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HYBRICON CORPORATION
| HYBRICON CORPORATION Patent applications | ||
| Patent application number | Title | Published |
|---|---|---|
| 20110058335 | DEVICES HAVING A THERMAL INTERFACE AND METHODS OF FORMING THE SAME - A conduction-cooled enclosure comprises a card guide having a card guide channel, at least one controlled-volume cavity in the card guide channel, and a thermal interface material (TIM) in the at least one controlled-volume cavity. | 03-10-2011 |