed parts partially combine the mats. Each of the mats has a basic rectangular shape. Each of the mats has a recess on one of shorter sides of the rectangular shape and a projection on another shorter side and is designed to be wound around an object to be wound so that the projection and the recess are fitted to each other. The mats have respective longitudinal lengths that increase as a distance from the object to each of the mats increases. A mat that is placed at a closest position to the object has a shortest longitudinal length. An area of the projection of the mat that is placed at a closest position to the object is smaller than an area of the projection of a mat that is placed at a farthest position from the object. | 11-17-2011 |
| 20110280771 | HOLDING SEALING MATERIAL, METHOD FOR ROLLING HOLDING SEALING MATERIAL, AND EXHAUST GAS PURIFYING APPARATUS - A holding sealing material includes a mat including an inorganic fibrous material. In a plan view, the mat has a basic quadrangular shape consisting of long sides extending in a longitudinal direction and short sides substantially perpendicular to the long sides. The mat has a recessed portion at one of the short sides and a projected portion at another of the short sides, whereby the projected and recessed portions should fit to each other when the mat is rolled around a periphery of a member to be wrapped. In a cross-sectional view, the projected portion is a quadrangle and the recessed portion is a gap between two quadrangles. At least one corner portion of the projected portion is cut out on a side of the member to be wrapped or another corner portion of the quadrangle of the projected or recessed portions is cut out. | 11-17-2011 |
| 20110277432 | MAT, METHOD FOR PRODUCING THE MAT, AND EXHAUST GAS PURIFYING APPARATUS - A mat includes a first main face and a second main face opposite to the first main face. At least two layers include a first layer occupying a first area from the first main face along a thickness direction of the mat. The first layer includes a first long fibrous substance which includes an inorganic fibrous substance. A second layer is adjacent to the first layer. The second layer includes a short fibrous substance which includes an inorganic fibrous substance and which has an average fiber length shorter than an average fiber length of the first long fibrous substance. An intertwined portion extends from the first main face to the second main face. The intertwined portion includes the first long fibrous substance and the short fibrous substance being more closely intertwined with each other than the inorganic fibrous substances in a portion except the intertwined portion. | 11-17-2011 |
| 20110277322 | WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD - A wiring board and method of forming the wiring board. The wiring board includes a first substrate, and a second substrate having a smaller mounting area than a mounting area of the first substrate. A base substrate is laminated between the first substrate and the second substrate such that the first substrate extends beyond an edge of the second substrate, and at least one via formed in at least one of the first substrate or the second substrate. A thickness of a portion of the base substrate that is sandwiched between the first substrate and the second substrate is greater than a thickness of a portion of the base substrate that is not sandwiched between the first substrate and the second substrate. | 11-17-2011 |
| 20110272286 | METHOD OF MANUFACTURING MULTILAYER PRINTED WIRING BOARD - A method of manufacturing a multilayer printed wiring board includes forming a first interlaminar resin insulating layer, a first conductor circuit on the first interlaminar resin insulating layer, a second interlaminar resin insulating layer, opening portions in the second interlaminar resin insulating layer to expose a face of the first conductor circuit, an electroless plating film on the second interlaminar resin insulating layer and the exposed face, and a plating resist on the electroless plating film. The method further includes substituting the electroless plating film with a thin film conductor layer, having a lower ion tendency than the electroless plating film, and a metal of the exposed face, forming an electroplating film including the metal on a portion of the electroless plating film and the thin film conductor layer, stripping the plating resist, and removing the electroless plating film exposed by the stripping. | 11-10-2011 |
| 20110271524 | MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A multilayer printed wiring board includes a core substrate, a resin insulation layer laminated on the core substrate and a capacitor section coupled to the resin insulating layer. The capacitor section includes a first electrode including a first metal and configured to be charged by a negative charge, and a second electrode including a second metal and opposing the first electrode, the second electrode configured to be charged by a positive charge. A dielectric layer is interposed between the first electrode and second electrode, and an ionization tendency of the first metal is larger than and ionization tendency of the second metal. | 11-10-2011 |
| 20110265439 | HONEYCOMB STRUCTURE - A honeycomb structure includes a ceramic block, a coating layer and at least one of the bonding layer and the coating layer. The ceramic block includes a plurality of honeycomb units that are bonded together and that have a plurality of cells partitioned by cell walls using a bonding layer. The coating layer is provided on an outer peripheral portion of the ceramic block. The at least one of the bonding layer and the coating layer includes bubble marks having a diameter in a range of approximately 100 μm to approximately 300 μm and includes no bubble marks having a size exceeding approximately 300 μm. | 11-03-2011 |
| 20110265324 | INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER - A method for manufacturing an interposer including forming a first insulating layer comprising an inorganic material on a supporting substrate, forming a first wire in the first insulating layer, forming a second insulating layer on a first side of the first insulating layer, forming a second wire with a longer wire length and a greater thickness than the first wire on the second insulating layer, and removing the supporting substrate. | 11-03-2011 |
| 20110265323 | INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER - A method of manufacturing an interposer including forming an inorganic insulating layer over a support substrate, forming a first wiring in or on a surface of the inorganic insulating layer, forming an organic insulating layer over the inorganic insulating layer and the first wiring, forming a second wiring on the organic insulating layer, and forming a conductor portion connecting the second wiring and the first wiring. | 11-03-2011 |
| 20110263419 | HONEYCOMB STRUCTURE - A honeycomb structure includes a ceramic block including honeycomb fired bodies. The honeycomb fired bodies include an assembly including a plurality of substantially quadrangular-cross-section units which are combined with one another with an adhesive layer interposed between the plurality of substantially quadrangular-cross-section units. A peripheral face of the assembly of substantially quadrangular-cross-section units has a concave portion and a convex portion formed in a substantially step-shaped pattern. At least one substantially triangular-cross-section unit has an outer wall on a periphery portion of the at least one substantially triangular-cross-section unit. The at least one substantially triangular-cross-section unit is fit in the concave portion with the adhesive layer interposed between the at least one substantially triangular-cross-section unit and the concave portion. A sealing material layer is provided on a peripheral face of the ceramic block. The sealing material layer has partially different thickness. | 10-27-2011 |
| 20110263413 | HONEYCOMB STRUCTURE - A honeycomb structure includes a ceramic block. A plurality of honeycomb fired bodies include first-shaped units, second-shaped units, and third-shaped units. The first-shaped units include peripheral first-shaped units. Each of the peripheral first-shaped units is disposed in such a manner as to have two sides. One side of the two sides faces one of adjacent sides of one third-shaped unit among the third-shaped units with an adhesive layer therebetween. Another side of the two sides faces one of adjacent sides of another third-shaped unit among the third-shaped units with the adhesive layer therebetween. The two sides of each of the peripheral first-shaped units or extensions of the two sides are each neither substantially parallel nor substantially perpendicular to an extension of a second side and an extension of a first side of each of the second-shaped units. | 10-27-2011 |
| 20110262691 | HONEYCOMB STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a honeycomb structure includes extrusion-molding honeycomb molded bodies. The honeycomb molded bodies are fired to form honeycomb fired bodies. A molding frame optionally having a vent portion with air permeability is provided. The honeycomb fired bodies are fixed in the molding frame. A member having an other vent portion with air permeability is optionally disposed on an inner face side of the molding frame. A gap between the honeycomb fired bodies and a gap between the molding frame and the honeycomb fired bodies are filled with a sealing material paste. The sealing material paste includes inorganic particles and/or inorganic fibers. The sealing material paste is dried to solidify the sealing material paste and to form an adhesive layer and a coat layer. The sealing material paste is in contact with at least a part of the vent portion during the drying. | 10-27-2011 |
| 20110262688 | HONEYCOMB STRUCTURE AND METHOD FOR MANUFACTURING THE HONEYCOMB STRUCTURE - A honeycomb structure includes a ceramic block including honeycomb fired bodies. The honeycomb fired bodies includes at least one first-shaped unit having a substantially quadrangular shape in a cross section perpendicular to the longitudinal direction. At least one second-shaped unit has a shape that includes at least a first side, a second side making a substantially right angle with the first side, and an inclined side facing the substantially right angle in the cross section. The at least one second-shaped unit is located in a peripheral portion of the ceramic block and is disposed with the second side adjacent to the at least one first-shaped unit. The second side forming a periphery of the at least one second-shaped unit is longer than a longest side of four sides forming a periphery of the at least one first-shaped unit in the cross section. | 10-27-2011 |
| 20110259629 | HIGH-DIELECTRIC SHEET, A PRINTED CIRCUIT BOARD HAVING THE HIGH-DIELECTRIC SHEET AND PRODUCTION METHODS THEREOF - A method of producing a capacitor for a printed circuit board includes producing high-dielectric sheets and selecting ones of the high-dielectric sheets, which are substantially free from a defect after the heat process. Each of the high-dielectric sheets is produced by providing a first electrode, forming a first sputter film on the first electrode, forming an intermediate layer on the first sputter film by calcining a sol-gel film, forming a second sputter film on the intermediate layer, and providing a second electrode on the second sputter film. The high-dielectric sheets are subjected to a heat process in which the high-dielectric sheets are subjected to a first temperature at least once and a second temperature higher than the first temperature at least once. | 10-27-2011 |
| 20110259270 | CARBON COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A carbon component having a hole therein and an outer surface covered with a ceramic coating, and a method for manufacturing the carbon component are provided. The carbon component includes two carbon plate members joined together. The hole is defined by a groove formed on a mating surface of at least one of the carbon plate members and a mating portion of the other of the carbon plate members, which opposes the groove. An inner surface of the hole including a surface of the groove is entirely covered with a ceramic coating. | 10-27-2011 |
| 20110259192 | EXHAUST GAS PURIFYING SYSTEM, METHOD FOR MANUFACTURING THE EXHAUST GAS PURIFYING SYSTEM AND EXHAUST GAS PURIFYING METHOD USING THE EXHAUST GAS PURIFYING SYSTEM - An exhaust gas purifying system includes an exhaust gas purifying apparatus provided with a gas inlet side connected to an inlet pipe and a gas outlet side connected to an exhaust pipe. A holding sealing material of the exhaust gas purifying apparatus has a first side face and a second side face. The first side face is positioned on the gas outlet side and has a first slanting face formed on the first side face. The first slanting face has a first inside end point and a first outside end point. The first inside end point is positioned between the gas inlet side and the first outside end point. The first slanting face extends from the first inside end point to the first outside end point and is tilted relative to an end face of an exhaust gas treating body of the exhaust gas purifying apparatus. | 10-27-2011 |
| 20110253306 | MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD - A method of manufacturing a printed circuit board includes the following steps (A) to (D). (A) Laminating a resin insulating layer on each of two sides of a core member to form a core substrate, (B) forming penetrating openings in the core substrate by applying laser beams, (C) forming a rough surface on the core substrate, and (D) providing a metal film for each penetrating opening to form through holes. | 10-20-2011 |
| 20110252641 | MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD - A method of manufacturing a multi-layer printed circuit board includes the following steps (A) and (B). (A) Providing penetrating openings which are formed into through holes and each of which has a small diameter for a core substrate, and (B) providing penetrating openings which are formed into through holes each having a large diameter for the core substrate. | 10-20-2011 |
| 20110252640 | WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD - A method of manufacturing a wiring board including forming a base substrate, forming a first insulation layer on a first surface of the base substrate and a second insulating layer on a second surface of the substrate opposing the first surface, forming an IVH (Interstitial Via Hole) that penetrates the base substrate, and cutting the first insulating layer in a first area and cutting the second insulating layer in a second area offset from said first area to form a first substrate laminated to a second substrate with the base layer interposed therebetween, the second substrate having a smaller mounting area than that of the first substrate such that the first substrate extends beyond an edge of the second substrate. | 10-20-2011 |
| 20110252639 | PRINTED WIRING BOARD WITH A BUILT-IN RESISTIVE ELEMENT - A printed wiring board with a built-in resistive element comprising a first electrode formed on the surface of an insulating member, a second electrode provided adjacent to the first electrode to form a space therebetween, a resistor-filling part formed by the space between the first electrode and the second electrode, and a resistive element comprising a resistive material provided in the resistor-filling part wherein the resistor-filling part is substantially enclosed by the first electrode and the second electrode. | 10-20-2011 |
