| Hong Kong Applied Science and Technology Research Institute Company Limited (ASTRI) Patent applications |
| Patent application number | Title | Published |
|---|
| 20090293604 | MULTI-CHIP PACKAGE - Subject matter disclosed herein may relate to packaging for multi-chip semiconductor devices as may be used, for example, in tire pressure monitoring systems. | 12-03-2009 |
| 20090211353 | PIEZOELECTRIC MODULE FOR ENERGY HARVESTING, SUCH AS IN A TIRE PRESSURE MONITORING SYSTEM - Subject matter disclosed herein may relate to energy harvesting piezoelectric modules as may be used, for example, in power supplies for tire pressure monitoring systems. | 08-27-2009 |
