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HTC BETEILIGUNGS GmbH
| HTC BETEILIGUNGS GmbH Patent applications | ||
| Patent application number | Title | Published |
|---|---|---|
| 20110001232 | Flip-Chip Module and Method for the Production Thereof - The invention relates to a flip-chip module with a semiconductor chip with contact posts, wherein the contact posts are connected electrically and mechanically to a substrate. Provided between the substrate and the semiconductor chip is a spacer, which is coupled mechanically to the substrate and/or the semiconductor chip. By this means, thermal stresses in the flip-chip module are absorbed by the spacer and kept away from the semiconductor chip. | 01-06-2011 |
| 20090085203 | Method for Exchanging Semiconductor Chip of Flip-Chip Module and Flip-Chip Module Suitable Therefor - A process for replacing a semiconductor chip of such a flip-chip module and a suitable flip-chip module and an apparatus for implementing the method are disclosed. The flip-chip module comprises at least one semiconductor chip and a substrate. The semiconductor chip comprises contact posts on a surface that are disposed at right angles to the surface. With these contact posts it is connected with contact points of the substrate via a soldered connection. The contact posts completely cover the contact points with their end faces. Due to this it is possible to completely press the solder between the contact posts and contact points out of the intermediate area between the contact points and the contact posts after a renewed heating. This permits a renewed attachment of a further semiconductor chip. | 04-02-2009 |