| 20110252638 | MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A multilayer printed wiring board including an insulation layer and a first interlayer resin insulation layer provided on the insulation layer. A layered capacitor section is provided on the first interlayer resin insulation layer and has a high dielectric layer and first and second layered electrodes that sandwich the high dielectric layer. Also included is a second interlayer resin insulation layer provided on the first interlayer resin insulation layer and the layered capacitor section, and a metal thin-film layer provided over the layered capacitor section and on the second interlayer resin insulation layer. An outermost interlayer resin insulation layer is provided on the second interlayer resin insulation layer and the metal thin-film layer, and a mounting section is provided on the outermost interlayer resin insulation layer and has first and second external terminals to mount a semiconductor element. Multiple via conductors penetrate each interlayer resin insulation layer. The via conductors include first via conductors that electrically connect the first layered electrode to the first external terminals, and second via conductors that electrically connect the second layered electrode to the second external terminals. | 10-20-2011 |
| 20110250382 | HONEYCOMB STRUCTURE AND METHOD FOR MANUFACTURING HONEYCOMB STRUCTURE - A honeycomb structure includes at least one pillar-shaped honeycomb unit and a pair of electrodes. The pillar-shaped honeycomb unit includes an outer peripheral wall and cell walls. The cell walls extend along a longitudinal direction of the honeycomb unit to define cells. The cell walls are composed of a ceramic aggregate having pores. The cell walls contain a substance having an electrical resistivity lower than an electrical resistivity of ceramic forming the ceramic aggregate. The pair of electrodes is arranged at the cell walls and/or the outer peripheral wall. | 10-13-2011 |
| 20110250097 | HONEYCOMB STRUCTURE - A honeycomb structure has a substantially circular-pillar-shape. The honeycomb structure includes at least one electrically conductive honeycomb unit, a first electrode, and a second electrode. The at least one electrically conductive honeycomb unit includes walls extending along a longitudinal direction of the at least one electrically conductive honeycomb unit to define a plurality of through holes. The first electrode is provided on an outer circumferential surface of the honeycomb structure. The second electrode is provided in a vicinity of a central axis of the honeycomb structure extending along the longitudinal direction. | 10-13-2011 |
| 20110250096 | HONEYCOMB STRUCTURE - A honeycomb structure includes at least one honeycomb unit. The at least one honeycomb unit includes a pair of electrodes and cell walls. The cell walls extend along a longitudinal direction of the at least one honeycomb unit to define a plurality of through holes. The cell walls have pores filled with a substance under a formation region of the pair of electrodes. The substance has an electrical resistivity lower than an electrical resistivity of a material to form the at least one honeycomb unit. | 10-13-2011 |
| 20110250095 | HONEYCOMB STRUCTURAL BODY AND EXHAUST GAS CONVERSION APPARATUS - A honeycomb structural body includes a plurality of honeycomb units adhered to each other by interposing an adhesive layer. Each of the honeycomb units has a substantially fan shaped cross section or a substantially elliptical fan shaped cross section perpendicular to a longitudinal direction of each of the honeycomb units. First and second electrodes are provided at a part of an outer peripheral surface of each of the honeycomb units that does not face the adhesive layer and are provided at a first area between each of the honeycomb units and the adhesive layer. And/or the first and second electrodes are provided at a second area between the outer peripheral surface of each of the honeycomb units and the adhesive layer and are provided at a third area including a center of the substantially fan shaped cross section or the substantially elliptical fan shaped cross section. | 10-13-2011 |
| 20110250094 | HONEYCOMB STRUCTURAL BODY AND EXHAUST GAS CONVERSION APPARATUS - A honeycomb structural body includes a plurality of honeycomb units, first and second electrodes, and first and second conductive members. The plurality of honeycomb units are adhered to each other by interposing an adhesive layer. Each of the plurality of honeycomb units contains a conductive ceramic material. Each of the plurality of honeycomb units includes cell walls extending along a longitudinal direction of each of the plurality of honeycomb units to define a plurality of through-holes. The first and second electrodes are provided on an outer peripheral surface of each of the plurality of honeycomb units. The first and second conductive members are electrically connected to the first and second electrodes, respectively. | 10-13-2011 |
| 20110247212 | WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD - A method of manufacturing a wiring board including forming a base substrate, forming a first insulation layer on a first surface of the base substrate and a second insulating layer on a second surface of the base substrate opposing the first surface, forming an IVH (Interstitial Via Hole) that penetrates the base substrate, forming vias in at least one of the first substrate or second substrate, and cutting the first insulating layer in a first area and cutting the second insulating layer in a second area offset from said first area to form a first substrate laminated to a second substrate with the base layer interposed therebetween, the second substrate having a smaller mounting area than a mounting area of the first substrate such that the first substrate extends beyond an edge of the second substrate. | 10-13-2011 |
| 20110247208 | MULTILAYERED PRINTED WIRING BOARD - A method of manufacturing a multilayered printed wiring board including forming a multilayered core substrate including insulation layers and one or more stacked via structures formed through the insulation layers, the stacked via structure including vias formed in the insulation layers, respectively, the insulation layers in the multilayered core substrate including at least three insulation layers and each of the insulation layers in the multilayered core substrate including a core material impregnated with a resin, and forming a build-up structure over the multilayered core substrate and including interlaminar insulation layers and conductor circuits, each of the interlaminar insulation layers including a resin material without a core material. | 10-13-2011 |
| 20110244198 | HOLDING SEALING MATERIAL - A holding sealing material includes at least one mat and at least one thread. The at least one mat includes inorganic fibers. The at least one thread is sewn in the at least one mat to provide identification information on the at least one mat. | 10-06-2011 |
| 20110240358 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes an insulation layer containing a resin and a silica-type filler and having a roughened surface, and a conductive layer formed on the roughened surface of the insulation layer and having a first conductive portion and a second conductive portion positioned adjacent to the first conductive portion. The roughened surface of the insulation layer has a roughness under the first conductive portion, a roughness under the second conductive portion, and a roughness between the first conductive portion and the second conductive portion, and the roughness between the first conductive portion and the second conductive portion is set less than at least one of the roughness under the first conductive portion and the roughness under the second conductive portion. | 10-06-2011 |
| 20110240357 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board including a first substrate having a penetrating hole penetrating through the first substrate, a built-up layer formed on one surface of the first substrate and including multiple interlayer resin insulation layers and wiring layers, the built-up layer having an opening portion communicated with the penetrating hole of the first substrate and opened to the outermost surface of the built-up layer, an interposer accommodated in the opening portion of the built-up layer and including a second substrate and a wiring layer formed on the second substrate, the wiring layer of the interposer including multiple conductive circuits for being connected to multiple semiconductor elements, and a filler filling the opening portion of the built-up layer such that the interposer is held in the opening portion of the built-up layer. The opening portion of the built-up layer has a tapered portion tapering toward the outermost surface of the built-up layer. | 10-06-2011 |
| 20110240356 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a core substrate, a first laminated structure formed on a surface of the substrate and including conductive and insulation layers, and a second laminated structure formed on the opposite surface of the substrate and including conductive and insulation layers. The substrate has a connection conductor made of a plating. The insulation layers of the first laminated structure have connection conductors stacked one over another and made of platings. The insulation layers of the second laminated structure have connection conductors stacked one over another and made of platings. The connection conductors of the laminated structures are stacked on the connection conductor of the substrate. The connection conductors of the laminated structures include outer-layer connection conductors which have positions shifted in a substantially same direction from the position of the connection conductor of the substrate. | 10-06-2011 |
| 20110240354 | WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD - A wiring board including a substrate having a cavity, an electronic component accommodated in the cavity of the substrate, a first conductive pattern formed on a surface of the substrate and having a frame shape surrounding the opening of the cavity, a second conductive pattern formed on the surface of the substrate and outside the frame shape of the first conductive pattern, and an insulation layer formed on the surface of the substrate and covering the first conductive pattern, the second conductive pattern and the opening of the cavity. The first conductive pattern has a slit extending from the outside of the frame shape to the inside of the frame shape. | 10-06-2011 |
| 20110240351 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board including a core insulation layer having a connection conductor formed in a hole of the core layer, and an interlayer insulation layer laminated on one side of the core layer. The conductor of the core layer includes plating filling the hole of the core layer. The interlayer layer has a connection conductor formed in a hole of the interlayer layer. The conductor of the interlayer layer includes plating filling the hole of the interlayer layer. The conductor of the interlayer layer is stacked on the conductor of the core insulation layer. The conductors of the core and interlayer layers have lands formed on the core and interlayer layers and including metal foils and plating on the foils. The foil of the land on the core layer has a thickness which is thicker than a thickness of the foil of the land on the interlayer layer. | 10-06-2011 |
| 20110239602 | MAT, METHOD FOR MANUFACTURING THE MAT, AND APPARATUS FOR PURIFYING EXHAUST GAS - A mat includes a first principal face, a second principal face opposite to the first principal face, entangled points, and unentangled portions. The entangled points are provided by entangling inorganic fibers with one another. The unentangled portions are provided from the first principal face to the second principal face. The inorganic fibers are not entangled with one another and are arranged substantially parallel to one another in said unentangled portions. | 10-06-2011 |
| 20110237427 | HONEYCOMB STRUCTURE - A honeycomb structure includes a ceramic block including at least one honeycomb fired body. The at least one honeycomb fired body has cell walls and a peripheral wall. The peripheral wall is formed around the at least one honeycomb fired body. The peripheral wall of the at least one honeycomb fired body, which forms a periphery of the ceramic block, is a stepped peripheral wall provided with a level difference. The level difference includes a projected portion and a recessed portion in a cross section perpendicular to a longitudinal direction of the at least one honeycomb fired body. At least one of the projected portion and the recessed portion is formed by at least one of a curve line and a straight line in the cross section perpendicular to the longitudinal direction of the at least one honeycomb fired body by being subjected to chamfering. | 09-29-2011 |
| 20110236626 | HONEYCOMB STRUCTURE - A honeycomb structure includes a ceramic block including honeycomb fired bodies. The honeycomb fired bodies include outer honeycomb fired bodies and at least one inner honeycomb fired body. At least one of the outer honeycomb fired bodies includes a curved part and a linear part provided in a part of a periphery of the at least one of the outer honeycomb fired bodies which partially constitutes a periphery of the ceramic block. The linear part is substantially parallel to at least one of a first adhesive layer between one of the outer honeycomb fired bodies and an adjacent inner honeycomb fired body, and a second adhesive layer between adjacent outer honeycomb fired bodies. The linear part has a length of from about 5 mm to about 20 mm in a direction substantially perpendicular to the longitudinal direction. | 09-29-2011 |
| 20110236624 | HONEYCOMB STRUCTURE - A honeycomb structure includes a ceramic block including at least one honeycomb fired body. The at least one honeycomb fired body has cell walls to define cells and a peripheral wall constituting a periphery of the at least one honeycomb fired body. The cells include peripheral cells in contact with the peripheral wall of the at least one honeycomb fired body constituting a periphery of the ceramic block and basic cells arranged at an inner side of the peripheral cells. The peripheral cells include deformed cells each having a different shape from the basic cells in a cross section perpendicular to a longitudinal direction of the at least one honeycomb fired body. Each of the deformed cells is capable of receiving therein a circle of about 0.9 mm in diameter in the cross section perpendicular to the longitudinal direction. | 09-29-2011 |
| 20110236030 | OPTICAL INTERCONNECT AND SIGNAL TRANSMISSION METHOD - An optical interconnect includes a transmitter circuit, a receiver circuit and an optical signal transmission route. The transmitter circuit includes a control circuit and an electrical/optical converter circuit. The control circuit receives an input electrical signal and outputs a drive signal. The electrical/optical converter circuit includes a light emitting element and converts the drive signal to an optical signal. The receiver circuit includes an optical/electrical converter circuit and a data recovery circuit. The data recovery circuit includes a second trigger signal generator and a latch circuit. The optical/electrical converter circuit includes a light receiving element and a received-signal amplifying circuit. The light receiving element converts the optical signal from the light emitting element to an output current signal. The received-signal amplifying circuit converts the output current signal to a required digital voltage signal. The optical signal transmission route optically is connecting the transmitter circuit and the receiver circuit. | 09-29-2011 |
| 20110234299 | SENSOR CONTROL CIRCUIT AND SENSOR - A sensor control circuit for controlling a sensor unit for measuring a physical value includes a timing controller which selects periodically one or more sensor units among multiple sensor units and converts an output signal from the sensor unit to a continuous serial input signal, an oscillator which receives the serial input signal input by the controller and outputs a frequency signal corresponding to the output signal detected by the sensor unit, a counter which counts for a predetermined duration a number of pulses of the frequency signal output from the oscillator, a data converter which converts the number of pulses to voltage data and outputs the data, and an RLC selector which inputs to the converter information indicating a characteristic value on which the number of pulses is based. The characteristic value is resistance, inductance or electrostatic capacitance. The sensor units measure physical values, respectively. | 09-29-2011 |
| 20110232948 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A printed wiring board includes a core substrate having a penetrating hole, a first circuit on a first surface of the substrate, a second circuit on a second surface of the substrate, and a through-hole conductor in the hole connecting the first and second circuits. The hole has first and second opening portions. The first opening portion becomes thinner toward the second surface. The second opening portion becomes thinner toward the first surface. The first opening portion has first and second portions. The second opening portion has first and second portions. The first and second portions of the first opening portion form inner walls bending inward at the boundary between the first and second portions. The first and second portions of the second opening portion form inner walls bending inward at the boundary between the first and second portions. | 09-29-2011 |
| 20110232086 | MULTILAYER PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF - A method of manufacturing a multi-layer printed wiring board including forming a core substrate, forming a first interlayer insulation layer over the core substrate, forming a first filled via in the first interlayer insulation layer, the first filled via having a bottom portion having a first diameter, forming a second interlayer insulation layer over the first interlayer insulation layer, and forming a second filled via in the second interlayer insulation layer, the second filled via having a bottom portion having a second diameter smaller than the first diameter. | 09-29-2011 |
| 20110230335 | HONEYCOMB STRUCTURED BODY - A honeycomb structured body includes a honeycomb block formed by bonding honeycomb fired bodies together. Each of the honeycomb fired bodies has cell walls extending along a longitudinal direction of the honeycomb fired bodies to define cells. At least one of the honeycomb fired bodies includes a first cell region having first cells and a second cell region having second cells and provided between a first peripheral cell wall and a second peripheral cell wall located on a periphery of each honeycomb fired body to surround a part or a whole of the first cell region. The honeycomb structured body has a higher aperture ratio at a first end face than at a second end face. The first end face has first aperture ratio in the second cell region higher than a second aperture ratio in the first cell region. | 09-22-2011 |
| 20110229684 | HONEYCOMB STRUCTURE - A honeycomb structure includes a honeycomb block including at least one honeycomb fired body. The at least one honeycomb fired body has cell walls extending along a longitudinal direction of the at least one honeycomb fired body to define cells. The cells include peripheral cells in contact with peripheral walls of the at least one honeycomb fired body and basic cells positioned to be surrounded by the peripheral cells. The peripheral cells include an irregular cell having a cell cross-sectional area larger than a cell cross-sectional area of one of the basic cells. | 09-22-2011 |
| 20110227251 | SHEET MEMBER AND MANUFACTURING METHOD OF THE SAME, AND EXHAUST GAS PROCESSING DEVICE - The papermaking sheet member includes inorganic fibers, and the inorganic fibers include a lump-shaped cohered fiber which coheres as a lump. | 09-22-2011 |
| 20110225954 | SENSOR FOR EXHAUST GAS PURIFYING APPARATUS - A sensor for an exhaust gas purifying apparatus includes an examining filter and a holding member. The examining filter is provided in a secondary exhaust line diverging from a primary exhaust line of an internal combustion engine. The holding member holds the examining filter on the secondary exhaust line. The holding member holds an approximately 10% to approximately 50% part by area of a peripheral portion of the examining filter so as to cover the part from a peripheral side of the examining filter. | 09-22-2011 |
| 20110220407 | FLEX-RIGID WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A flex-rigid wiring board includes a flexible board including a flexible substrate and a conductor pattern formed over the flexible substrate, a non-flexible substrate disposed adjacent to the flexible board, an insulating layer including an inorganic material and covering the flexible board and the non-flexible substrate, the insulating layer exposing at least one portion of the flexible board, a conductor pattern formed on the insulating layer, and a plating layer connecting the conductor pattern of the flexible board and the conductor pattern on the insulating layer. | 09-15-2011 |
| 20110220399 | MULTILAYER PRINTED WIRING BOARD FOR SEMICONDUCTOR DEVICES AND METHOD FOR MANUFACTURING THE BOARD - A multilayer printed wiring board includes one or more resin layers having via-holes and a core layer having via-holes. The via-holes formed in the one or more resin layers are open in the direction opposite to the direction in which the via-holes formed in the core layer are open. A method for manufacturing a multilayer printed wiring board includes a step of preparing a single- or double-sided copper-clad laminate; a step of forming lands by processing the copper-clad laminate; a step of forming a resin layer on the upper surface of the copper-clad laminate, forming openings for via-holes in the resin layer, and then forming the via-holes; and a step of forming openings for via-holes in the lower surface of the copper-clad laminate and then forming the via-holes. | 09-15-2011 |
| 20110214915 | PRINTED WIRING BOARD - A printed wiring board comprises a wiring substrate provided with at least one conductor circuit, a solder resist layer provided on the surface of the wiring substrate, at least one conductor pad formed from a part of the conductor circuit exposed from an opening provided in the solder resist layer, and at least one solder bump for mounting electronic parts on the conductor pad. | 09-08-2011 |
| 20110209911 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a substrate having first and second surfaces, a first penetrating hole penetrating through the substrate, a first through-hole conductor formed on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor formed in the second hole, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, a first conductive portion on one end of the second hole, and a second conductive portion on the opposite end of the second penetrating hole. The first conductor is connecting the first circuit and the second circuit. The second conductor is made of a conductive material filled in the second hole and is connecting the first conductive portion and the second conductive portion. | 09-01-2011 |
| 20110209905 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a substrate having a first penetrating hole penetrating through the substrate, a first through-hole conductor formed on the inner wall of the first penetrating hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor formed in the second penetrating hole, a first conductive circuit formed on a first surface of the substrate; a second conductive circuit formed on a second surface of the substrate; a first conductive portion formed on one end of the second penetrating hole, and a second conductive portion formed on the opposite end of the second penetrating hole. The first conductor is connecting the first and second circuits. The second conductor is connecting the first and second conductive portions. The first circuit has the thickness which is set greater than the thickness of the first conductive portion. | 09-01-2011 |
| 20110209904 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a substrate having first and second surfaces and a first penetrating hole through the substrate, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, an interlayer insulation layer on the substrate and the first or second circuit, and a third conductive circuit on the interlayer layer. The interlayer layer has a via conductor in the interlayer layer and connecting the third circuit and the second conductor. The substrate has a first through-hole conductor connecting the first and second circuits and on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor in the second hole. The via conductor is shifted from the center of the second conductor in the direction parallel to the first surface of the substrate. | 09-01-2011 |
| 20110209344 | WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD - A wiring board and method of forming a wiring board. The wiring board includes a first substrate and a second substrate having a smaller mounting area than a mounting area of the first substrate. A base substrate is laminated between the first substrate and the second substrate such that the first substrate extends beyond at least one edge of the second substrate. At least one of the base substrate, the first substrate or the second substrate comprises pliable resin, and at least one other of the base substrate, the first substrate or the second substrate comprises an inorganic filler. | 09-01-2011 |
| 20110206316 | OPTICAL INTERCONNECT DEVICE AND METHOD FOR MANUFACTURING THE SAME - An optical interconnect device includes a first substrate, a second substrate, an optical waveguide, an electrical wiring and a switching device. The first substrate has an electrical wiring circuit, an electrical-optical converter for converting an electrical signal to an optical signal, and a light emitting device for emitting a light. The second substrate has an electrical wiring circuit, an optical-electrical converter for converting the optical signal to the electrical signal, and a light receiving device for receiving the light from the light emitted device. The optical waveguide optically connects the light emitting and light receiving devices. The electrical wiring electrically connects the electrical wiring circuits of the first and second substrates. The switching device determines a fast signal of data to be transmitted via the optical substrate and a slow signal of data to be transmitted via the electrical wiring. | 08-25-2011 |
| 20110203837 | FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A flex-rigid wiring board includes an insulative substrate, a flexible connected body positioned beside the insulative substrate and including multiple flexible wiring boards, and an insulation layer positioned over the insulative substrate and the flexible connected body and having a portion exposing a portion of the flexible connected body. The flexible wiring boards include a double-sided flexible wiring board having a conductive layer on one surface of the double-sided flexible wiring board and a conductive layer on the opposite surface of the double-sided flexible wiring board. The flexible connected body has a conductor on one side of the flexible connected body, a conductor on the opposite side of the flexible connected body, and a through-hole conductor electrically connecting the conductors of the flexible connected body. The through-hole conductor is penetrating from one side through the opposite side of the flexible wiring boards. | 08-25-2011 |
| 20110200490 | HOLDING SEALER AND EXHAUST GAS PURIFYING DEVICE - A holding sealer for an exhaust gas purifying device includes a sheet member including inorganic fibers and having a first surface and a second surface substantially facing each other and perpendicular to a direction of thickness of the sheet member. At least one of the first and second surfaces has a profile including projecting portions and depressed portions. The projecting and depressed portions of the profile have a maximum difference, h. The h satisfies about 0.4 mm≦h≦9 mm. | 08-18-2011 |
| 20110199739 | FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A flex-rigid wiring board including an insulative substrate having a wiring layer which is formed on the insulative substrate and includes a conductor, a flexible wiring board positioned beside the insulative substrate and having a wiring layer, the wiring layer of the flexible wiring board including a conductor and being contained inside the flexible wiring board, and a first insulation layer positioned on the insulative substrate and the flexible wiring board such that a portion of the flexible wiring board is left exposed from the first insulation layer. The first insulation layer has a wiring layer which is formed on the first insulation layer and includes a conductor. The wiring layer of the first insulation layer has a thickness which is formed thicker than a thickness of the wiring layer of the flexible wiring board and a thickness of the wiring layer of the insulative substrate. | 08-18-2011 |
| 20110198111 | FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A flex-rigid wiring board includes an insulative substrate, a flexible wiring board positioned beside the insulative substrate, and an insulation layer positioned over the insulative substrate and the flexible wiring board and exposing at least a portion of the flexible wiring board. The flexible wiring board has a tapered portion which is made thinner toward the insulative substrate at an end portion of the flexible wiring board positioned beside the insulative substrate. | 08-18-2011 |
| 20110194262 | FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A flex-rigid wiring board including an insulative substrate, a flexible wiring board positioned beside the insulative substrate, an insulation layer positioned over the insulative substrate and the flexible wiring board and exposing a portion of the flexible wiring board, and a wiring layer made of a conductor and formed on the insulation layer. The insulation layer has a tapered portion which becomes thinner toward an end surface of the insulation layer in the direction of the portion of the flexible wiring board exposed by the insulation layer. The wiring layer has a sloping portion formed on the tapered portion of the insulation layer. | 08-11-2011 |
| 20110192637 | MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD - A multi-layer printed circuit board includes a core structure including resin layers and conductor circuits sandwiched by the resin layers, the core structure having first and second surfaces, a first conductor layer including conductor circuits on the first surface of the core structure, and a second conductor layer including conductor circuits on the second surface of the core structure. The core structure includes first and via holes, and the first and second via holes include a metal filling up to the respective top of openings in the resin layers, respectively, sandwich one or more conductor circuits in the core structure and are positioned vertically to form a through hole electrically connecting respective ones of the conductor circuits of the first and second conductor layers, and the first and second via holes are deviated from each other in a vertical direction. | 08-11-2011 |
| 20110183267 | METHOD OF PRODUCING MULTILAYER PRINTED WIRING BOARD AND PHOTOSENSITIVE DRY FILM USED THEREFOR - A method of producing a multilayer printed wiring board by attaching a photosensitive dry film onto an interlaminar resin insulating layer having a thin-film conductor layer and conducting a light exposure and development to form a plating resist and then forming a conductor circuit on a portion not forming the plating resist. The photosensitive dry film has a nitrogen-containing heterocyclic compound layer on a first surface thereof. | 07-28-2011 |
| 20110180908 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a laminated body having first and second surfaces and including first, second and third insulation layers in the order of the first, second and third insulation layers from the first surface toward the second surface. The first insulation layer has a first hole which penetrates through the first insulation layer and includes a first conductor made of a plating in the first hole. The second insulation layer has a second hole which penetrates through the second insulation layer and includes a second conductor made of a conductive paste in the second hole. The third insulation layer has a third hole which penetrates through the third insulation layer and includes a third conductor made of a plating in the third hole. The first, second and third conductors are positioned along the same axis and are electrically continuous with each other. | 07-28-2011 |
| 20110180307 | FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A flex-rigid wiring board having a flexible wiring board, a first insulation layer positioned adjacent to a side of the flexible board and having a first hole which penetrates through the first layer, a second insulation layer laminated over the flexible board and the first layer and having a second hole which penetrates through the second layer, the second hole of the second layer being formed along the axis of the first hole of the first layer, a first conductor structure formed in the first hole and including a filled conductor formed by filling plating in the first hole, and a second conductor structure formed in the second hole and including a filled conductor formed by filling plating in the second hole, the second conductor structure being formed along the axis of the first conductor structure and electrically connected to the first conductor structure. | 07-28-2011 |
| 20110180306 | FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A flex-rigid wiring board including a flexible wiring board, a first insulation layer positioned to a side of the flexible board and having a first hole through the first layer, a second insulation layer over the first layer and an end portion of the flexible board and with a second hole through the second layer along the axis of the first hole, a third insulation layer over the first layer and the end portion of the flexible board on the opposite side of the second layer and with a third hole through the third layer along the axis of the first hole, a first structure having a filled conductor in the first hole, a second structure having a filled conductor in the second hole along the axis of the first structure, and a third structure having a filled conductor in the third hole along the axis of the first structure. | 07-28-2011 |
| 20110180174 | INSULATOR AND EXHAUST SYSTEM OF INTERNAL-COMBUSTION ENGINE - An insulator having an inner surface for covering an exhaust system of an internal-combustion engine includes a cover member having a surface, a joint member formed on the surface of the cover member, and a mat member made of material including at least one of ceramic fibers and glass fibers, the mat member being attached to the cover member through binding of the fibers to the joint member, and the mat member being exposed to form the inner surface. | 07-28-2011 |
| 20110176284 | MULTILAYER PRINTED CIRCUIT BOARD AND THE MANUFACTURING METHOD THEREOF - A multilayer printed circuit board, wherein, on a resin-insulating layer that houses a semiconductor element, another resin-insulating layer and a conductor circuit are formed with conductor circuits electrically connected through a via hole, wherein an electromagnetic shielding layer is formed on a resin-insulating layer surrounding a concave portion for housing a semiconductor element or on the inner wall surface of the concave portion, and the semiconductor element is embedded in the concave portion. | 07-21-2011 |
| 20110147057 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A method for manufacturing a printed wiring board includes forming a pad for mounting an electronic component on a resin layer, forming a solder-resist layer on the resin layer and the pad, exposing an upper surface of the pad and a portion of a side wall of the pad from the solder-resist layer, and forming a metal layer on the upper surface of the pad and the portion of the side wall of the pad. | 06-23-2011 |
| 20110140564 | COIL SHEET, METHOD FOR MANUFACTURING COIL SHEET, COIL SHEET HOLDER, METHOD FOR ATTACHING COIL SHEET, ROTATOR OF MOTOR, AND MOTOR - A coil sheet has an insulative substrate which bends and has the first surface and the second surface on the opposite side of the first surface, a first conductor forming a first spiral conductive pattern and formed on the first surface of the insulative substrate, and a second conductor forming a second spiral conductive pattern and formed on the second surface of the insulative substrate. The width of the tip portion of the second conductor of the second spiral conductive pattern is set narrower than the width of the base end portion of the first conductor of the first spiral conductive pattern. | 06-16-2011 |
| 20110139498 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board including an insulation layer made of a resin material and having first and second surfaces, the insulation layer having an opening portion opened on the second surface, a conductive circuit having first and second surfaces, the conductive circuit being embedded in the insulation layer such that the first surface of the conductive circuit is formed flush with the first surface of the insulation layer and that the second surface of the conductive circuit is exposed through the opening portion of the insulation layer, a first surface-treatment film formed on the conductive circuit and facing the first surface of the conductive circuit, and a second surface-treatment film formed on the conductive circuit and facing the second surface of the conductive circuit and in the opening portion of the insulation layer. | 06-16-2011 |
| 20110138622 | DRILL AND METHOD OF PRODUCING PRINTED WIRING BOARD - A printed wiring board manufacturing method for forming a hole penetrating through a board having an electric conductor layer and forming the electric conductor layer in the hole to make electrical connection, the method including forming a hole that penetrates through the board in accordance with a drill featured in that a blade portion is formed at a distal end and a groove is formed by one stripe, and an occupying rate of a metal at a proximal end of the blade tip of the body is in the range of 40% to 80%; and a curvature radius in an axially vertical direction of a deepest portion of the groove is in the range of 1.50 to 3.50 mm, forming an electric conductor layer in a hole, and forming an electric conductor circuit on a top layer of the board. | 06-16-2011 |
| 20110131806 | ALIGNMENT MARK RECOGNITION METHOD AND PRINTED WIRING BOARD MANUFACTURING METHOD - A method for recognizing alignment marks includes preparing a substrate having multiple alignment marks including alignment marks positioned adjacent to each other, and recognizing the alignment marks on the substrate by capturing images of the alignment marks using a recognition camera. The recognizing of the alignment marks includes adjusting the position of the recognition camera when capturing images of the alignment marks positioned adjacent to each other such that each of the alignment marks positioned adjacent to each other is positioned equidistant from the center of an image-capturing region of the recognition camera. | 06-09-2011 |
| 20110129391 | HONEYCOMB FILTER AND EXHAUST GAS PURIFYING APPARATUS - A honeycomb filter includes cell walls. The cell walls extend along a longitudinal direction of the honeycomb filter to define a plurality of cells each of which has one end and another end opposite to the one end along the longitudinal direction. A majority of the plurality of cells are sealed cells sealed at either the one end or the another end. A part of the plurality of cells are open cells open at both of the one end and the another end. A number of the open cells is from about 0.1% to about 4.9% of a number of the plurality of cells. | 06-02-2011 |
| 20110121493 | METHOD FOR MANUFACTURING CERAMIC FIRED BODY AND METHOD FOR MANUFACTURING HONEYCOMB STRUCTURED BODY - A method for manufacturing a ceramic fired body includes molding and degreasing a ceramic raw material to manufacture a ceramic degreased body. The ceramic degreased body is fired in a continuous firing furnace. The firing step includes preheating the ceramic degreased body up to a preheating temperature of at least about 1500° C. and at most about 2000° C. by resistance heating with a resistance heating mechanism. High-temperature firing includes heating the ceramic degreased body from the preheating temperature to a firing temperature of at least about 2000° C. and at most about 2300° C. by both the resistance heating with the resistance heating mechanism and direct energizing heating in which the ceramic degreased body is energized and heated. The temperature of the ceramic degreased body is held at the firing temperature. | 05-26-2011 |
| 20110121450 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR - A semiconductor device includes a support plate having a hole formed therein and a conductor formed on a wall surface of the hole, a semiconductor element; and a conductive post formed by a conductor having a first end portion at one end, and a second end portion at an other end. The second end portion of the conductive post is connected to the semiconductor element, and a side surface of the conductive post is fixed to the conductor on the wall surface of the hole deformed by pressing force of the conductive post on a side closer to the first end portion than the second end portion. | 05-26-2011 |
| 20110121448 | SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREOF - The semiconductor device comprises a support plate; a semiconductor element; and conductor posts consisting of a conductor having a first end at one end and a second end at the other end, the second end being connected to the semiconductor element and the conductor posts being connected to the support plate at a position on the side of the second end that is closer to the first end, wherein the conductor posts have a heat conductivity of approximately 200 W/m·K or higher and a Vickers hardness of approximately 70 or lower. | 05-26-2011 |
| 20110120762 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A printed wiring board including a substrate having first and second surfaces and a penetrating hole extending through the substrate between the surfaces, a first conductive circuit on the first surface, a second conductive circuit on the second surface, and a through-hole conductor in the hole and connecting the first and second conductive circuits. The conductor includes an electroless plated film on the inner-wall surface of the hole, a first electrolytic plated film formed on the electroless plated film and forming a first opening portion opening on the first surface and a second opening portion opening on the second surface, a second electrolytic plated film filling the first portion, and a third electrolytic plated film filling the second portion. The first and second portions taper toward the central portion of the hole with respect to the axis direction of the hole and have cross sections forming a substantially U-shape, respectively. | 05-26-2011 |
| 20110118108 | HONEYCOMB STRUCTURAL BODY AND MANUFACTURING METHOD OF HONEYCOMB STRUCTURAL BODY - A honeycomb structural body includes honeycomb units that are pillar-shaped and bound together. Each of the honeycomb units includes plural cells, phosphate-based zeolite, and a first inorganic binder. The plural cells extend from a first end face to a second end face in a longitudinal direction of each of the honeycomb units. The plural cells are defined by cell walls. The mat members are interposed between the honeycomb units and include a first inorganic fiber. | 05-19-2011 |
| 20110118106 | HONEYCOMB STRUCTURE - A honeycomb structure includes a honeycomb unit. The honeycomb unit includes plural cells, inorganic particles, and at least one of a flake substance, a tetrapod-shaped substance, and a three-dimensional needle-shaped substance. The plural cells extend from a first end face to a second end face of the honeycomb structure along a longitudinal direction of the honeycomb structure. The plural cells are defined by cell walls. | 05-19-2011 |
| 20110117236 | DIE AND METHOD FOR MANUFACTURING DIE - A die includes abase body and a modified surface layer. The base body includes tungsten carbide particles bonded by a bonding phase. The modified surface layer includes tungsten carbide particles and a filling material filled among the tungsten carbide particles to bond the tungsten carbide particles to each other. The filling material comprises copper. The modified surface layer is formed on at least a part of a surface of the base body. | 05-19-2011 |
| 20110116989 | HONEYCOMB STRUCTURAL BODY AND EXHAUST GAS CONVERSION APPARATUS - A honeycomb structural body includes a honeycomb unit having a plurality of through holes defined by partition walls and arranged in a longitudinal direction of the honeycomb unit and having macro-pores having an average pore diameter approximately 0.1 μm or more and approximately 0.3 μm or less. The macro-pores have a porosity approximately 30% or more and approximately 40% or less. The honeycomb unit includes a phosphate group zeolite and an inorganic binder. | 05-19-2011 |
| 20110116988 | HONEYCOMB STRUCTURAL BODY AND EXHAUST GAS CONVERTING APPARATUS - A honeycomb structural body includes a honeycomb unit having a plurality of through holes defined by cell walls and arranged in a longitudinal direction of the honeycomb unit. The honeycomb unit includes an inorganic binder, a first zeolite, and second zeolite. The first zeolite includes at least one of a β type zeolite and a ZSM-5 type zeolite, and primary particles having an average particle diameter of approximately 0.01 μm or more and approximately 0.1 μm or less. The second zeolite includes a phosphate group zeolite and primary particles having an average particle diameter of approximately 0.5 μm or more and approximately 5 μm or less. A ratio between a mass of the first zeolite and a total mass of the first and second zeolites is approximately 0.1 or more and approximately 0.5 or less. | 05-19-2011 |
| 20110116983 | HONEYCOMB STRUCTURE AND EXHAUST GAS CONVERTER - A honeycomb structure includes at least one honeycomb unit. The honeycomb unit includes a first region, a second region different from the first region, an inorganic binder, and zeolite. The first region extends from one end of the honeycomb unit over approximately 30% or more and approximately 70% or less of an overall length of the honeycomb unit in the longitudinal direction. The zeolite includes a first zeolite and a second zeolite. The first zeolite is ion-exchanged with a first metal and has a mass content. The second zeolite is ion-exchanged with a second metal and has a mass content that is smaller than the mass content of the first metal in the first region and larger than the mass content of the first metal in the second region. | 05-19-2011 |
| 20110116982 | HONEYCOMB STRUCTURE AND EXHAUST GAS CONVERTER - A honeycomb structure includes at least one honeycomb unit. The at least one honeycomb unit has a plurality of through holes defined by partition walls along a longitudinal direction of the honeycomb unit. The honeycomb unit includes zeolite, an inorganic binder, and a noble metal catalyst. The noble metal catalyst is supported in a region of the honeycomb unit. The region extends from one end portion of the honeycomb unit in the longitudinal direction over approximately 1.5% or more to approximately 20% or less of an overall length of the honeycomb unit in the longitudinal direction. | 05-19-2011 |
| 20110115136 | MANUFACTURING METHOD OF HONEYCOMB STRUCTURAL BODY - A method of manufacturing a honeycomb structural body includes performing a heat treatment on zeolite particles that have undergone an iron ion-exchange. The heat treatment is performed in a non-oxygenated atmosphere having a temperature within a range of approximately 500° C. through approximately 800° C. to obtain heat-treated zeolite particles. A honeycomb molded body is formed from a raw material including the heat-treated zeolite particles. The honeycomb molded body is fired to manufacture a honeycomb unit. The honeycomb structural body includes the honeycomb unit including plural cells extending from a first end face to a second end face in a longitudinal direction. The plural cells are partitioned by cell walls. | 05-19-2011 |
| 20110114372 | PRINTED WIRING BOARD - A printed wiring board has an insulation layer having upper and lower surfaces, an upper-surface circuit formed on the upper surface of the insulation layer, a resin insulation layer formed on the upper surface of the insulation layer and the upper-surface circuit and having a via-conductor opening through the resin insulation layer, a conductive circuit formed on the resin insulation layer, and a via conductor formed in the opening. The resin insulation layer has first and second surfaces. The second surface of the resin insulation layer faces the upper surface of the insulation layer. The conductive circuit is formed on the first surface of the resin insulation layer. The via conductor is connecting the conductive circuit and the upper-surface circuit. The opening has an inner wall which has a diameter decreasing from the second surface of the resin insulation layer toward the first surface of the resin insulation layer. | 05-19-2011 |
| 20110113614 | METHOD FOR MANUFACTURING HONEYCOMB STRUCTURAL BODY AND METHOD FOR MANUFACTURING EXHAUST GAS CONVERTING APPARATUS - A method for manufacturing a honeycomb structural body having a honeycomb unit includes obtaining a honeycomb molded body including a compound containing a phosphate group zeolite and an inorganic binder. The honeycomb molded body has a plurality of through holes that are defined by cell walls and arranged in a longitudinal direction of the honeycomb molded body. The honeycomb molded body is dried. The dried honeycomb molded body is fired to obtain the honeycomb unit. At least one of the honeycomb unit and the dried honeycomb molded body is stored so that a difference in moisture content is approximately 5 mass % or less between a moisture content of the cell walls at a center part of a cross section perpendicular to the longitudinal direction and a moisture content of the cell walls at an outer periphery part of the cross section perpendicular to the longitudinal direction. | 05-19-2011 |
| 20110108311 | MULTILAYER PRINTED WIRING BOARD - A multilayered printed circuit board including a substrate, a multilayered structure built thereon and having conductor circuits and interlaminar resin insulating layers in an alternate fashion, and one or more stack-via structures including via-holes stacked one another and electrically connected to the conductor circuits through the insulating layers. Each of the via-holes includes a land portion formed on a respective one of the insulating layers and a filled via structure portion filling an opening of the respective one of the insulating layers with a metal layer such that the via-holes are stacked one another immediately above the filled via structure portion of each via-hole, the via-holes include the outermost layer via-hole in the outermost layer of the insulating layers, and one or more via-holes have the land portion having the land diameter which is larger than the land diameter of the land portion of the outermost layer via-hole. | 05-12-2011 |
| 20110107279 | METHOD FOR CORRECTING IMAGE RENDERING DATA, METHOD FOR RENDERING IMAGE, METHOD FOR MANUFACTURING WIRING BOARD, AND IMAGE RENDERING SYSTEM - A method for correcting image rendering data includes preparing image rendering data having position coordinates that determine an image rendering region and base position coordinates that show the position of a base point arranged in the image rendering region; obtaining a displacement state of position coordinates on an image rendering object; based on the obtained displacement state of position coordinates on the image rendering object, correcting the base position coordinates; and based on the corrected base position coordinates, correcting the position coordinates of the image rendering region while the shape of the image rendering region is maintained. | 05-05-2011 |
| 20110102122 | INDUCTOR AND ELECTRIC POWER SUPPLY USING IT - A printed wiring board including a substrate having a first surface and a second surface on the opposite side of the second surface, a first conductive circuit formed on the first surface of the substrate, a second conductive circuit formed on the second surface of the substrate, a magnetic body embedded in the substrate and extending in a thickness direction of the substrate, the magnetic body having a through-hole formed through the magnetic body and extending in the thickness direction of the substrate, and a through-hole conductor formed on an inner surface of the through-hole of the magnetic body such that the first and second conductive circuits are electrically connected to each other through the through-hole conductor. | 05-05-2011 |
| 20110100700 | MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board | 05-05-2011 |
| 20110100698 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board has a first rigid wiring board having a substrate with a penetrating hole, a first insulation layer formed on the substrate to cover at least one opening of the penetrating hole, and a first wiring layer formed on the first insulation layer, a second rigid wiring board having a second wiring layer on a main surface and being accommodated in the penetrating hole, a first connection conductor which connects the first wiring layer and the second wiring layer, and a first interlayer insulation layer formed on the first wiring layer. | 05-05-2011 |
| 20110100680 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board has a first rigid wiring board having a first wiring layer on a first main surface, a second rigid wiring board having a second wiring layer on a second main surface, a first connection portion connecting the first wiring layer and the second wiring layer, and a first interlayer insulation layer formed on the first wiring layer, the second wiring layer and the first connection portion. In such a wiring board, the first rigid wiring board and the second rigid wiring board are positioned in such a way that the first main surface and the second main surface are set at substantially the same level, and the first wiring layer and the second wiring layer are electrically connected by the first connection portion. | 05-05-2011 |
| 20110096517 | MULTI-PIECE BOARD AND METHOD FOR MANUFACTURING THE SAME - A multi-piece board includes a frame and multiple wiring boards connected to the frame. The frame and each of the wiring boards are positioned with a clearance. The frame and/or each of the wiring boards has an end portion having a first notch portion on a surface side adjacent to the clearance. The end portion of the frame and/or each of the wiring boards has a second notch portion formed on the opposite surface side with respect to the surface side of the first notched portion adjacent to the clearance. The clearance between the frame and each of the wiring boards is filled with an adhesive agent. | 04-28-2011 |
| 20110085953 | EXHAUST GAS PURIFYING APPARATUS AND METHOD FOR PURIFYING EXHAUST GAS - An exhaust gas purifying apparatus includes a metal casing and a honeycomb filter installed in the metal casing. The honeycomb filter includes cells, a first end face, and a second end face. The cells include a first cell and a second cell provided alternately. The first cell includes an open end on the first end face side and a sealed end on the second end face side. The second cell includes an open end on the second end face side and a sealed end on the first end face side. A cross-sectional area of the first cell is smaller than a cross-sectional area of the second cell. The first end face is disposed on a gas inlet side of the metal casing. The second end face is disposed on a gas outlet side of the metal casing. | 04-14-2011 |
| 20110085942 | HONEYCOMB FILTER AND UREA SCR DEVICE - A honeycomb filter includes a honeycomb structure and a zeolite. The honeycomb structure includes cell walls having a porosity of about 55% to about 65% and extending along a longitudinal direction of the honeycomb structure to define cells between the cell walls. Each of the cells is sealed at either end of the cells. The zeolite is supported on the cell walls of the honeycomb structure. An amount of the zeolite supported on the cell walls is from about 80 g/L to about 150 g/L. A thermal conductivity of the cell walls supporting the zeolite is about 3 W/mK or more. | 04-14-2011 |
| 20110085941 | HONEYCOMB FILTER - A honeycomb filter includes a honeycomb structure and a zeolite. The honeycomb structure has cell walls to define cells between the cell walls. The zeolite is supported on the cell walls. An amount of the zeolite is from about 80 g/L to about 150 g/L. A porosity of the cell walls is from about 55% to about 65%. A cell density in a cross section perpendicular to the longitudinal direction is from about 46.5 pcs/cm | 04-14-2011 |
| 20110085940 | HONEYCOMB FILTER - A honeycomb filter includes a honeycomb structure and a zeolite. The honeycomb structure has cell walls to define cells between the cell walls. The zeolite is supported on the cell walls. An amount of the zeolite is from about 80 g/L to about 150 g/L. The cells include a large volume cell and a small volume cell. A porosity of the cell walls is from about 55% to about 65%. A proportion of a sum of a pore volume A and a pore volume B relative to a total pore volume C is about 20% or less. The pore volume A indicates a pore volume of pores having a pore diameter of one half or less of the average pore diameter. The pore volume B indicates a pore volume of pores having a pore diameter of twice or more the average pore diameter. | 04-14-2011 |
| 20110085306 | MULTILAYER PRINTED WIRING BOARD FOR SEMICONDUCTOR DEVICES AND METHOD FOR MANUFACTURING THE BOARD - A coreless multilayer printed wiring board including a coreless layer having an opening, a conductive film formed on an upper surface of the coreless layer and closing one end of the opening of the coreless layer, a via-hole formed in the opening of the coreless layer, a first resin layer formed on the coreless layer and the conductive film and having an opening reaching to the conductive film, a via-hole formed in the opening of the first resin layer, a second resin layer formed on the upper surface of the first resin layer and having an opening, a via-hole formed in the opening of the second resin layer. The via-holes formed in the first and second resin layers are open in the direction opposite to the direction in which the via-hole formed in the coreless layer is open. | 04-14-2011 |
| 20110080714 | CIRCUIT BOARD AND SEMICONDUCTOR MODULE - A circuit board comprises a first conductive post for electrically connecting to the first electrode of the semiconductor device, a first metal plate connecting to the first conductive post, a second conductive post for electrically connecting to the second electrode of the semiconductor device, a second metal plate connecting to the second conductive post, a third conductive post for electrically connecting to the third electrode of the semiconductor device, and a third metal plate connecting to the third conductive post. | 04-07-2011 |
| 20110079418 | CERAMIC WIRING BOARD AND METHOD OF MANUFACTURING THEREOF - A ceramic wiring board comprises a ceramic substrate and a copper layer formed on the ceramic substrate. The average copper grain radius in the copper layer is approximately equal to or larger than 10 μm. | 04-07-2011 |
| 20110072789 | PARTICULATE MATTER SENSOR AND EXHAUST GAS PURIFICATION APPARATUS - A particulate matter sensor includes a first detection filter provided in an exhaust gas flow passage and capable of collecting particle matter. A second detection filter is provided on a downstream side of the first detection filter in the exhaust gas flow passage and capable of collecting the particle matter. A first differential pressure detection unit is configured to detect a first differential pressure between pressures of an upstream side and the downstream side of the first detection filter. A second differential pressure detection unit is configured to detect a second differential pressure between pressures of an upstream side and a downstream side of the second detection filter. A particle matter amount detection unit is configured to detect an amount of particle matter based on a detection result of the first differential pressure detection unit and a detection result of the second differential pressure detection unit. | 03-31-2011 |
| 20110070129 | HONEYCOMB FILTER AND METHOD FOR PRODUCING THE HONEYCOMB FILTER - A honeycomb filter includes cell walls and cells. The cell walls extend along a longitudinal direction of the honeycomb filter to define the cells between the cell walls. The cells have first cells and second cells each having a substantially square shape in a cross-section perpendicular to the longitudinal direction. The first cells are sealed and the second cells are open at one end face of the honeycomb filter. The substantially square shape of the first cells includes a first side whose extended line intersects a second side except for corner portions of the substantially square shape of the second cells. The second side and the extended line of the first side are substantially perpendicular. | 03-24-2011 |
| 20110067913 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board includes an interlayer resin insulation layer having the first surface, the second surface on the opposite side of the first surface, and a penetrating hole for a via conductor, a conductive circuit formed on the first surface of the interlayer resin insulation layer, a via conductor formed in the penetrating hole and connected to the conductive circuit on the first surface of the interlayer resin insulation layer, and a surface-treatment coating formed on the surface of the via conductor exposed from the second surface of the interlayer resin insulation layer through the penetrating hole. The via conductor is made of a first conductive layer formed on the side wall of the penetrating hole and a plated-metal filling the penetrating hole. The surface of the via conductor is recessed from the second surface of the interlayer resin insulation layer. | 03-24-2011 |
| 20110067904 | FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A flex-rigid wiring board includes a flexible substrate having a first surface and a second surface on the opposite side of the first surface, a first conductive pattern formed on the first surface of the flexible substrate, a second conductive pattern formed on the second surface of the flexible substrate, and a conductor made of a conductive paste and formed in a first hole penetrating through the flexible substrate such that the first conductive pattern and the second conductive pattern are electrically connected to each other. | 03-24-2011 |
| 20110063811 | MULTILAYER PRINTED WIRING BOARD - A printed wiring board includes a main body having a mounting portion and ground and power supply pads in the mounting portion such that a ground line of a semiconductor device is connected to a ground pad and a power supply line of the device is connected to a power supply pad, and a layered capacitor disposed in the main body and having a high dielectric constant layer and first and second layer electrodes sandwiching the dielectric layer. One of the electrodes is connected to the power supply line and the other electrode is connected to the ground line, the first electrode has a solid pattern including passage holes through which second rod terminals connected to the second electrode pass in a non-contacting manner, and the second electrode has a solid pattern including passage holes through which first rod terminals connected to the first electrode pass in a non-contacting manner. | 03-17-2011 |
| 20110063806 | HEAT RESISTANT SUBSTRATE INCORPORATED CIRCUIT WIRING BOARD - A circuit wiring board including a wiring substrate, multiple electronic components provided on a surface of the wiring substrate, and a heat resistant substrate accommodated in the wiring substrate and having a core substrate and a built-up wiring layer formed over the core substrate. The built-up wiring layer includes a conductive layer and an interlayer resin insulating layer, and the electronic components are electrically connected to the conductive layer of the built-up wiring layer. | 03-17-2011 |
| 20110061921 | WIRING BOARD WITH BUILT-IN CAPACITOR - A wiring board with built-in capacitors includes a core substrate, and a high dielectric sheet including a lower electrode layer, an upper electrode layer and a dielectric layer, the dielectric layer made of a sintered ceramic body and sandwiched between the lower electrode layer and the upper electrode layer, the lower electrode layer and/or the upper electrode layer being partitioned into multiple electrodes such that the high dielectric sheet has multiple capacitors. The lower electrode layer and/or the upper electrode layer is connected to a ground line and the other one of the lower electrode layer and the upper electrode layer is connected to a power line such that the capacitors are electrically connected in parallel. | 03-17-2011 |
| 20110061797 | METHOD FOR MANUFACTURING HONEYCOMB STRUCTURE - A method for manufacturing a honeycomb structure includes molding a ceramic raw material to manufacture honeycomb molded bodies. The honeycomb molded bodies are fired to manufacture honeycomb fired bodies. End faces of at least two of the honeycomb fired bodies are joined interposing a joining material between the end faces to manufacture honeycomb joined bodies each having a length larger than a length of each honeycomb fired body. Side faces of the honeycomb joined bodies are bonded interposing an adhesive paste between the side faces to manufacture an aggregated body of the honeycomb joined bodies. The adhesive paste is dried and solidified to manufacture a honeycomb block including the aggregated body. The honeycomb block is separated at the joining material into at least two honeycomb blocks. | 03-17-2011 |
| 20110061368 | PARTICULATE MATTER SENSOR AND EXHAUST GAS PURIFYING APPARATUS - A particulate matter sensor includes a detection filter, a differential pressure detecting unit, an on-off valve, and a valve control unit. The detection filter is installed in an exhaust passage connected to an internal combustion engine and is configured to detect particulate matter contained in an exhaust gas passing through the exhaust passage. The differential pressure detecting unit is configured to detect a pressure difference between an upstream side and a downstream side of the detection filter. The on-off valve is installed on the upstream side of the detection filter in the exhaust passage and is configured to control a flow of the exhaust gas toward the detection filter. The valve control unit is configured to control the on-off valve to be opened and closed. | 03-17-2011 |
| 20110061232 | PRINTED WIRING BOARD - A method for manufacturing a printed wiring board including providing a structure having a wiring substrate having a conductor circuit, a build-up multilayer structure formed over the wiring substrate and having an outermost conductor circuit and an outermost insulative resin layer, and a solder resist layer formed over the outermost conductor circuit and outermost insulative resin layer and having openings with an opening diameter D for mounting electronic elements, forming conductor pads with a pitch of about 200 pm or less on the outermost conductor circuit in the openings of the solder resist layer, respectively, and forming solder bumps with a height H from a surface of the solder resist layer on the conductor pads on the conductor pads, respectively, such that a ratio H/D is about 0.55 to about 1.0. | 03-17-2011 |
| 20110058348 | SEMICONDUCTOR DEVICE - A semiconductor device includes a first substrate having a power-source line, an IC device mounted on the first substrate and having a power-source line, a second substrate mounted on the IC device and having a base material, a power-source layer formed inside or on a surface of the base material, an insulation layer formed on the power-source layer, and a pad formed on the insulation layer, and a via conductor connecting the power-source layer and the pad. A first route connects the power-source line of the first substrate and the power-source line of the IC device. A second route connects the power-source line of the first substrate and the power-source layer of the second substrate. A third route connects the power-source layer of the second substrate and the power-source line of the IC device. | 03-10-2011 |
| 20110056838 | METHOD OF MANUFACTURING PRINTED WIRING BOARD - A printed wiring board is manufactured by a method in which an opening is formed in a substrate, and a seed layer for electrolytic plating is formed on an inner wall of the opening and a surface of the substrate. The substrate with the seed layer is placed in an electrolytic plating solution, and an insulative body is placed in the electrolytic plating solution. The substrate and the insulative body are moved relative to each other to form an electrolytic plated film on the substrate and fill the opening with the electrolytic plated film. A conductive circuit is formed on the substrate. The electrolytic plating solution includes copper sulfate, sulfuric acid, and iron ions. | 03-10-2011 |
| 20110048775 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board includes a substrate having a first surface and a second surface on the opposite side of the first surface and multiple first penetrating holes, a first conductive portion formed on the first surface of the substrate and made of a first plated cover layer, a second conductive portion formed on the second surface of the substrate and made of a second plated cover layer, the second conductive portion being positioned opposite the first conductive portion, and multiple first through-hole conductors made of conductors formed in the multiple first penetrating holes, respectively, the multiple first through-hole conductors connecting the first conductive portion and the second conductive portion. The first conductive portion, the second conductive portion and the first through-hole conductors form a first through-hole connection section which sets up either a power-source through-hole conductor or a ground through-hole conductor. | 03-03-2011 |
| 20110048773 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board includes an interlayer resin insulation layer having a penetrating hole for a via conductor, a conductive circuit formed on one surface of the interlayer resin insulation layer, a via conductor formed in the penetrating hole and having a protruding portion protruding from the other surface of the interlayer resin insulation layer, and a surface-treatment coating formed on the surface of the protruding portion of the via conductor. The via conductor is connected to the conductive circuit and has a first conductive layer formed on the side wall of the penetrating hole and a plated layer filling the penetrating hole. | 03-03-2011 |
| 20110042120 | WIRING AND COMPOSITE WIRING - A wire (a twisted pair cable) that transmits a gigahertz band signal and that is provided with a pair of core wires that are twisted with each other, a first insulation coating material, a second insulation coating material, and a shield material that shields evanescent waves emitted from the pair of core wires. The pair of core wires have a twisting pitch, a diameter, and a spacing so that the wire has a characteristic impedance of 100 to 200Ω and the phases of the TEM (Transverse Electro-Magnetic) wave and the evanescent wave that are emitted from the pair of core wires are matched. | 02-24-2011 |
| 20110036626 | MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD - A multi-layer printed circuit board including a first insulating layer, a first conductor layer having conductor circuits on one surface of the first insulating layer, a second conductor layer having conductor circuits on the opposite surface of the first insulating layer, a second insulating layer on the second conductor and first insulating layers, and a third conductor layer having conductor circuits on the second insulating layer on the opposite side of the second conductor layer. The first and second insulating layers have first and second via holes which are formed in openings of the first and second insulating layers and made of conductive materials filled to the top of the openings such that conductor circuits in the first and third conductor layers are connected to one or more conductor circuits in the second conductor layer, and the first and second via holes are tapering toward the second conductor layer. | 02-17-2011 |
| 20110024164 | MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD - A multi-layer printed circuit board including a core structure comprising resin layers and conductor circuits sandwiched by the resin layers, the core structure having a first surface and a second surface on an opposite side of the first surface, a first conductor layer including conductor circuits formed on the first surface of the core structure, and a second conductor layer including conductor circuits formed on the second surface of the core structure. The core structure includes a first via hole and a second via hole, and the first via hole and the second via hole include a metal filling up to the respective top of openings formed in the resin layers, respectively, sandwich one or more conductor circuits in the core structure and are positioned vertically to form a through hole electrically connecting respective ones of the conductor circuits of the first and the second conductor layers. | 02-03-2011 |
| 20110019383 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board has a first rigid wiring board having an accommodation section, a second rigid wiring board to be accommodated in the accommodation section, and an insulation layer formed on the first rigid wiring board and the second rigid wiring board. Here, a conductor of the first rigid wiring board and a conductor of the second rigid wiring board are electrically connected to each other, and at least either a side surface of the second rigid wiring board or a wall surface of the accommodation section has a concave-convex portion. | 01-27-2011 |
| 20110018077 | SEMICONDUCTOR PRESSURE SENSOR AND ITS MANUFACTURING METHOD - A semiconductor pressure sensor includes a single crystal silicon substrate, a diaphragm, four diaphragm side walls enclosing the diaphragm, and a bridge circuit. The diaphragm is formed in the silicon substrate by etching the silicon substrate from a lower surface side of the silicon substrate. The diaphragm has a (110) plane orientation and a substantially parallelogram shape. The four diaphragm side walls have a (111) plane orientation and form two pairs of substantially parallel and opposite surfaces. The bridge circuit is formed on an upper surface of the silicon substrate. The bridge circuit includes a lead conductor and a strain gauge resistor. The bridge circuit is configured to detect pressure applied to the pressure sensor based on a change in an output value of the bridge circuit corresponding to an amount of flexure produced in the diaphragm by the pressure. | 01-27-2011 |
| 20110014733 | OPTICAL INTERCONNECT DEVICE AND METHOD FOR MANUFACTURING THE SAME - An optical interconnect device includes a first substrate, a second substrate, an optical waveguide, an electrical wiring and a switching device. The first substrate has an electrical wiring circuit, an electrical-optical converter for converting an electrical signal to an optical signal, and a light emitting device for emitting a light. The second substrate has an electrical wiring circuit, an optical-electrical converter for converting the optical signal to the electrical signal, and a light receiving device for receiving the light from the light emitted device. The optical waveguide optically connects the light emitting and light receiving devices. The electrical wiring electrically connects the electrical wiring circuits of the first and second substrates. The switching device determines a fast signal of data to be transmitted via the optical substrate and a slow signal of data to be transmitted via the electrical wiring. | 01-20-2011 |
| 20110000708 | WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE - [Subject Matter] To provide a method for manufacturing a wiring substrate where rigidity is enhanced in an insulative portion made by oxidizing aluminum. | 01-06-2011 |
| 20110000575 | EXHAUST PIPE - An exhaust pipe devised to, at the flow of high-temperature exhaust gas through the exhaust pipe, lower the temperature of the exhaust gas. The exhaust pipe has the following characteristics. The exhaust pipe has a tubular base material of metal and, provided on the outer circumferential surface of the base material, a surface coating layer composed of a crystalline inorganic material and an amorphous binder material. In the surface coating layer, the crystalline inorganic material is distributed in the state of being multiply stacked one upon another in the direction of thickness of the surface coating layer. The average thickness of the amorphous binder material located on the side of outer circumferential surface relative to the crystalline inorganic material is 20 μm or less. The exhaust gas flows through the interior of the pipe. | 01-06-2011 |
| 20100329802 | CUTTING DRILL AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A cutting drill includes a shank having a hole and formed to be gripped in a tool holder, and a drill body having a rod shape and locked into the hole of the shank. The shank has an axis around which the drill body rotates. The drill body has a cutting-edge portion forming a tip portion of the drill body and a neck portion having a diameter smaller than a diameter of the cutting-edge portion. The cutting-edge portion has a first cutting-edge portion and a second cutting-edge portion formed between the first cutting-edge portion and the neck portion. The first cutting-edge portion is contiguous to the second cutting-edge portion by a step portion such that the second cutting-edge portion has a diameter which is smaller than a diameter of the first cutting-edge portion. | 12-30-2010 |
| 20100328915 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - A printed circuit board has a core substrate including a resin substrate having an opening, a capacitor formed in the opening and having a first electrode structure having a portion facing to the upper surface of the core substrate and a second electrode structure having a portion facing to the lower surface of the core substrate, an upper insulating layer formed over the upper surface of the core substrate and having a conductive circuit formed over the upper insulating layer and a via hole electrically connecting the portion of the first electrode structure and the conductive circuit of the upper insulating layer, and a lower insulating layer formed over the lower surface of the core substrate and having a conductive circuit formed over the lower insulating layer and a via hole electrically connecting the portion of the second electrode structure and the conductive circuit of the lower insulating layer. | 12-30-2010 |
| 20100326709 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board includes a first insulation layer, a first conductive circuit formed on the first insulation layer, a second insulation layer formed on the first insulation layer and the first conductive circuit and having an opening portion reaching the first conductive circuit, a second conductive circuit formed on the second insulation layer, and a via conductor formed in the opening portion and connecting the first conductive circuit and the second conductive circuit. The via conductor is formed an inner-wall surface of the opening portion and has a seed layer including a nitride compound and/or a carbide compound containing Ti, Zr, Hf, V, Nb, Ta or Si and a plated-metal film formed in the opening portion, and the plated-metal film and the first conductive circuit have at least portions making direct contact. | 12-30-2010 |
| 20100321914 | MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board in which interlayer insulation layer and conductive layer are formed on a multilayer core substrate composed of three or more layers, having through holes for connecting the front surface with the rear surface and conductive layers on the front and rear surfaces and conductive layer in the inner layer to achieve electric connection through via holes, the through holes being composed of power source through holes, grounding through holes and signal through holes connected electrically to a power source circuit or a grounding circuit or a signal circuit of an IC chip, when the power source through holes pass through the grounding conductive layer of the inner layer in the core substrate, of the power source through holes, at least a power source through hole just below the IC having no conductive circuit extending from the power source through hole in the grounding conductive layer. | 12-23-2010 |
| 20100319309 | HONEYCOMB STRUCTURAL BODY AND MANUFACTURING METHOD THEREOF - A honeycomb structural body including a ceramic block having a flat shape and comprising a plurality of honeycomb units, a sealing material layer bonding the honeycomb units and comprising a sealing material paste, and a peripheral sealing material layer formed on a peripheral portion of the ceramic block. The flat shape has a cross-section which is bisected by an axis, the sealing material layer forms an angle diagonal with respect to the axis of the flat shape, the sealing material layer has end portions abutting against the peripheral sealing layer at a diagonal angle, and each of the honeycomb units has through holes extending in a longitudinal direction of the ceramic block and a partition wall portion between the through holes. | 12-23-2010 |
| 20100310829 | MULTI-PIECE BOARD AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a multi-piece board having a frame section and a multiple piece sections connected to the frame section includes forming a frame section from a manufacturing panel for the frame section, sorting out multiple acceptable piece sections by inspecting quality of piece sections, forming notch portions in the frame section and the acceptable piece sections such that the notch portions allow the acceptable piece sections to be arranged with respect to the frame section, provisionally fixing the piece sections and the frame section in respective positions, injecting an adhesive agent into cavities formed by the notch portions when the frame section and the piece sections are provisionally fixed to each other, and joining the acceptable piece sections with the frame section by curing the adhesive agent injected into the cavities. | 12-09-2010 |
| 20100307809 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board having a penetrating hole formed by forming holes with different shapes from both surfaces of a substrate. In such a penetrating hole, the depth of a first opening portion formed in the first-surface side of the substrate is shallower than the depth of a second opening portion formed in the second-surface side, and the diameter of a first opening is greater than the diameter of a second opening. Even if the gravity line of the first opening portion and the gravity line of the second opening portion are shifted from each other, the region of the second opening portion inserted into the inner space of the first opening portion may be made larger. | 12-09-2010 |
| 20100307807 | DOUBLE-SIDED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A method for manufacturing a double-sided circuit board includes preparing a substrate having the first and second surfaces, forming a first hole having a first opening with a diameter R | 12-09-2010 |
| 20100303406 | OPTICAL PATH CONVERTING MEMBER, MULTILAYER PRINT CIRCUIT BOARD, AND DEVICE FOR OPTICAL COMMUNICATION - A device for optical communication including a conductor circuit and an insulating layer formed and laminated, an optical circuit and an optical path for transmitting an optical signal, and an optical element or a package substrate on which an optical element is mounted. An optical path converting member is disposed at the optical path for transmitting an optical signal so as to transmit an optical signal between the optical element and the optical circuit. The optical path converting member comprises a lens and an optical path conversion mirror having an entrance surface, an exit surface and a reflection surface. The lens is provided at either the entrance surface or the exit surface on the side facing the optical circuit. | 12-02-2010 |
| 20100300738 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board has a substrate designating one of the upper and lower surfaces as a first surface and the other as a second surface, a first laminated section laminated on the second-surface side of the substrate, a first external connection terminal and second external connection terminals formed on the first laminated section, and an electronic component arranged inside the substrate and having first pads on the second-surface side. The first pads and first terminal as well as the first pads and second terminals are electrically connected, and the first terminal and second terminals are formed to avoid being directly over the first pads. When the first pads, first terminal and second terminals are projected onto the second surface, the first terminal is positioned to be surrounded by the first pads, and the first pads and first terminal are positioned to be surrounded by the second terminals. | 12-02-2010 |
| 20100300737 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board is formed with a substrate designating either the upper surface or the lower surface as a first surface and the other as a second surface; an electronic component arranged inside the substrate; and a first conductive layer formed on the first-surface side of the substrate by means of a first insulation layer made up of a first lower insulation layer and a first upper insulation layer. In such a wiring board, the first lower insulation layer and the first upper insulation layer are made of different materials from each other. Moreover, the first lower insulation layer is positioned on the first surface of the substrate and the electronic component, and the material that forms the first lower insulation layer fills a clearance between the substrate and the electronic component. | 12-02-2010 |
| 20100288544 | MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board including a core substrate, a built-up wiring layer having a first surface in contact with the substrate and a second surface, the second surface including a mounting area for mounting a semiconductor device, the built-up layer including circuits and insulating layers, first through-hole conductors formed in a first portion of the substrate which corresponds to the mounting area, second through-hole conductors formed in a second portion of the substrate which corresponds to an area of the second surface other than the mounting area, third through-hole conductors formed in a processor core area of the first portion of the substrate which corresponds to a processor core section of the device, and pads provided on the second surface. The first conductors have a pitch smaller than a pitch of the second conductors, and the third conductors have a pitch smaller than the pitch of the first conductors. | 11-18-2010 |
| 20100282502 | MULTILAYER PRINTED WIRING BOARD - In a core substrate | 11-11-2010 |
| 20100269939 | EXHAUST PIPE - An object of the present invention is to provide an exhaust pipe in which a peeling of a constituent member does not occur and reliability thereof is excellent, and an exhaust pipe allowing exhaust gases to flow through the exhaust pipe of the present invention includes a heat-releasing layer containing a crystalline inorganic material and an amorphous inorganic material and having infrared emissivity higher than infrared emissivity of a base, wherein irregularities are formed on a surface of the base on which the heat-releasing layer is to be formed. | 10-28-2010 |
| 20100255250 | HONEYCOMB STRUCTURAL BODY - A honeycomb structural body includes a columnar honeycomb structural body having large-capacity through holes and small-capacity through holes extending in parallel in a length direction of the columnar structural body. The large-capacity through holes and the small-capacity through holes have a polygonal shape in a cross section perpendicular to the length direction, and the large-capacity through holes and the small-capacity through holes have R-chamfered corner portions or C-chamfered corner portions in the cross section perpendicular to the length direction. | 10-07-2010 |
| 20100252318 | MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board including insulating layers, conductor layers stacked alternately over the insulating layers, respectively, and viaholes formed in the insulation layers and electrically connecting the conductor layers through the insulation layers. The viaholes include a first group of viaholes and a second group of viaholes. The viaholes in the first group are tapered toward the viaholes in the second group, and the viaholes in the second group are tapered toward the viaholes in the first group. The viaholes in the first group and the the viaholes in the second group are formed in the insulating layers, respectively, and the viaholes are formed by plating openings formed after lamination of respective ones of the insulating layers, and each of the insulating layers is about 100 μm or less in thickness. | 10-07-2010 |
| 20100252308 | PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF - A printed wiring board including resin insulation layers, and conductive circuits formed between the resin insulation layers such that spaces between the conductive circuits are filled with a resin material of the resin insulation layers. The conductor circuits include a first conductive circuit and a second conductive circuit positioned adjacent to the first conductive circuit, each of the first and second conductive circuits has a trapezoidal cross section, and the first and the second conductive circuits satisfy a formula, 0.10T≦|W | 10-07-2010 |
| 20100248951 | HONEYCOMB STRUCTURE AND METHOD FOR MANUFACTURING HONEYCOMB STRUCTURE - A honeycomb structure includes cells and aluminum titanate. The cells are provided substantially in parallel with one another in a longitudinal direction of the honeycomb structure. The cells are each sealed at either one end. The aluminum titanate includes about 40% to about 60% by mass of Al | 09-30-2010 |
| 20100247851 | SEALING MATERIAL FOR HONEYCOMB STRUCTURE, HONEYCOMB STRUCTURE, AND METHOD FOR MANUFACTURING HONEYCOMB STRUCTURE - A sealing material for a honeycomb structure includes inorganic fibers, inorganic particles, and an ion adsorbent. The inorganic fibers include a biosoluble inorganic compound. The ion adsorbent is in an amount of about 0.1% by weight or more. | 09-30-2010 |
| 20100247406 | HONEYCOMB STRUCTURE - A honeycomb structure includes aluminum titanate and cell walls. The cell walls extend along a longitudinal direction of the honeycomb structure to form a plurality of cells between the cell walls. A porosity of the honeycomb structure is from about 40% to about 60%. In a binary image of substrate portions and pore portions of each of the cell walls, an area ratio (%) of the pore portions to a whole area in a rectangularly-divided image is in a range from (the porosity−about 25%) to (the porosity+about 25%). The binary image is converted from a microscopic image of a cross section of each of the cell walls in parallel with the longitudinal direction. The rectangularly-divided image is formed by dividing the binary image in a direction parallel to a thickness direction of each of the cell walls at a predetermined width. | 09-30-2010 |
| 20100247398 | HONEYCOMB STRUCTURE - A disclosed honeycomb structure includes at least one honeycomb unit having parallel through holes separated by partition walls and extending in the longitudinal direction, the honeycomb unit including a first SOx-occluding agent, first inorganic particles, and an inorganic binder; and coating layers formed on the partition walls and including a second SOx-occluding agent and second inorganic particles. In the honeycomb structure, the basicity of the honeycomb unit is higher than that of the coating layers. | 09-30-2010 |
| 20100244242 | SEMICONDUCTOR DEVICE - A semiconductor device including a first substrate having first and second surfaces, multiple first mounting pads formed on the first surface of the first substrate and for mounting a first semiconductor element on the first surface of the first substrate, multiple first connection pads formed on the first surface of the first substrate and positioned on the periphery of the multiple first mounting pads, a second substrate formed on the first substrate and having first and second surfaces, the second substrate having a second penetrating electrode which penetrates through the first and second surfaces of the second substrate, multiple second mounting pads formed on the first surface of the second substrate and for mounting a second semiconductor element, and a conductive member formed on one of the first connection pads and electrically connecting an end portion of the second penetrating electrode and the one of the first connection pads. | 09-30-2010 |
| 20100243311 | SUBSTRATE WITH METAL FILM AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a substrate with a metal film includes preparing a first insulation layer having first and second surfaces, forming a first conductive circuit on the first surface of the first insulation layer, forming on the first surface of the first insulation layer and on the first conductive circuit a second insulation layer having first and second surfaces, forming in the second insulation layer a penetrating hole tapering from the first surface toward the first conductive circuit, forming on the inner wall of the penetrating hole, a composition containing a polymerization initiator and a polymerizable compound, providing a polymer on the inner wall of the penetrating hole by irradiating the composition, applying a plating catalyst on the polymer, and forming a plated-metal film on the inner wall of the penetrating hole. The first surface of the first insulation layer faces the second surface of the second insulation layer. | 09-30-2010 |
| 20100243305 | SUBSTRATE WITH METAL FILM AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a substrate with a metal film includes preparing an insulative substrate having the first surface and the second surface on the opposite side of the first surface, forming in the insulative substrate a penetrating hole having the inner wall tapering from the first surface of the insulative substrate toward the second surface, forming a layer of a composition containing a polymerization initiator and a polymerizable compound on the inner wall of the penetrating hole, irradiating the layer of the composition with energy such that a polymer is formed on the inner wall of the penetrating hole, applying a plating catalyst on the polymer, and forming a plated-metal film on the inner wall of the penetrating hole. | 09-30-2010 |
| 20100243299 | MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board includes a core base material having a penetrating portion, a low-thermal-expansion substrate accommodated inside the penetrating portion of the core base material and having a first surface for mounting a semiconductor element and a second surface on the opposite side of the first surface, a first through-hole conductor provided inside the low-thermal-expansion substrate and provided for electrical connection between the first surface and the second surface of the low-thermal-expansion substrate, a filler filled in a gap between the low-thermal-expansion substrate and an inner wall of the core base material, and a wiring layer formed on at least one of the first surface and the second surface of the low-thermal-expansion substrate and having a resin insulation layer and a conductive layer. The wiring layer has a via conductor connecting the first through-hole conductor and the conductive layer. | 09-30-2010 |
| 20100242463 | PARTICULATE MATTER CONCENTRATION MEASURING APPARATUS - A particulate matter concentration measuring apparatus configured to measure a concentration of a particulate matter in an exhaust gas that flows through a diesel engine exhaust line includes an exhaust gas collecting line, a particulate matter detection filter, and a differential pressure detecting unit. The exhaust gas collecting line branches from the diesel engine exhaust line and includes a flow path cross-sectional area smaller than a flow path cross-sectional area of the diesel engine exhaust line. The particulate matter detection filter is disposed in the exhaust gas collecting line. The differential pressure detecting unit is configured to detect a differential pressure between an inlet and an outlet of the particulate matter detection filter and disposed apart from a downstream end of the particulate matter detection filter in a direction of a flow of the exhaust gas. | 09-30-2010 |
| 20100242457 | PARTICULATE MATTER CONCENTRATION MEASURING APPARATUS - A particulate matter concentration measuring apparatus is configured to measure a concentration of particulate matter in exhaust gas flowing through an exhaust line of a diesel engine. The apparatus includes an exhaust gas extraction line diverging from the exhaust line and having a flow passage cross-sectional area smaller than a flow passage cross-sectional area of the exhaust line. A particulate matter detection filter has a cell wall and is provided in the exhaust gas extraction line. A flow velocity of the exhaust gas passing through the cell wall is more than or equal to approximately 0.02 m/s and less than or equal to approximately 2.0 m/s. A differential pressure sensing part is configured to sense a differential pressure generated between an inlet and an outlet of the particulate matter detection filter. | 09-30-2010 |
| 20100242456 | PARTICULATE MATTER CONCENTRATION MEASURING APPARATUS - A particulate matter concentration measuring apparatus configured to measure concentration of particulate matter in exhaust gas passing through an exhaust line includes an exhaust gas collecting line branched from the exhaust line, a particulate matter detection filter provided in the exhaust gas collecting line, a differential pressure sensor configured to sense differential pressure between an inlet and an outlet of the particulate matter detection filter, a passage wall disposed so that the exhaust gas flows to a downstream side of the particulate matter detection filter, an inlet side passage through which the exhaust gas flows into the particulate matter detection filter in the passage wall, and an outlet side passage through which the exhaust gas flows out from the particulate matter detection filter. The outlet side passage has an outlet side cross-sectional area approximately 1.0 times or more larger than an inlet side cross-sectional area of the inlet side passage. | 09-30-2010 |
| 20100242455 | PARTICULATE MATTER CONCENTRATION MEASURING APPARATUS - A particulate matter concentration measuring apparatus configured to measure a particulate matter concentration in exhaust gas includes an exhaust gas extraction line that is branched from an exhaust line and has a flow passage cross-sectional area smaller than that of the exhaust line, a particulate matter detection filter provided in the exhaust gas extraction line and configured to catch particulate matter, a heating unit configured to heat the caught particulate matter, and a differential pressure detection unit configured to detect a differential pressure generated between an inlet and an outlet of the particulate matter detection filter. The heating unit is configured to apply about 50% or more of a calorific value for heating the particulate matter to an area making up about 30% of the particulate matter detection filter on an upstream side of an exhaust gas flow. | 09-30-2010 |
| 20100239468 | EXHAUST GAS PURIFYING APPARATUS AND METHOD FOR MANUFACTURING EXHAUST GAS PURIFYING APPARATUS - An exhaust gas purifying apparatus includes an exhaust gas treating body, a metal casing, and a holding sealing material. The exhaust gas treating body has a longitudinal direction and includes cell walls extending along the longitudinal direction to define cells between the cells. The metal casing has an inner surface and houses the exhaust gas treating body to face the inner surface. The holding sealing material is provided between the exhaust gas treating body and the inner surface of the metal casing to hold the exhaust gas treating body in the metal casing. The holding sealing material includes an inorganic fiber aggregated body. The metal casing has a corrosion area at least on a part of the inner surface. The corrosion area includes a corroded base material of the metal casing. | 09-23-2010 |
| 20100236822 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board is formed with a substrate, conductive patterns laminated in the thickness direction of the substrate, multiple pads having a predetermined pitch and formed on the same layer as the conductive patterns, a conductive bonding layer arranged on each of the multiple pads, and an electronic component having electrodes. Here, the electronic component is arranged inside the substrate. The electrodes of the electronic component and the multiple pads are electrically connected to each other by means of bonding layers. Also, the height of each of the multiple pads is greater than the height of the conductive pattern adjacent to each pad. Moreover, a protective material related to the bonding layers is not formed at least on the layer where the pads and the first conductive patterns are formed. | 09-23-2010 |
| 20100236697 | METHOD OF WINDING HOLDING SEALING MATERIAL AND METHOD OF MANUFACTURING EXHAUST GAS PURIFYING APPARATUS - A method of winding a holding sealing material includes providing a mat-shaped holding sealing material including inorganic fibers. An exhaust gas treating body is provided having cell walls extending along a longitudinal direction of the exhaust gas treating body to define cells. The mat-shaped holding sealing material is wound around an outer peripheral portion of the exhaust gas treating body to form multiple layers including a first layer and a second layer wound around the first layer. Each of the multiple layers is shifted along the longitudinal direction in a winding order such that the first layer is placed closer to one end face of the exhaust gas treating body than the second layer. A shift between the first layer and the second layer is from about 0.15% to about 15% of a length in a width direction of the holding sealing material. | 09-23-2010 |
| 20100232744 | SUBSTRATE FOR MOUNTING IC CHIP, MANUFACTURING METHOD OF SUBSTRATE FOR MOUNTING IC CHIP, DEVICE FOR OPTICAL COMMUNICATION, AND MANUFACTURING METHOD OF DEVICE FOR OPTICAL COMMUNICATION - A device for optical communication including a substrate for mounting an IC chip, and a multilayered printed circuit board. An optical path for transmitting optical signal which penetrates the substrate for mounting an IC chip is formed in the substrate for mounting an IC chip. | 09-16-2010 |
| 20100230148 | SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFACTURING SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT - To provide a substrate for mounting a semiconductor element, in which fine-pitch wiring layers are formed to allow a semiconductor element to be mounted, while heat generated in the semiconductor element will not result in a decrease in reliability. Semiconductor-element mounting substrate sandwiches low-thermal-expansion substrate with upper interlayer resin layer and lower interlayer resin layer, and conductive circuit of organic substrate and first conductive circuit of low-thermal-expansion substrate are connected by via conductor formed in interlayer resin layer. Therefore, low-thermal-expansion substrate for mounting semiconductor element may be connected to organic substrate that is connected to outside substrates, without arranging an organic substrate and resin layers on the lower surface of low-thermal-expansion substrate, where impact from the thermal history of semiconductor element is notable. | 09-16-2010 |
| 20100226108 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - A printed circuit board including a core substrate including a first resin substrate, a second resin substrate having an opening and a third resin substrate in a multilayer manner while interposing bonding plates, insulating layers and conductive circuit layers alternately laminated on the core substrate, solder bumps formed on an outer surface of the printed circuit board, a first capacitor formed in the opening of the second resin substrate, a conductive pad formed on the first resin substrate and connected to an electrode of the first capacitor, a via hole formed in the first resin substrate and directly connected to the conductive pad and a conductive circuit on the core substrate, and a second capacitor mounted on a surface of the printed circuit board. | 09-09-2010 |
| 20100224397 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board has a substrate with an opening section, an electronic component having an electrode and arranged in the opening section, insulative material filled in the gaps between the substrate and the electronic component in the opening section, and a first conductive layer formed on the insulative material and including a first conductive pattern. A via hole is formed in the insulative material. The electrode of the electronic component and the first conductive pattern are connected by means of the via hole. The height of the via hole is set in the range of 5-15 μm and the aspect ratio of the via hole is set in the range of 0.07-0.33. | 09-09-2010 |
| 20100222213 | HONEYCOMB STRUCTURE - A honeycomb structure includes aluminum titanate, cell walls, and pore portions. The cell walls extend along a longitudinal direction of the honeycomb structure to define cells between the cell walls. The pore portions have an average pore diameter of about 10 μm to about 20 μm. A length of a longest pore portion among the pore portions in a binary image including substrate portions and the pore portions is about 8 times or less of the average pore diameter. The binary image is converted from a microscopic image of a cross section of the cell walls in parallel with the longitudinal direction. The length is measured along a line drawn in a direction perpendicular to a thickness direction of the cell walls. | 09-02-2010 |
| 20100221414 | METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A method for manufacturing a printed wiring board includes preparing insulative board having first and second surfaces, forming metal film on the first surface, plating resist on the metal film and plated-metal film on the metal film exposed by the plating resist, covering portion of the plated-metal film with etching resist, etching to reduce thickness of the plated-metal film exposed by the etching resist, removing the etching and plating resists, by removing the metal film exposed after removing the plating resist, forming wiring comprising pad for electronic component having gold bump and conductive circuit which is thinner than the pad, forming solder-resist layer on the first surface and the wiring, and forming opening in the solder-resist layer to expose the pad and portion of the conductive circuit contiguous to the pad and metal coating on the pad and portion of the conductive circuit, which are exposed through the opening. | 09-02-2010 |
| 20100218986 | METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD - A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal film with an etching resist, etching to reduce thickness of the plated-metal film exposed from the etching resist, removing the resists, and forming a wiring having a pad and a conductive circuit thinner than the pad by removing the metal film exposed through the removing of the plating resist, a solder-resist layer on the surface of the board and wiring, in the layer an opening exposing the pad and a portion of the circuit contiguous to the pad, a solder film on the pad and portion of the circuit exposed through the opening, and a solder bump on the pad by solder reflow. | 09-02-2010 |
| 20100218983 | METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD - A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal film with an etching resist, etching to reduce thickness of the plated-metal film exposed from the etching resist, removing the etching and plating resists, and forming a wiring having a pad for wire-bonding an electrode of an electronic component and a conductive circuit thinner than the pad by removing the metal film exposed after the plating resist is removed, a solder-resist layer on the surface of the board and wiring, an opening in the layer exposing the pad and a portion of the circuit contiguous to the pad, and a metal coating on the pad and portion of the circuit exposed through the opening. | 09-02-2010 |
| 20100218980 | PRINTED WIRING BOARD - A printed wiring board has an insulative board having a first surface and a second surface on the opposite side of the first surface, a wiring formed on the first surface of the insulative board and having a pad and a conductive circuit contiguous to the pad, and a metal film formed on the pad. The pad is provided to mount an electronic component having a gold bump. The pad has a thickness which is greater than a thickness of the conductive circuit. | 09-02-2010 |
